Abstract: This invention relates to compositions which are dispersions of certain proportions of gold and inorganic binder in an inert liquid vehicle, useful in the electronics art for producing conductor patterns adherent to substrates. Even small amounts of the binder are effective in obtaining excellent adhesion to ceramic substrates. The binder comprises, by weight, (a) 4-23% CuO, (b) 13-36% of CdO or mixtures thereof with CaO, there being at least 13% CdO in the binder, (c) 30-60% B.sub.2 O.sub.3, SiO.sub.2, P.sub.2 O.sub.5, V.sub.2 O.sub.5, Al.sub.2 O.sub.3, and/or GeO.sub.2, provided that at least 5% B.sub.2 O.sub.3, SiO.sub.2, P.sub.2 O.sub.5, and/or V.sub.2 O.sub.5 is present in the binder, and (d) 0-20% PbO, and/or Bi.sub.2 O.sub.3. The amount of binder in the compositions is related to the amount of CuO in the binder as set forth herein. Optionally certain amounts of crystalline fluxes (PbF.sub.2 and/or LiF) may be present.