Patents by Inventor Ruben Javier

Ruben Javier has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240082843
    Abstract: A soft and stretchable microelectrode array (sMEA) including a first circuit board having a first though hole; a second circuit board having a second through hole; a microelectrode array including a plurality of microelectrodes embedded in an elastomeric substrate, wherein the microelectrode array is disposed between the first and second printed circuit boards, and includes an exposed portion corresponding the first and second through holes; a plurality of contact pads formed on a top or bottom surface of the first printed circuit board and electrically connected to the plurality of microelectrodes; and a culture well mounted on the first printed circuit board and encompassing the first through hole. Further, the exposed portion of the microelectrode array includes a 3D pocket lined with stretched microelectrodes for electrically stimulating and recording signals from an organoid placed in the 3D pocket.
    Type: Application
    Filed: September 9, 2022
    Publication date: March 14, 2024
    Applicant: BMSEED LLC
    Inventors: Oliver Graudejus, Francisco Javier Lopez Arellano, Cami Caitlyn Rowan, Ruben Dario Ponce Wong
  • Publication number: 20130321231
    Abstract: A planar dipole antenna for dual-band Wi-Fi application is disclosed. The antenna has a ground copper and a radiation copper. The ground copper is adhered to a substrate and has an upper, shorter and generally horizontal segment and a lower, longer and also generally horizontal segment that are connected at one end thereof by a vertical segment. The radiation copper is adhered to the substrate and has a copper shaped substantially as a mirror symmetry of the ground copper and spaced apart from the ground copper by a gap at the end of the ground and radiation coppers where the shorter and longer horizontal segments thereof are connected. The antenna has a gross span of approximately 42 mm and a height of approximately 7 mm. The gap is approximately 0.
    Type: Application
    Filed: November 21, 2011
    Publication date: December 5, 2013
    Applicant: Taoglas Group Holdings
    Inventor: Ruben Javier Flores-Cuadras
  • Patent number: D485943
    Type: Grant
    Filed: March 19, 2003
    Date of Patent: January 27, 2004
    Assignee: Colgate-Palmolive Company
    Inventors: Lee Mai Wong, Ruben Javier, Alan Nimmey, Steven Johnson, Randy A. Kliment, Todd VanGordon, Scott Murray Walsh