Patents by Inventor Roy V. Buck, Jr.

Roy V. Buck, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Microelectronic-device assemblies and methods that exclude extraneous elements from sensitive areas
    Patent number: 6476471
    Abstract: Microelectronic-device assemblies and methods are provided that enhance operation of microelectronic devices because they exclude extraneous elements from sensitive device areas. They are especially suited for devices that carry a plurality of bonding pads on a circuit face that has a sensitive area. A lead frame defines a paddle that has an area less than that of the device face. The paddle is spaced from the face and positioned to cover the sensitive area and expose the pads. A plastic ring is arranged to surround the sensitive area and abut the face and the paddle. Encapsulation in an overmold thus forms a void within the ring and between the device face and the paddle and extraneous elements are excluded from this void.
    Type: Grant
    Filed: March 14, 2000
    Date of Patent: November 5, 2002
    Assignee: Analog Devices, Inc.
    Inventor: Roy V. Buck, Jr.