Patents by Inventor Rozalia Beica

Rozalia Beica has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electroplating compositions and methods
    Patent number: 7151049
    Abstract: Disclosed are electrolyte compositions for depositing a tin alloy on a substrate. The electrolyte compositions include tin ions, ions of one or more alloying metals, an acid, a thiourea derivative, and an additive selected from alkanol amines, polyethylene imines, alkoxylated aromatic alcohols, and combinations thereof. Also disclosed are methods of depositing a tin alloy on a substrate and methods of forming an interconnect bump on a semiconductor device.
    Type: Grant
    Filed: April 2, 2004
    Date of Patent: December 19, 2006
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Rozalia Beica, Neil D. Brown, Kai Wang
  • Electroplating compositions and methods
    Publication number: 20040253804
    Abstract: Disclosed are electrolyte compositions for depositing a tin alloy on a substrate. The electrolyte compositions include tin ions, ions of one or more alloying metals, an acid, a thiourea derivative, and an additive selected from alkanol amines, polyethylene imines, alkoxylated aromatic alcohols, and combinations thereof. Also disclosed are methods of depositing a tin alloy on a substrate and methods of forming an interconnect bump on a semiconductor device.
    Type: Application
    Filed: April 2, 2004
    Publication date: December 16, 2004
    Applicant: Rohm and Haas Electronic Materials, L.L.C.
    Inventors: Rozalia Beica, Neil D. Brown, Kai Wang
  • Control of breakdown products in electroplating baths
    Patent number: 6508924
    Abstract: Disclosed are methods for analyzing additive breakdown products in electroplating baths as well as methods of controlling the presence of such breakdown products in electroplating baths.
    Type: Grant
    Filed: May 31, 2000
    Date of Patent: January 21, 2003
    Assignee: Shipley Company L.L.C.
    Inventors: Luis A. Gomez, Rozalia Beica, Denis Morrissey, Eugene N. Step
  • Seed layer recovery
    Publication number: 20020074242
    Abstract: Disclosed is a method for repairing of seed layers by removal of oxidized metal from the seed layers prior to subsequent metallization. Also disclosed is a method for monitoring such repair to provide substantially metal oxide free seed layers.
    Type: Application
    Filed: October 13, 2001
    Publication date: June 20, 2002
    Applicant: Shipley Company, L.L.C.
    Inventors: Denis Morrissey, Jeffrey M. Calvert, Rozalia Beica