Abstract: A method is provided for obtaining stable and elevated deposition rates in a reaction chamber, following the cleaning of the chamber. The method involves cleaning of the chamber, pre-coating the interior surfaces of the reaction chamber with an inorganic composition, and then, using the pre-coated chamber to deposit an organic layer onto a workpiece.

Abstract: A method is provided for obtaining stable and elevated deposition rates in a reaction chamber, following the cleaning of the chamber. The method involves cleaning of the chamber, pre-coating the interior surfaces of the reaction chamber with an inorganic composition, and then, using the pre-coated chamber to deposit an organic layer onto a workpiece.

Abstract: Method for the treatment of semiconductor substrates as well as an oven-boat system for this purpose. The oven is embodied as a vertical oven and it is aimed to simultaneously treat a number of substrates arranged one above the other in a boat. To carry out the deposition and such processes at raised temperatures as uniformly as possible, that is, so that each semiconductor substrate substantially undergoes the same treatment, it is proposed on the one hand to vary the ratio of the volume limited by two consecutive armrests and on the other hand the volume limited by screening off the process area and the edge of the substrates from the insertion end of the gas to the discharge end of the gas that flows through the oven.

Abstract: Method for the treatment of semiconductor substrates as well as an oven-boat system for this purpose. The oven is embodied as a vertical oven and it is aimed to simultaneously treat a number of substrates arranged one above the other in a boat. To carry out the deposition and such processes at raised temperatures an uniformly as possible, that is, so that each semiconductor substrate substantially undergoes the same treatment, it is proposed on the one hand to vary the ratio of the volume limited by two consecutive armrests and on the other hand the volume limited by screening off the process area and the edge of the substrates from the insertion end of the gas to the discharge end of the gas that flows through the oven.

Abstract: A process for admixing additives to plastics and simultaneously removing volatile constituents in a horizontal devolatilizing extruder. Taken in sequence in the direction of flow, the additives are first introduced into the devolatilizing extruder from above, and the plastic melt, solution or dispersion is then introduced from below, while the bulk of the volatile constituents are withdrawn from the devolatilizing extruder at an orifice located vertically above the point at which the plastic is fed in. The process permits the removal of volatile constituents with simultaneous admixture of additives during aftertreatment of plastics, in a single step and at very high throughputs.

Abstract: A continuous process for the polymerisation of olefinically unsaturated monomers in bulk or in solution in which at least a portion of the low-viscosity materials to be fed to the polymerization zone is thoroughly mixed with a portion of the high-viscosity contents of the polymerization zone in a mixing zone disposed upstream of the polymerization zone, which mixture is then continuously fed to the polymerization zone. The resulting polymers have a uniform composition and a narrow molecular weight distribution. They may be converted to shaped articles by thermoplastic methods.