Patents by Inventor Roy Senn

Roy Senn has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Temperature sensor and thermal flow-measuring device
    Patent number: 9182262
    Abstract: A temperature sensor and a flow measuring device. The temperature sensor comprising: a housing which comprises a housing body from which at least a first shell and a second shell protrude, each of which shells comprises a first end section, a second end section and a longitudinal axis. A temperature sensor element is arranged, which has especially a thin-film resistance thermometer, wherein one of the temperature sensor elements is heatable, and which shells have outsides, which interface the housing with the environment. From each temperature sensor element at least one connection wire leads away, which is connected with a circuit board. The housing body has a housing chamber, which is connected with inner hollow spaces of the shells, wherein the circuit board is arranged in the housing chamber, and wherein the circuit board is positioned in the housing chamber by a snap-in connection.
    Type: Grant
    Filed: October 16, 2013
    Date of Patent: November 10, 2015
    Assignee: Endress + Hauser Flowtec AG
    Inventors: Achim Wiest, Heinerich Hagenmeyer, Roy Senn, Tobias Baur
  • TEMPERATURE SENSOR AND THERMAL FLOW-MEASURING DEVICE
    Publication number: 20140109664
    Abstract: A temperature sensor and a flow measuring device. The temperature sensor comprising: a housing which comprises a housing body from which at least a first shell and a second shell protrude, each of which shells comprises a first end section, a second end section and a longitudinal axis. A temperature sensor element is arranged, which has especially a thin-film resistance thermometer, wherein one of the temperature sensor elements is heatable, and which shells have outsides, which interface the housing with the environment. From each temperature sensor element at least one connection wire leads away, which is connected with a circuit board. The housing body has a housing chamber, which is connected with inner hollow spaces of the shells, wherein the circuit board is arranged in the housing chamber, and wherein the circuit board is positioned in the housing chamber by a snap-in connection.
    Type: Application
    Filed: October 16, 2013
    Publication date: April 24, 2014
    Applicant: Endress + Hauser Flowtec AG
    Inventors: Achim Wiest, Heinerich Hagenmeyer, Roy Senn, Tobias Bauer