Abstract: A compound heat-dissipating device includes a conductive base and a heat-dissipating body. The conductive base has a first bottom surface, a first top surface, and a plurality of combining portions protruded from the first top surface. Each combining portion has a bottom end connected with the first bottom surface and a top end extended from the bottom end integrally. The top end has a cross-sectional area bigger than that of the bottom end. The heat-dissipating body has a second bottom surface and a second top surface. The second bottom surface has a pair of concave portions corresponding to a contour of the conductive base, and a plurality of combining grooves formed in the concave portion. The shape of the combining grooves is corresponding to that of the combining portions, and the combining portions are correspondingly combined with the combining grooves.