Patents by Inventor Roy Vahan Semerdjian

Roy Vahan Semerdjian has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Bonding procedure for silica assemblies
    Patent number: 5653777
    Abstract: A method for bonding silica containing materials uses a mixture of ultrasonically treated silica powder and a suspension liquid to provide a bonding material. Once applied to the bonding surfaces of silica containing components the mixture is dried and then heated. Upon cooling the mixture provides a solid bonding between the components. The bonding procedure minimizes the mount of localized heating required to bond the material and thereby prevents distortion of silica components as they are bonded.
    Type: Grant
    Filed: October 19, 1995
    Date of Patent: August 5, 1997
    Assignee: UOP
    Inventor: Roy Vahan Semerdjian