Patents by Inventor Roy Werkman

Roy Werkman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210003927
    Abstract: A method, system and program for determining a fingerprint of a parameter. The method includes determining a contribution from a device out of a plurality of devices to a fingerprint of a parameter. The method includes obtaining parameter data and usage data, wherein the parameter data is based on measurements for multiple substrates having been processed by the plurality of devices, and the usage data indicates which of the devices out of the plurality of the devices were used in the processing of each substrate; and determining the contribution using the usage data and parameter data.
    Type: Application
    Filed: September 17, 2020
    Publication date: January 7, 2021
    Applicant: ASML NETHERLANDS B.V.
    Inventors: Davit Harutyunyan, Fei Jia, Frank Staals, Fuming Wang, Hugo Thomas Looijestijn, Cornelis Johannes Rijnierse, Maxim Pisarenco, Roy Werkman, Thomas Theeuwes, Tom Van Hemert, Vahid Bastani, Jochem Sebastiaan Wildenberg, Everhardus Cornelis Mos, Erik Johannes Maria Wallerbos
  • Patent number: 10884345
    Abstract: A first substrate 2002 has a calibration pattern applied to a first plurality of fields 2004 by a lithographic apparatus. Further substrates 2006, 2010 have calibration patterns applied to further pluralities of fields 2008, 2012. The different pluralities of fields have different sizes and/or shapes and/or positions. Calibration measurements are performed on the patterned substrates 2002, 2006, 2010 and used to obtain corrections for use in controlling the apparatus when applying product patterns to subsequent substrates. Measurement data representing the performance of the apparatus on fields of two or more different dimensions (fields 2004, 2008, 2012 in this example) is gathered together in a database 2013 and used to synthesize the information needed to calibrate the apparatus for a new size. Calibration data is also obtained for different scan and step directions.
    Type: Grant
    Filed: March 18, 2020
    Date of Patent: January 5, 2021
    Assignee: ASML Netherlands B.V.
    Inventors: Emil Peter Schmitt-Weaver, Jens Stäcker, Koenraad Remi André Maria Schreel, Roy Werkman
  • Publication number: 20200401052
    Abstract: A method for determining a preferred control strategy relating to control of a manufacturing process for manufacturing an integrated circuit. The method includes: obtaining process data associated with a design of said integrated circuit; and obtaining a plurality of candidate control strategies configured to control the manufacturing process based on the process data, each candidate control strategy including an associated cost metric based on an associated requirement to implement the candidate control strategy. A quality metric related to an expected performance of the manufacturing process is determined for each candidate control strategies, and a preferred control strategy is selected based on the determined quality metrics and associated cost metrics for each candidate control strategy.
    Type: Application
    Filed: February 13, 2019
    Publication date: December 24, 2020
    Applicant: ASML NETHERLANDS B.V.
    Inventors: Ivo Matteo Leonardus WEIJDEN, Jeroen VAN DONGEN, Cornelis Johannes Henricus LAMBREGTS, Theo Wilhelmus Maria THIJSSEN, Ruud Rudolphus Johannes Catharinus DE WIT, Hans Marinus STRUIJS, Erik Mathijs Maria CROMBAG, Roy WERKMAN, Maria Helena SCHUT, Erwin RIEMENS, Menno MEELDIJK
  • Patent number: 10816904
    Abstract: A method, system and program for determining a fingerprint of a parameter. The method includes determining a contribution from a device out of a plurality of devices to a fingerprint of a parameter. The method including: obtaining parameter data and usage data, wherein the parameter data is based on measurements for multiple substrates having been processed by the plurality of devices, and the usage data indicates which of the devices out of the plurality of the devices were used in the processing of each substrate; and determining the contribution using the usage data and parameter data.
    Type: Grant
    Filed: May 23, 2018
    Date of Patent: October 27, 2020
    Assignee: ASML Netherlands B.V.
    Inventors: Davit Harutyunyan, Fei Jia, Frank Staals, Fuming Wang, Hugo Thomas Looijestijn, Cornelis Johannes Rijnierse, Maxim Pisarenco, Roy Werkman, Thomas Theeuwes, Tom Van Hemert, Vahid Bastani, Jochem Sebastiaan Wildenberg, Everhardus Cornelis Mos, Erik Johannes Maria Wallerbos
  • Publication number: 20200278614
    Abstract: A method for determining a plurality of corrections for control of at least one manufacturing apparatus used in a manufacturing process for providing product structures to a substrate in a plurality of layers, the method including: determining the plurality of corrections including a correction for each layer, based on an actuation potential of the applicable manufacturing apparatus used in the formation of each layer, wherein the determining includes determining corrections for each layer simultaneously in terms of a matching parameter.
    Type: Application
    Filed: November 9, 2018
    Publication date: September 3, 2020
    Applicant: ASML NETHERLANDS B.V.
    Inventors: Roy WERKMAN, Bijoy RAJASEKHARAN, Lydia Marianna VERGAIJ-HUIZER, Jochem Sebastiaan WILDENBERG, Ronald VAN ITTERSUM, Pieter Gerardus Jacobus SMORENBERG, Robertus Wilhelmus VAN DER HEIJDEN, Xiuhong WEI, Hadi YAGUBIZADE
  • Patent number: 10725372
    Abstract: A method includes determining topographic information of a substrate for use in a lithographic imaging system, determining or estimating, based on the topographic information, imaging error information for a plurality of points in an image field of the lithographic imaging system, adapting a design for a patterning device based on the imaging error information. In an embodiment, a plurality of locations for metrology targets is optimized based on imaging error information for a plurality of points in an image field of a lithographic imaging system, wherein the optimizing involves minimizing a cost function that describes the imaging error information. In an embodiment, locations are weighted based on differences in imaging requirements across the image field.
    Type: Grant
    Filed: January 20, 2016
    Date of Patent: July 28, 2020
    Assignee: ASML Netherlands B.V.
    Inventors: Wim Tjibbo Tel, Marinus Jochemsen, Frank Staals, Christopher Prentice, Laurent Michel Marcel Depre, Johannes Marcus Maria Beltman, Roy Werkman, Jochem Sebastiaan Wildenberg, Everhardus Cornelis Mos
  • Publication number: 20200218170
    Abstract: A first substrate 2002 has a calibration pattern applied to a first plurality of fields 2004 by a lithographic apparatus. Further substrates 2006, 2010 have calibration patterns applied to further pluralities of fields 2008, 2012. The different pluralities of fields have different sizes and/or shapes and/or positions. Calibration measurements are performed on the patterned substrates 2002, 2006, 2010 and used to obtain corrections for use in controlling the apparatus when applying product patterns to subsequent substrates. Measurement data representing the performance of the apparatus on fields of two or more different dimensions (fields 2004, 2008, 2012 in this example) is gathered together in a database 2013 and used to synthesize the information needed to calibrate the apparatus for a new size. Calibration data is also obtained for different scan and step directions.
    Type: Application
    Filed: March 18, 2020
    Publication date: July 9, 2020
    Applicant: ASML Netherlands B.V.
    Inventors: Emil Peter SCHMITT-WEAVER, Jens STÄCKER, Koenraad Remi André Maria SCHREEL, Roy WERKMAN
  • Patent number: 10627729
    Abstract: A first substrate (2002) has a calibration pattern applied to a first plurality of fields (2004) by a lithographic apparatus. Further substrates (2006, 2010) have calibration patterns applied to further pluralities of fields (2008, 2012). The different pluralities of fields have different sizes and/or shapes and/or positions. Calibration measurements are performed on the patterned substrates (2002, 2006, 2010) and used to obtain corrections for use in controlling the apparatus when applying product patterns to subsequent substrates. Measurement data representing the performance of the apparatus on fields of two or more different dimensions (2004, 2008, 2012) is gathered together in a database (2013) and used to synthesize the information needed to calibrate the apparatus for a new size. Calibration data is also obtained for different scan and step directions.
    Type: Grant
    Filed: May 27, 2016
    Date of Patent: April 21, 2020
    Assignee: ASML Netherlands B.V.
    Inventors: Emil Peter Schmitt-Weaver, Jens Stäcker, Koenraad Remi André Maria Schreel, Roy Werkman
  • Publication number: 20200026200
    Abstract: A method for optimizing a sequence of processes for manufacturing of product units, includes: associating measurement results of performance parameters (e.g., fingerprints) with the recorded process characteristics (e.g., context); obtaining a characteristic (e.g., context) of a previous process (e.g. deposition) in the sequence already performed on a product unit; obtaining a characteristic (e.g., context) of a subsequent process (e.g., exposure) in the sequence to be performed on the product unit; determining a predicted performance parameter (e.g., fingerprint) of the product unit associated with the sequence of previous and subsequent processes by using the obtained characteristics to retrieve measurement results of the performance parameters (e.g., fingerprints) corresponding to the recorded characteristics; and determining corrections to be applied to future processes (e.g. exposure, etch) in the sequence to be performed on the product unit, based on the determined predicted performance parameter.
    Type: Application
    Filed: March 28, 2018
    Publication date: January 23, 2020
    Applicant: ASML NETHERLANDS B.V.
    Inventors: Jochem Sebastiaan WILDENBERG, Marinus JOCHEMSEN, Erik JENSEN, Erik Johannes Maria WALLERBOS, Cornelis Johannes RIJNIERSE, Bijoy RAJASEKHARAN, Roy WERKMAN, Jurgen Johannes Henerikus Maria SCHOONUS
  • Publication number: 20190285992
    Abstract: A method to change an etch parameter of a substrate etching process, the method including: making a first measurement of a first metric associated with a structure on a substrate before being etched; making a second measurement of a second metric associated with a structure on a substrate after being etched; and changing the etch parameter based on a difference between the first measurement and the second measurement.
    Type: Application
    Filed: November 6, 2017
    Publication date: September 19, 2019
    Applicant: ASML NETHERLANDS B.V.
    Inventors: Richard Johannes Franciscus VAN HAREN, Victor Emanuel CALADO, Leon Paul VAN DIJK, Roy WERKMAN, Everhardus Cornelis MOS, Jochem Sebastiaan WILDENBERG, Marinus JOCHEMSEN, Bijoy RAJASEKHARAN, Erik JENSEN, Adam Jan URBANCZYK
  • Publication number: 20190271919
    Abstract: A method, system and program for determining a fingerprint of a parameter. The method includes determining a contribution from a device out of a plurality of devices to a fingerprint of a parameter. The method including: obtaining parameter data and usage data, wherein the parameter data is based on measurements for multiple substrates having been processed by the plurality of devices, and the usage data indicates which of the devices out of the plurality of the devices were used in the processing of each substrate; and determining the contribution using the usage data and parameter data.
    Type: Application
    Filed: May 23, 2018
    Publication date: September 5, 2019
    Applicant: ASML NETHERLANDS B.V.
    Inventors: Davit HARUTYUNYAN, Fei JIA, Frank STAALS, Fuming WANG, Hugo Thomas LOOIJESTIJN, Cornelis Johannes RIJNIERSE, Maxim PISARENCO, Roy WERKMAN, Thomas THEEUWES, Tom VAN HEMERT, Vahid BASTANI, Jochem Sebastian WILDENBERG, Everhardus Cornelis MOS, Erik Johannes Maria WALLERBOS
  • Publication number: 20190011842
    Abstract: A method of characterizing distortions in a lithographic process, and associated apparatuses. The method includes obtaining measurement data corresponding to a plurality of measurement locations on a substrate, the measurement data comprising measurements performed on a plurality of substrates, and comprising one or more measurements performed on one or more of the substrates for each of the measurement locations. For each of the measurement locations, a first quality value representing a quality metric and a noise value representing a noise metric is determined from the measurements performed at that measurement location. A plurality of distortion parameters is determined, each distortion parameter configured to characterize a systematic distortion in the quality metric and a statistical significance of the distortion parameters from the first quality value and from the noise value is determined. Systematic distortion is parameterized from the distortion parameters determined to be statistically significant.
    Type: Application
    Filed: February 22, 2017
    Publication date: January 10, 2019
    Applicant: ASML NETHERLANDS B.V.
    Inventors: Everhardus Cornelis MOS, Jochem Sebastiaan WILDENBERG, Roy WERKMAN, Erik Johannes Maria WALLERBOS
  • Publication number: 20180173118
    Abstract: A first substrate (2002) has a calibration pattern applied to a first plurality of fields (2004) by a lithographic apparatus. Further substrates (2006, 2010) have calibration patterns applied to further pluralities of fields (2008, 2012). The different pluralities of fields have different sizes and/or shapes and/or positions. Calibration measurements are performed on the patterned substrates (2002, 2006, 2010) and used to obtain corrections for use in controlling the apparatus when applying product patterns to subsequent substrates. Measurement data representing the performance of the apparatus on fields of two or more different dimensions (2004, 2008, 2012) is gathered together in a database (2013) and used to synthesize the information needed to calibrate the apparatus for a new size. Calibration data is also obtained for different scan and step directions.
    Type: Application
    Filed: May 27, 2016
    Publication date: June 21, 2018
    Applicant: ASML Netherlands B.V.
    Inventors: Emil Peter SCHMITT-WEAVER, Jens STÄCKER, Koenraad Remi André Maria SCHREEL, Roy WERKMAN
  • Publication number: 20180011398
    Abstract: A method includes determining topographic information of a substrate for use in a lithographic imaging system, determining or estimating, based on the topographic information, imaging error information for a plurality of points in an image field of the lithographic imaging system, adapting a design for a patterning device based on the imaging error information. In an embodiment, a plurality of locations for metrology targets is optimized based on imaging error information for a plurality of points in an image field of a lithographic imaging system, wherein the optimizing involves minimizing a cost function that describes the imaging error information. In an embodiment, locations are weighted based on differences in imaging requirements across the image field.
    Type: Application
    Filed: January 20, 2016
    Publication date: January 11, 2018
    Applicant: ASML Netherlands B.V.
    Inventors: Wim Tjibbo TEL, Marinus JOCHEMSEN, Frank STAALS, Christopher PRENTICE, Laurent Michel Marcel DEPRE, Johannes Marcus Maria BELTMAN, Roy WERKMAN, Jochem Sebastiaan WILDENBERG, Everhardus Cornelis MOS
  • Patent number: 7969577
    Abstract: When using a scatterometer different portions of a target area may be at different focal depths. When the whole area is measured this results in part of it being out of focus. To compensate for this an array of lenses is placed in the back focal plane of the high numerical aperture lens.
    Type: Grant
    Filed: September 14, 2006
    Date of Patent: June 28, 2011
    Assignee: ASML Netherlands B.V.
    Inventors: Roy Werkman, Everhardus Cornelis Mos, Maurits Van Der Schaar
  • Patent number: 7468795
    Abstract: A method of selecting a grid model for correcting a process recipe for grid deformations in a lithographic apparatus is disclosed. First a set of grid models is provided. Subsequently, alignment data are obtained by performing an alignment measurement on a plurality of alignment marks on a number of substrates. For each grid model it is checked whether the alignment data is suitable to solve the grid model. If so, the grid model is added to a subset of grid models. The grid model with lowest residuals is selected. In addition to alignment data, metrology data may be obtained by performing an overlay measurement on a plurality of overlay marks on the number of substrates. For each grid model of the subset simulated metrology data may then be determined that is used to determine overlay performance indicators. The grid model is then selected using the overlay performance indicators.
    Type: Grant
    Filed: July 12, 2006
    Date of Patent: December 23, 2008
    Assignee: ASML Netherlands B.V.
    Inventors: Hubertus Johannes Gertrudus Simons, Henricus Johannes Lambertus Megens, Everhardus Cornelis Mos, Leonardus Henricus Marie Verstappen, Roy Werkman, Henricus Jacobus Maria Verhoeven
  • Patent number: 7433038
    Abstract: An alignment apparatus for a substrate bonding system is provided with a first optical arm arranged to direct onto a detector radiation from a first alignment mark on a first substrate, and a second optical arm arranged to direct onto the detector radiation from a second alignment mark on a second substrate. The first alignment mark has a known location relative to a functional pattern provided on an opposite side of the first substrate, and the second alignment mark has a known location relative to a functional pattern provided on an opposite side of the second substrate. The substrate bonding system can be further provided with first and second substrate tables arranged to hold the first and second substrates such that they face one another, at least one of the substrate tables being movable in response to a signal output from the detector, thereby allowing the first and second substrates to be aligned with respect to each other for bonding.
    Type: Grant
    Filed: April 27, 2006
    Date of Patent: October 7, 2008
    Assignee: ASML Netherlands B.V.
    Inventors: Franciscus Godefridus Casper Bijnen, Roy Werkman
  • Patent number: 7415319
    Abstract: Correcting for misalignment of a substrate before it is exposed is performed using offset corrections and process corrections that are calculated based on alignment offset measurements of alignment marks and overlay measurements of overlay targets on substrates in previous batches.
    Type: Grant
    Filed: April 4, 2006
    Date of Patent: August 19, 2008
    Assignee: ASML Netherlands B.V.
    Inventors: Roy Werkman, Everhardus Cornelis Mos
  • Publication number: 20080068609
    Abstract: When using a scatterometer different portions of a target area may be at different focal depths. When the whole area is measured this results in part of it being out of focus. To compensate for this an array of lenses is placed in the back focal plane of the high numerical aperture lens.
    Type: Application
    Filed: September 14, 2006
    Publication date: March 20, 2008
    Applicant: ASML Netherlands B.V.
    Inventors: Roy Werkman, Everhardus Cornelis Mos, Maurits Van Der Schaar
  • Publication number: 20070252994
    Abstract: An alignment apparatus for a substrate bonding system is provided with a first optical arm arranged to direct onto a detector radiation from a first alignment mark on a first substrate, and a second optical arm arranged to direct onto the detector radiation from a second alignment mark on a second substrate. The first alignment mark has a known location relative to a functional pattern provided on an opposite side of the first substrate, and the second alignment mark has a known location relative to a functional pattern provided on an opposite side of the second substrate. The substrate bonding system can be further provided with first and second substrate tables arranged to hold the first and second substrates such that they face one another, at least one of the substrate tables being movable in response to a signal output from the detector, thereby allowing the first and second substrates to be aligned with respect to each other for bonding.
    Type: Application
    Filed: April 27, 2006
    Publication date: November 1, 2007
    Applicant: ASML Netherlands B.V.
    Inventors: Franciscus Godefridus Bijnen, Roy Werkman