Patents by Inventor Ruben T. Apodaca

Ruben T. Apodaca has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermal dissipating metal core printed circuit board
    Patent number: RE29784
    Abstract: A metal core printed circuit board which includes multiple layers of synthetic plastic resin material on a sheet of metal, and wherein the surface of the plastic material is of such character that it provides an acceptable bond on which are built up sundry layers of different metals, the innermost layer on the plastic surface and the other layers positioned one upon another, ultimately comprising a built up circuit pattern, and wherein areas intermediate the circuit pattern comprise an exposed surface of the resin material.
    Type: Grant
    Filed: June 28, 1974
    Date of Patent: September 26, 1978
    Assignee: International Electronics Research Corp.
    Inventors: Donald H. Chadwick, Ruben T. Apodaca