Patents by Inventor Roy Werkman
Roy Werkman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240036479Abstract: A method of optimizing a target layout for a patterning device and a sampling scheme for measuring the targets of the target layout exposed on a substrate, the method including co-optimizing the target layout and the sampling scheme to obtain an optimized target layout for the patterning device and an optimized sampling scheme for measuring the targets of the optimized target layout exposed on a substrate.Type: ApplicationFiled: March 8, 2022Publication date: February 1, 2024Applicant: ASML NETHERLANDS B.V.Inventors: Roy WERKMAN, Jochem Sebastiaan WILDENBERG, Manouk RIJPSTRA
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Publication number: 20230400778Abstract: A method to infer a current sampling scheme for one or more current substrates is provided, the method including: obtaining a first model trained to infer an optimal sampling scheme based on inputting context and/or pre-exposure data associated with one or more previous substrates, wherein the first model is trained in dependency of an outcome of a second model configured to discriminate between the inferred optimal sampling scheme and a pre-determined optimal sampling scheme; and using the obtained first model to infer the current sampling scheme based on inputting context and/or pre-exposure data associated with the one or more current substrate.Type: ApplicationFiled: October 26, 2021Publication date: December 14, 2023Applicant: ASML NETHERLANDS B.V.Inventors: Roy WERKMAN, Jochem Sebastiaan WILDENBERG, Reza SAHRAEIAN
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Publication number: 20230333485Abstract: A substrate including a target structure formed in at least two layers. The target structure includes a first region having periodically repeating features in each of the layers measureable using optical metrology; and a second region having repetitions of one or more product features in each of the layers, the repetitions being sufficient for stochastic analysis to determine at least one local variation metric. The method also includes determining a correction for control of a lithographic process based on measurement of such a target structure.Type: ApplicationFiled: September 27, 2021Publication date: October 19, 2023Applicant: ASML NETHERLANDS B.V.Inventors: Wim Tjibbo TEL, Hermanus Adrianus DILLEN, Roy WERKMAN, David Frans Simon DECKERS
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Patent number: 11754931Abstract: A method for determining a correction for an apparatus used in a process of patterning substrates, the method including: obtaining a group structure associated with a processing history and/or similarity in fingerprint of to be processed substrates; obtaining metrology data associated with a plurality of groups within the group structure, wherein the metrology data is correlated between the groups; and determining the correction for a group out of the plurality of groups by applying a model to the metrology data, the model including at least a group-specific correction component and a common correction component.Type: GrantFiled: March 18, 2020Date of Patent: September 12, 2023Assignee: ASML NETHERLANDS B.V.Inventors: Roy Werkman, David Frans Simon Deckers, Simon Philip Spencer Hastings, Jeffrey Thomas Ziebarth, Samee Ur Rehman, Davit Harutyunyan, Chenxi Lin, Yana Cheng
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Patent number: 11669017Abstract: A method for determining a plurality of corrections for control of at least one manufacturing apparatus used in a manufacturing process for providing product structures to a substrate in a plurality of layers, the method including: determining the plurality of corrections including a correction for each layer, based on an actuation potential of the applicable manufacturing apparatus used in the formation of each layer, wherein the determining includes determining corrections for each layer simultaneously in terms of a matching parameter.Type: GrantFiled: November 9, 2018Date of Patent: June 6, 2023Assignee: ASML NETHERLANDS B.V.Inventors: Roy Werkman, Bijoy Rajasekharan, Lydia Marianna Vergaij-Huizer, Jochem Sebastiaan Wildenberg, Ronald Van Ittersum, Pieter Gerardus Jacobus Smorenberg, Robertus Wilhelmus Van Der Heijden, Xiuhong Wei, Hadi Yagubizade
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Publication number: 20230168594Abstract: A method of determining a position of a product feature on a substrate, the method includes: obtaining a plurality of position measurements of one or more product features on a substrate, wherein the measurements are referenced to either a positioning system used in displacing the substrate in between measurements or a plane parallel to the surface of the substrate; and determining a distortion component of the substrate based on the position measurements.Type: ApplicationFiled: May 11, 2021Publication date: June 1, 2023Applicant: ASML NETHERLANDS B.V.Inventors: Wim Tjibbo TEL, Hermanus Adrianus DILLEN, Marc Jurian KEA, Roy WERKMAN, Weitian KOU
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Publication number: 20220413391Abstract: A method for determining an input to a lens model to determine a setpoint for manipulation of a lens of a lithographic apparatus when addressing at least one of a plurality of fields of a substrate, the method including: receiving parameter data for the at least one field, the parameter data relating to one or more parameters of the substrate within the at least one field, the one or more parameters being at least partially sensitive to manipulation of the lens as part of an exposure performed by the lithographic apparatus; receiving lens model data relating to the lens; and determining the input based on the parameter data and on the lens model data.Type: ApplicationFiled: October 15, 2020Publication date: December 29, 2022Applicant: ASML NETHERLANDS B.V.Inventors: Michel Alphons Theodorus VAN HINSBERG, James Robert DOWNES, Erwin Josef Maria VERDURMEN, Jacob Fredrik Friso KLINKHAMER, Roy WERKMAN, Jochem Sebastiaan WILDENBERG, Adam Jan URBANCZYK, Lucas Jan Joppe VISSER
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Publication number: 20220342319Abstract: A method, system and program for determining a fingerprint of a parameter. The method includes determining a contribution from a device out of a plurality of devices to a fingerprint of a parameter. The method includes obtaining parameter data and usage data, wherein the parameter data is based on measurements for multiple substrates having been processed by the plurality of devices, and the usage data indicates which of the devices out of the plurality of the devices were used in the processing of each substrate; and determining the contribution using the usage data and parameter data.Type: ApplicationFiled: July 1, 2022Publication date: October 27, 2022Applicant: ASML NETHERLANDS B.V.Inventors: Davit Harutyunyan, Fei Jia, Frank Staals, Fuming Wang, Hugo Thomas Looijestijn, Cornelis Johannes Rijnierse, Maxim Pisarenco, Roy Werkman, Thomas Theeuwes, Tom Van Hemert, Vahid Bastani, Jochem Wildenberg, Everhardus Cornelis Mos, Erik Johannes Maria Wallerbos
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Publication number: 20220291593Abstract: A method for characterizing a patterning process, the method including obtaining a plurality of values of stitching errors made along one or more boundaries between at least two patterned adjacent fields or sub-fields on a substrate; and fitting, using a hardware computer system, a distortion model to the plurality of values to obtain a fingerprint representing deformation of a field or sub-field out of the at least two patterned adjacent fields or sub-fields.Type: ApplicationFiled: August 5, 2020Publication date: September 15, 2022Inventors: Roy WERKMAN, Pui Leng LAM, Blandine Marie Andree Richit MINGHETTI, Vahid BASTANI, Mohamadrezh HAJIAHMADI, Lydia Marianna VERGAIJ-HUIZER, Frans Reinier SPIERING
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Patent number: 11442367Abstract: A method for optimizing a sequence of processes for manufacturing of product units, includes: associating measurement results of performance parameters (e.g., fingerprints) with the recorded process characteristics (e.g., context); obtaining a characteristic (e.g., context) of a previous process (e.g. deposition) in the sequence already performed on a product unit; obtaining a characteristic (e.g., context) of a subsequent process (e.g., exposure) in the sequence to be performed on the product unit; determining a predicted performance parameter (e.g., fingerprint) of the product unit associated with the sequence of previous and subsequent processes by using the obtained characteristics to retrieve measurement results of the performance parameters (e.g., fingerprints) corresponding to the recorded characteristics; and determining corrections to be applied to future processes (e.g. exposure, etch) in the sequence to be performed on the product unit, based on the determined predicted performance parameter.Type: GrantFiled: August 25, 2021Date of Patent: September 13, 2022Assignee: ASML Netherlands B.V.Inventors: Jochem Sebastiaan Wildenberg, Marinus Jochemsen, Erik Jensen, Erik Johannes Maria Wallerbos, Cornelis Johannes Rijnierse, Bijoy Rajasekharan, Roy Werkman, Jurgen Johannes Henderikus Maria Schoonus
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Patent number: 11435673Abstract: A method of determining a set of metrology point locations, the set including a subset of potential metrology point locations on a substrate, the method including: determining a relation between noise distributions associated with a plurality of the potential metrology point locations using existing knowledge; and using the determined relation and a model associated with the substrate to determine the set.Type: GrantFiled: March 19, 2020Date of Patent: September 6, 2022Assignee: ASML Netherlands B.V.Inventors: Kevin Van De Ruit, Roy Werkman, Jochem Sebastiaan Wildenberg
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Publication number: 20220260920Abstract: A method for determining a sampling scheme, the method including: obtaining a first fingerprint model relating to a first spatial distribution of a performance parameter over a first portion of a semiconductor substrate and a second fingerprint model relating to a second spatial distribution of the performance parameter over a second portion of the semiconductor substrate; and determining a sampling point corresponding to a measuring location on the semiconductor substrate for generating measurement data based on an expected reduction of a first uncertainty metric associated with evaluation of the first fingerprint model over the first portion and an expected reduction of a second uncertainty metric associated with evaluation of the second fingerprint model over the second portion.Type: ApplicationFiled: May 11, 2020Publication date: August 18, 2022Applicant: ASML NETHERLANDS B.V.Inventors: Pieter Gerardus Jacobus SMORENBERG, Putra SAPUTRA, Khalid ELBATTAY, Paul DERWIN, Roy WERKMAN, Erik JENSEN, Hyunwoo YU, Gautam SARMA
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Publication number: 20220252988Abstract: A method for determining a correction for an apparatus used in a process of patterning substrates, the method including: obtaining a group structure associated with a processing history and/or similarity in fingerprint of to be processed substrates; obtaining metrology data associated with a plurality of groups within the group structure, wherein the metrology data is correlated between the groups; and determining the correction for a group out of the plurality of groups by applying a model to the metrology data, the model including at least a group-specific correction component and a common correction component.Type: ApplicationFiled: March 18, 2020Publication date: August 11, 2022Applicant: ASML NETHERLANDS B.V.Inventors: Roy WERKMAN, David Frans Simon DECKERS, Simon Philip Spencer HASTINGS, Jeffrey Thomas ZIEBARTH, Samee Ur REHMAN, Davit HARUTYUNYAN, Chenxi LIN, Yana CHENG
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Publication number: 20220236647Abstract: A method of controlling a semiconductor manufacturing process, the method including: obtaining first metrology data based on measurements performed after a first process step; obtaining second metrology data based on measurements performed after the first process step and at least one additional process step; estimating a contribution to the process of: a) a control action which is at least partially based on the second metrology data and/or b) the at least one additional process step by using at least partially the second metrology data; and determining a Key Performance Indicator (KPI) or a correction for the first process step using the first metrology data and the estimated contribution.Type: ApplicationFiled: July 16, 2020Publication date: July 28, 2022Applicant: ASML NETHERLANDS B.V.Inventors: Marc HAUPTMANN, Cornelis Johannes Henricus LAMBREGTS, Amir Bin ISMAIL, Rizvi RAHMAN, Allwyn BOUSTHEEN, Raheleh PISHKARI, Everhardus Cornelis MOS, Ekaterina Mikhailovna VIATKINA, Roy WERKMAN, Ralph BRINKHOF
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Patent number: 11378891Abstract: A method, system and program for determining a fingerprint of a parameter. The method includes determining a contribution from a device out of a plurality of devices to a fingerprint of a parameter. The method includes obtaining parameter data and usage data, wherein the parameter data is based on measurements for multiple substrates having been processed by the plurality of devices, and the usage data indicates which of the devices out of the plurality of the devices were used in the processing of each substrate; and determining the contribution using the usage data and parameter data.Type: GrantFiled: September 17, 2020Date of Patent: July 5, 2022Assignee: ASML Netherlands B.V.Inventors: Davit Harutyunyan, Fei Jia, Frank Staals, Fuming Wang, Hugo Thomas Looijestijn, Cornelis Johannes Rijnierse, Maxim Pisarenco, Roy Werkman, Thomas Theeuwes, Tom Van Hemert, Vahid Bastani, Jochem Sebastiaan Wildenberg, Everhardus Cornelis Mos, Erik Johannes Maria Wallerbos
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Patent number: 11372338Abstract: A method for determining a preferred control strategy relating to control of a manufacturing process for manufacturing an integrated circuit. The method includes: obtaining process data associated with a design of said integrated circuit; and obtaining a plurality of candidate control strategies configured to control the manufacturing process based on the process data, each candidate control strategy including an associated cost metric based on an associated requirement to implement the candidate control strategy. A quality metric related to an expected performance of the manufacturing process is determined for each candidate control strategies, and a preferred control strategy is selected based on the determined quality metrics and associated cost metrics for each candidate control strategy.Type: GrantFiled: February 13, 2019Date of Patent: June 28, 2022Assignee: ASML Netherlands B.V.Inventors: Ivo Matteo Leonardus Weijden, Jeroen Van Dongen, Cornelis Johannes Henricus Lambregts, Theo Wilhelmus Maria Thijssen, Ruud Rudolphus Johannes Catharinus De Wit, Hans Marinus Struijs, Erik Mathijs Maria Crombag, Roy Werkman, Maria Helena Schut, Erwin Riemens, Menno Meeldijk
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Publication number: 20220155698Abstract: A method of determining a set of metrology point locations, the set including a subset of potential metrology point locations on a substrate, the method including: determining a relation between noise distributions associated with a plurality of the potential metrology point locations using existing knowledge; and using the determined relation and a model associated with the substrate to determine the set.Type: ApplicationFiled: March 19, 2020Publication date: May 19, 2022Applicant: ASML NETHERLANDS B.V.Inventors: Kevin VAN DE RUIT, Roy WERKMAN, Jochem Sebastiaan WILDENBERG
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Patent number: 11327406Abstract: A method for estimating a parameter across a region on a substrate, the region being divided into a plurality of sub-regions, the method including: obtaining values of the parameter for at least two sub-regions out of the plurality of sub-regions; and estimating the parameter for a position on the region by evaluation of a function having said values of the parameter as input values, wherein the function: a) has piecewise defined base functions, wherein a single base function is defined across a sub-region; and b) is continuous between one or more adjacent sub-regions of the at least two sub-regions within the region.Type: GrantFiled: April 2, 2019Date of Patent: May 10, 2022Assignee: ASML Netherlands B.V.Inventors: Svetla Petrova Matova, Jochem Sebastiaan Wildenberg, Roy Werkman, Luc Roumen
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Patent number: 11300887Abstract: A method to change an etch parameter of a substrate etching process, the method including: making a first measurement of a first metric associated with a structure on a substrate before being etched; making a second measurement of a second metric associated with a structure on a substrate after being etched; and changing the etch parameter based on a difference between the first measurement and the second measurement.Type: GrantFiled: November 6, 2017Date of Patent: April 12, 2022Assignee: ASML Netherlands B.V.Inventors: Richard Johannes Franciscus Van Haren, Victor Emanuel Calado, Leon Paul Van Dijk, Roy Werkman, Everhardus Cornelis Mos, Jochem Sebastiaan Wildenberg, Marinus Jochemsen, Bijoy Rajasekharan, Erik Jensen, Adam Jan Urbanczyk
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Publication number: 20220091514Abstract: A method of determining a control parameter for a lithographic process is disclosed, the method includes: defining a substrate model for representing a process parameter fingerprint across a substrate, the substrate model being defined as a combination of basis functions including at least one basis function suitable for representing variation of the process parameter fingerprint between substrates and/or batches of substrates; receiving measurements of the process parameter across at least one substrate; calculating substrate model parameters using the measurements and the basis functions; and determining the control parameter based on the substrate model parameters and the similarity of the at least one basis function to a process parameter fingerprint variation between substrates and/or batches of substrates.Type: ApplicationFiled: December 18, 2019Publication date: March 24, 2022Applicant: ASML NETHERLANDS B.V.Inventors: Roy WERKMAN, David Frans Simon DECKERS, Bijoy RAJASEKHARAN, Ignacio Salvador VAZQUEZ RODARTE, Sarathi ROY