Abstract: Embodiments of the present invention provide a compound power transistor device including a first semiconductor substrate including a first semiconductor material, a second semiconductor substrate including a second semiconductor material different from the first semiconductor material, and a power transistor formed in or on the second semiconductor substrate. In certain embodiments, the second semiconductor substrate is micro-transfer printed on and secured to the first semiconductor substrate.

Abstract: A method for manufacturing a system in a wafer for measuring an absolute and a relative pressure includes etching a shallow and a deep cavity in the wafer. A top wafer is applied and the top wafer is thinned for forming a first respectively second membrane over the shallow respectively deep cavity, and for forming in the top wafer first respectively second bondpads at the first respectively second membrane resulting in a first respectively second sensor. Back grinding the wafer results in an opened deep cavity and a still closed shallow cavity. The first bondpads of the first sensor measure an absolute pressure and the second bondpads of the second sensor measure a relative pressure. The etching in the first step defines the edges of the first membrane and of the second membrane in respectively the sensors formed from the shallow and the deep cavity.

Abstract: Embodiments of the present invention provide a compound power transistor device including a first semiconductor substrate including a first semiconductor material, a second semiconductor substrate including a second semiconductor material different from the first semiconductor material, and a power transistor formed in or on the second semiconductor substrate. In certain embodiments, the second semiconductor substrate is micro-transfer printed on and secured to the first semiconductor substrate.

Abstract: A method for manufacturing a system in a wafer for measuring an absolute and a relative pressure includes etching a shallow and a deep cavity in the wafer. A top wafer is applied and the top wafer is thinned for forming a first respectively second membrane over the shallow respectively deep cavity, and for forming in the top wafer first respectively second bondpads at the first respectively second membrane resulting in a first respectively second sensor. Back grinding the wafer results in an opened deep cavity and a still closed shallow cavity. The first bondpads of the first sensor measure an absolute pressure and the second bondpads of the second sensor measure a relative pressure. The etching in the first step defines the edges of the first membrane and of the second membrane in respectively the sensors formed from the shallow and the deep cavity.

Abstract: A test insert for an integrated circuit according to the present invention comprises access contacts and an electrical path. Furthermore, there may be additional access contacts and a plurality of different electrical paths. The electrical path is comprised of a plurality of tracks, each track provided at a single layer of the integrated circuit and connected to the other tracks by interconnecting vias. The vias provide interlayer contacts and thus allow the tracks to be connected into a single electrical track. In one embodiment, an access contact is connected to ground; another contact is connected to a reference voltage; and connected to various points in the electrical path are transistor-resistor pairs. The transistor-resistor pairs are in connected between earth and a third access contact. If the electrical path is intact at the track connected to a transistor-resistor pair, a current can flow between contact and the respective earth of the transistor-resistor pair.

Abstract: An integrated circuit comprises one or more integrated circuit elements which may interact with other circuitry via one or more input/output pins. In the present invention the circuit elements include and interface element for interfacing with external test circuitry. The interface element communicates with the external test circuitry via a single input/output pin dedicated for testing.

Abstract: A DC motor drive circuit includes a switching circuit that drives the coils of a small permanent magnetic DC motor. The drive circuit is preferably implemented in an integrated circuit device, such as a silicon CMOS device. Integrated into the same integrated circuit device is a magnetic sensor arranged to detect the position of the permanent magnet as it passes a defined point, or points, in its revolution, and control circuitry to derive the timing waveforms for driving the coils. The integrated power devices for driving the coils are also arranged to limit the rise and fall times of the applied voltages and currents so as to reduce or eliminate the generation of unwanted RFI. Additional circuitry is also integrated into the same integrated circuit device to derive the necessary power to operate the magnetic sensor, the control circuitry and the switching circuitry from the connections between the switching circuitry and the coils so as to remove the need for a separate power supply connection.

Abstract: A DC motor drive circuit includes a switching circuit that drives the coils of a small permanent magnetic DC motor. The drive circuit is preferably implemented in an integrated circuit device, such as a silicon CMOS device. Integrated into the same integrated circuit device is a magnetic sensor arranged to detect the position of the permanent magnet as it passes a defined point, or points, in its revolution, and control circuitry to derive the timing waveforms for driving the coils. The integrated power devices for driving the coils are also arranged to limit the rise and fall times of the applied voltages and currents so as to reduce or eliminate the generation of unwanted RFI. Additional circuitry is also integrated into the same integrated circuit device to derive the necessary power to operate the magnetic sensor, the control circuitry and the switching circuitry from the connections between the switching circuitry and the coils so as to remove the need for a separate power supply connection.

Abstract: A DC motor drive circuit, includes a switching circuit that drives the coils of a small permanent magnetic DC motor. The drive circuit is preferably implemented in an integrated circuit device, such as a silicon CMOS device. Integrated into the same integrated circuit device is a magnetic sensor arranged to detect the position of the permanent magnet as it passes a defined point, or points, in its revolution, and control circuitry to derive the timing waveforms for driving the coils. The integrated power devices for driving the coils are also arranged to limit the rise and fall times of the applied voltages and currents so as to reduce or eliminate the generation of unwanted RFI. Additional circuitry is also integrated into the same integrated circuit device to derive the necessary power to operate the magnetic sensor, the control circuitry and the switching circuitry from the connections between the switching circuitry and the coils so as to remove the need for a separate power supply connection.

Abstract: A sensor system including magnetic sensing elements and circuitry configured to detect the presence or absence of an article, such as a gear tooth, in a first mode, and to determine timing accuracy in a second mode. Control circuitry is provided for controlling the switching circuitry to switch between modes in a predetermined manner and at predetermined times dependent upon the voltages and magnetic fields. The magnetic sensing elements as well as the switching circuitry, interface circuitry and the control circuitry are preferably integrated onto a single silicon chip to yield an efficient and reliable sensor system. Upon power on, the sensor is configured in the first mode to determine the presence or absence of the article next to the sensor. After a number of transitions of the hall voltage, e.g.

Abstract: A DC motor drive circuit, includes a switching circuit that drives the coils of a small permanent magnetic DC motor. The drive circuit is preferably implemented in an integrated circuit device, such as a silicon CMOS device. Integrated into the same integrated circuit device is a magnetic sensor arranged to detect the position of the permanent magnet as it passes a defined point, or points, in its revolution, and control circuitry to derive the timing waveforms for driving the coils. The integrated power devices for driving the coils are also arranged to limit the rise and fall times of the applied voltages and currents so as to reduce or eliminate the generation of unwanted RFI. Additional circuitry is also integrated into the same integrated circuit device to derive the necessary power to operate the magnetic sensor, the control circuitry and the switching circuitry from the connections between the switching circuitry and the coils so as to remove the need for a separate power supply connection.

Abstract: A DC motor drive circuit includes a switching circuit that drives the coils of a small permanent magnetic DC motor. The drive circuit is preferably implemented in an integrated circuit device, such as a silicon CMOS device. Integrated into the same integrated circuit device is a magnetic sensor arranged to detect the position of the permanent magnet as it passes a defined point, or points, in its revolution, and control circuitry to derive the timing waveforms for driving the coils. The integrated power devices for driving the coils are also arranged to limit the rise and fall times of the applied voltages and currents so as to reduce or eliminate the generation of unwanted RFI. Additional circuitry is also integrated into the same integrated circuit device to derive the necessary power to operate the magnetic sensor, the control circuitry and the switching circuitry from the connections between the switching circuitry and the coils so as to remove the need for a separate power supply connection.

Abstract: An improved Hall effect sensor includes a four-terminal Hall plate with orthogonally paired terminals that produce voltage signals in response to changes in an ambient magnetic field created by the proximity of a ferrous gear tooth to the sensor. Voltage signals from orthogonally paired terminals of the Hall plate are controlled by switches that are coupled to a clock signal generator. In response to the clock signal, the switches allow current to flow in a first direction corresponding to a first phase of the clock and to flow in a second direction corresponding to a second phase of the clock. A plurality of pass gate transistors in the sensor circuitry are connected to a timing generator synchronized with the clock signal generator. The timing generator outputs are received by the gate transistors and the gate transistors control the sequence in which a plurality of capacitors are charged. This plurality of capacitors store the voltage output from the Hall plate.

Abstract: A capacitive position sensor employs conventional printed circuit board (PCB) technology to detect capacitive changes caused by the movement of a ball along conductive tracks. A recessed region (or through hole) is stamped on the PCB with well controlled dimensions. Electrically conductive tracks are laid around the region and connect to a capacitance detection circuit on the PCB. As the PCB experiences inclination or acceleration the ball moves along the axis of the recessed region causing variations in the measured capacitance.