Abstract: The present subject matter relates to an electronic system comprising gated circuitry, a first regulator circuit directly coupled to the gated circuitry, always-on circuitry, a second regulator circuit directly coupled to the always-on circuitry, and a switch circuit coupled between an output of the first regulator circuit and an output of the second regulator circuit. The always-on circuitry includes control logic configured to activate the second regulator circuit and deactivate the first regulator circuit and the switch circuit in a sleep mode and activate the first regulator circuit and the switch circuit in an active mode.

Abstract: Multilevel memory error management techniques can improve system performance, availability, and reliability by preventing future accesses to faulty near memory locations. According to examples described herein, multilevel memory error management techniques enable proactively offlining far memory locations mapped to a faulty near memory location before additional faults are encountered, and/or maintaining a faulty near memory location list to enable bypassing the faulty near memory location to prevent future errors.

Abstract: A method and/or an apparatus of core timing prediction is disclosed. In one embodiment, a method may include generating a core timing model of a core logic that is accurately transferable to any chip-level integration process. The method may reduce performance degradation and/or performance variation of the core logic caused by a number of interactions between core logic components and chip-level components in the chip-level integration process. In addition, the core timing model of the core logic may be generated by filling un-wired tracks with metal in any of an outermost layer of the core logic after a core logic routing and constructing a layer at least an area of and adjacent to any of the outermost layer of the core logic with grounded metal that is orthogonal to those of the metal used in the outermost layer of the core logic.

Abstract: A method and/or an apparatus of core timing prediction is disclosed. In one embodiment, a method may include generating a core timing model of a core logic that is accurately transferable to any chip-level integration process. The method may reduce performance degradation and/or performance variation of the core logic caused by a number of interactions between core logic components and chip-level components in the chip-level integration process. In addition, the core timing model of the core logic may be generated by filling un-wired tracks with metal in any of an outermost layer of the core logic after a core logic routing and constructing a layer at least an area of and adjacent to any of the outermost layer of the core logic with grounded metal that is orthogonal to those of the metal used in the outermost layer of the core logic.

Abstract: A method and/or an apparatus of core timing prediction is disclosed. In one embodiment, a method may include generating a core timing model of a core logic that is accurately transferable to any chip-level integration process. The method may reduce performance degradation and/or performance variation of the core logic caused by a number of interactions between core logic components and chip-level components in the chip-level integration process. In addition, the core timing model of the core logic may be generated by filling un-wired tracks with metal in any of an outermost layer of the core logic after a core logic routing and constructing a layer at least an area of and adjacent to any of the outermost layer of the core logic with grounded metal that is orthogonal to those of the metal used in the outermost layer of the core logic.

Abstract: A method and/or an apparatus of core timing prediction is disclosed. In one embodiment, a method may include generating a core timing model of a core logic that is accurately transferable to any chip-level integration process. The method may reduce performance degradation and/or performance variation of the core logic caused by a number of interactions between core logic components and chip-level components in the chip-level integration process. In addition, the core timing model of the core logic may be generated by filling un-wired tracks with metal in any of an outermost layer of the core logic after a core logic routing and constructing a layer at least an area of and adjacent to any of the outermost layer of the core logic with grounded metal that is orthogonal to those of the metal used in the outermost layer of the core logic.

Abstract: A packaging for at least two associated articles comprises a box-like body (1) with a substantially polygonal bottom (10), a number of standing side walls (11, 12) and a cover (20) which closes off the whole in the closed situation. The box-like body herein houses an internal space (30) in which the articles for packaging can be accommodated. According to the invention this internal space (30) is intended to receive therein only a first of the two articles, the first article being supplied as standard. The box-like body (1) is provided with a recess (40) accessible from outside for receiving a second article therein, which second article can be an optional article which is precisely determined only later.