Abstract: A method for optimizing a machining time of a laser machining process includes: specifying a machining path of the laser machining process on the workpiece, said machining path having a plurality of machining path sections, specifying at least one boundary condition for at least one of the machining path sections; and determining control data for the laser machining process of the machining path taking into account the at least one boundary condition such that a machining time of the laser machining process is minimal. Furthermore, a method for performing a laser machining process on a workpiece includes such a method and a laser machining system is configured to perform the methods.

Abstract: A laser machining head for machining a workpiece by means of a laser beam, includes: a scanning device for directing the laser beam at a plurality of positions on a workpiece surface; an image acquisition device for acquiring an image of the workpiece surface, said image acquisition device including an objective with a lens having an adjustable focal length; and a control configured to adjust a focal length of the lens based on a measurement value.

Abstract: A laser machining head for machining a workpiece by a laser beam includes: a scanning device for deflecting the laser beam on the workpiece; a housing in which the scanning device is arranged; and at least one overheat protection device configured to protect the housing from overheating, said overheat protection device comprising an energy distribution device for distributing incident radiation energy and/or a heat sink for dissipating heat.

Abstract: A method for determining a position of a workpiece for a laser machining process includes the steps of: radiating a measurement beam to at least one workpiece and a support device surrounding the workpiece along at least one first and along at least one second measurement path, the first path forming a predetermined angle with the second path; acquiring a portion of the radiated measurement beam, reflected by the support device and the workpiece, along the first and along the second measurement path and generating a corresponding measurement signal, the support device and the workpiece comprising a reflectivity different from each other; and determining a position of the workpiece based on the measurement signal. A method for machining a workpiece by a laser beam includes the method for determining the position of the workpiece. An apparatus for determining a position of a workpiece is configured for conducting the methods.

Abstract: A method for calibrating at least one optical sensor of a laser machining head is provided. The laser machining head comprises a first optical sensor, a deflection device, and a focusing device. A laser beam path of the first optical sensor passes through the deflection device and the focusing device. The method comprises the steps of: deflecting the beam path of the first optical sensor by the deflection device to a first position on a first reference; generating a first optical measurement signal based on measurement light received by the first optical sensor from the first position on the first reference; and determining a correction value for calibrating the first optical sensor based on the first optical measurement signal and according to a deviation of the first position on the first reference from a first target position, which is specified relative to a position of the machining laser beam.

Abstract: A method of analyzing a welded connection during laser welding of workpieces includes acquiring a first measurement signal for a process radiation generated during laser welding, acquiring a second measurement signal for a laser radiation reflected by the workpieces, determining whether there is a gap between the workpieces based on the first measurement signal, and when it is determined that there is a gap, determining based on the second measurement signal whether there is a welded connection.

Abstract: A method for identifying joining positions of workpieces includes capturing images of a joint by a camera, determining measurement data for the joining positions associated with a course of the joint from the images of the joint, determining a mathematical model of the joint course from a part of the measurement data, providing a curve based on the mathematical model for positioning a welding laser during a laser welding process along the curve.

Abstract: A method of laser machining a workpiece includes the steps of: radiating a laser beam onto at least one workpiece, the laser beam having a core beam and a ring beam extending coaxially with one another, wherein the laser beam is moved over the workpiece along a pre-determined machining path, and adjusting a laser power of the core beam and/or a laser power of the ring beam as a function of a position of the laser beam on the workpiece. An associated laser machining system is also disclosed.

Abstract: A method for determining a depth of a vapor capillary during laser machining includes: irradiating a machining laser beam onto a workpiece to form the capillary, the beam deflected by a first deflection device along a machining path within a first scan field, irradiating an optical measuring beam onto the workpiece, the measuring beam deflected by a second deflection device relative to the machining laser beam along a scanning path within a scanning area and then together with the machining laser beam by the first deflecting device, acquiring measured distance values along the path based on part of the measuring beam reflected by the workpiece, determining a depth/position of the capillary based on the acquired measured distance values. The scanning area size is based on a position of the laser beam and/or deflection of the laser beam by the first deflection device. A corresponding laser machining system is also provided.

Abstract: A method is provided for analyzing a weld seam formed by a laser welding process, said method including thermally exciting the weld seam by radiating at least one laser pulse onto the weld seam, acquiring a decay characteristic of a thermal radiation emitted by the weld seam, and determining whether a welding defect is present based on an evaluation of the acquired decay characteristic. Furthermore, a laser machining system for analyzing a weld seam formed by a laser welding process between at least two workpieces is provided.

Abstract: A system for machining materials by means of laser beam includes a deflection device for deflecting the laser beam and a wobble device configured to superimpose a wobble movement of the laser beam with a wobble figure and a wobble frequency onto a feed movement of the laser beam corresponding to a machining path by controlling the deflection device. The wobble device is configured, for carrying out the wobble movement, to control the deflection device according to a compensated wobble movement. Control values for a deflection of the laser beam along the wobble figure are adapted as a function of the wobble frequency and/or a path speed of the wobble movement that varies along the wobble figure is adapted as a function of a position of the laser beam in the wobble figure and as a function of the wobble frequency.

Abstract: A laser processing head is presented. The laser processing head includes a laser entry module for introducing a laser beam; a collimating module for collimating the laser beam; a scanning module for deflecting the laser beam; a focusing module for focusing the laser beam; and at least one diaphragm for increasing a scan field of the laser beam. The diaphragm comprises a diaphragm body and an opening, and is configured to limit a cross-sectional area of the laser beam by the diaphragm body. The at least one diaphragm is positioned optically downstream of the laser entry module and optically upstream of the focusing module. A laser processing system including the laser processing head is also presented. Furthermore, a method for increasing a scan field of the laser beam is also provided.

Abstract: A laser machining system, or laser welding system, for machining a workpiece includes: a laser machining head for directing a laser beam onto a workpiece to produce a vapor capillary; an optical measuring device using an optical measuring beam; an image acquisition unit to capture an image of a region of the workpiece surface containing the vapor capillary and a measuring spot produced by irradiation with the measuring beam. The system determines positions of the measuring spot and vapor capillary based on the image. A method includes: directing the laser beam onto a workpiece surface to produce a vapor capillary; directing an optical measuring beam onto the surface to measure a depth of the vapor capillary; capturing an image of a region containing the vapor capillary and a measuring spot from the optical measuring beam; and determining, based on the captured image, position of the measuring spot and vapor capillary.

Abstract: The present disclosure concerns a device for distance measurement for a laser processing system. The device comprises a light source, which is configured to generate a primary beam for direction onto a workpiece, at least one detection device configured to record a secondary beam reflected from the workpiece, at least one optical amplifier configured to amplify the primary beam and/or the secondary beam, and an evaluation unit configured to evaluate interference between spectral components in the frequency domain.

Abstract: A device for measuring the depth of a weld seam in real time during the welding or joining of a workpiece by means of radiation, including: its measuring light source, the light of which is coupled by a beam splitter into a reference arm and a measuring arm; a collimator module having at least one collimation lens for collimating a measuring light beam, which is fed to the collimator module via an optical waveguide in the measuring arm, and for imaging the measuring light beam, which is reflected from a workpiece to be processed, on an exit/entry surface of the optical waveguide; a coupling element for coupling the measuring light beam into the beam path of a processing beam; a focusing lens for the joint focusing of the measuring light beam and the processing beam on the workpiece and for the collimating of the reflected measuring light beam; and an analysis unit for determining the depth of a weld seam, into which the measuring light reflected from the workpiece is guided with the superimposed, reflected li

Abstract: A laser machining system, or laser welding system, for machining a workpiece includes: a laser machining head for directing a laser beam onto a workpiece to produce a vapor capillary; an optical measuring device using an optical measuring beam; an image acquisition unit to capture an image of a region of the workpiece surface containing the vapor capillary and a measuring spot produced by irradiation with the measuring beam. The system determines positions of the measuring spot and vapor capillary based on the image. A method includes: directing the laser beam onto a workpiece surface to produce a vapor capillary; directing an optical measuring beam onto the surface to measure a depth of the vapor capillary; capturing an image of a region containing the vapor capillary and a measuring spot from the optical measuring beam; and determining, based on the captured image, position of the measuring spot and vapor capillary.

Abstract: A method is provided for identifying joining positions of workpieces. A laser machining head includes a housing through which a work laser beam path is guided. A device for carrying out the method for identifying joining positions of workpieces includes: a camera for capturing images of a joint of workpieces, the viewing beam path of which is coupled coaxially into the work laser beam path; and an illumination device, the illumination beam path of which is coupled coaxially into the viewing beam path and into the work laser beam path. In the method, images of a joint are captured by a camera, and from the images of the joint measurement data for the joining positions is determined. The measurement data is associated with the course of the joint. A model of the course of the joint is determined from a part of the measurement data, the model providing a measurement curve which is output for controlling a joining process and/or for determining additional quality characteristics.

Abstract: The invention relates to a device for process monitoring during laser processing, in particular during laser welding and deep laser welding, comprising an optical distance measuring device having a measurement light source for generating a measurement light beam (14), which is focused onto a workpiece surface in order to form a measurement light spot, and comprising a prism deflection unit (24) having at least one prism (22) which is mounted rotatably about an axis (28) running transversely with respect to the measurement light beam (14) and which laterally deflects the measurement light beam (14) for positioning the measurement light spot on the workpiece surface.

Abstract: The present disclosure relates to a device for distance measurement for a laser processing system, comprising a collimator lens system, which is set up to collimate an optical measuring beam, a deflection lens system, which defines an optical axis, wherein the deflection lens system comprises at least one transmissive optical element, which is displaceable relative to the optical axis, in order to deflect the collimated optical beam from the optical axis, and a focusing lens system, which is set up to focus the deflected measuring beam onto a workpiece.

Abstract: The present disclosure concerns a device for distance measurement for a laser processing system. The device comprises a light source, which is configured to generate a primary beam for direction onto a workpiece, at least one detection device configured to record a secondary beam reflected from the workpiece, at least one optical amplifier configured to amplify the primary beam and/or the secondary beam, and an evaluation unit configured to evaluate interference between spectral components in the frequency domain.