Patents by Inventor Ru-Jen Chiu

Ru-Jen Chiu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Transfer method using thermal transfer film
    Patent number: 8685191
    Abstract: A thermal transfer film at least including a substrate, a semi-cured protection layer, and an ink layer is provided. The semi-cured protection layer is coated on the substrate, and a material of the semi-cured protection layer includes thermal curing resin and radiation curing resin. Moreover, the resin of the semi-cured protection layer is at least partially cured. The ink layer is coated on the semi-cured protection layer.
    Type: Grant
    Filed: February 5, 2008
    Date of Patent: April 1, 2014
    Assignee: Compal Electronics, Inc.
    Inventors: Chen-Hua Liu, Ru-Jen Chiu, Bar-Long Denq, Hung-Jen Chen
  • Protective sheet and method for manufacturing the same
    Patent number: 7939165
    Abstract: A protective film comprises a substrate and a semi-cured protective layer over the substrate. The semi-cured protective layer is formed by curing a liquid mixture consisting of a thermosetting resin and a radiation curing resin.
    Type: Grant
    Filed: March 3, 2008
    Date of Patent: May 10, 2011
    Assignee: Compal Electronics, Inc.
    Inventors: Ru-Jen Chiu, Chen-Hua Liu, Bar-Long Denq, Hung-Jen Chen
  • COLOR PATTERN FILM FOR METAL SHELL
    Publication number: 20090104396
    Abstract: A color pattern film for metal shell is provided. The color pattern film for metal shell includes a transparent polymer substrate, a releasing coating layer, a protective layer, an ink layer, and an adhesive layer. The releasing coating layer is on the transparent polymer substrate, the protective layer is on the releasing coating layer, the ink layer is on the protective layer, and the adhesive layer is on the ink layer. The adhesive layer at least includes a base resin which is one of resin systems selected from ethylene-vinyl acetate (EVA), polyester (PET) resin, and polyolefin resin. The color pattern film for metal shell can be directly pressed and attached onto a metal sheet or coil, and subsequently punched, thus the problems of the prior art that the yield of adhesive wet film coating process is not easily controlled and complex post-processes are still required after molding are addressed.
    Type: Application
    Filed: February 4, 2008
    Publication date: April 23, 2009
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Chien-Chun Wu, Chen-Hua Liu, Bar-Long Denq, Yu-Ju Chen, Ru-Jen Chiu
  • Protective Sheet and Method for Manufacturing the Same
    Publication number: 20090047508
    Abstract: A protective film comprises a substrate and a semi-cured protective layer over the substrate. The semi-cured protective layer is formed by curing a liquid mixture consisting of a thermosetting resin and a radiation curing resin.
    Type: Application
    Filed: March 3, 2008
    Publication date: February 19, 2009
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Ru-Jen Chiu, Chen-Hua Liu, Bar-Long Denq, Hung-Jen Chen
  • THERMAL TRANSFER FILM, METHOD OF MANUFACTURING THE SAME AND TRANSFER METHOD
    Publication number: 20080277050
    Abstract: A thermal transfer film at least including a substrate, a semi-cured protection layer, and an ink layer is provided. The semi-cured protection layer is coated on the substrate, and a material of the semi-cured protection layer includes thermal curing resin and radiation curing resin. Moreover, the resin of the semi-cured protection layer is at least partially cured. The ink layer is coated on the semi-cured protection layer.
    Type: Application
    Filed: February 5, 2008
    Publication date: November 13, 2008
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Chen-Hua Liu, Ru-Jen Chiu, Bar-Long Denq, Hung-Jen Chen