Patents by Inventor Rudolf Bart

Rudolf Bart has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Module package and production method
    Patent number: 9576870
    Abstract: The invention relates to a module package which comprises a module substrate 1, a chip 2, 3 applied using the flip chip process, and an encapsulation layer 8, and to a method for producing same. The chip 2, 3 has component structures on the top side 13, 14 thereof. Said top said 13, 14 faces the module carrier 1, wherein a gap 4, 5 is formed between the top side 13, 14 of the chip and the module carrier 1. A filler is added to the encapsulation layer 8. The encapsulation layer 8 partly fills underneath the chip 2, 3, wherein at most the part of the chip 2, 3, on which no component structures are present, is underfilled, and at a minimum the material of the encapsulation layer 8 completely encloses the sides of the chip 2, 3.
    Type: Grant
    Filed: June 20, 2011
    Date of Patent: February 21, 2017
    Assignee: EPCOS AG
    Inventors: Claus Reitlinger, Frank Rehme, Rudolf Bart
  • MODULE PACKAGE AND PRODUCTION METHOD
    Publication number: 20130168876
    Abstract: The invention relates to a module package which comprises a module substrate 1, a chip 2, 3 applied using the flip chip process, and an encapsulation layer 8, and to a method for producing same. The chip 2, 3 has component structures on the top side 13, 14 thereof. Said top said 13, 14 faces the module carrier 1, wherein a gap 4, 5 is formed between the top side 13, 14 of the chip and the module carrier 1. A filler is added to the encapsulation layer 8. The encapsulation layer 8 partly fills underneath the chip 2, 3, wherein at most the part of the chip 2, 3, on which no component structures are present, is underfilled, and at a minimum the material of the encapsulation layer 8 completely encloses the sides of the chip 2, 3.
    Type: Application
    Filed: June 20, 2011
    Publication date: July 4, 2013
    Applicant: EPCOS AG
    Inventors: Claus Reitlinger, Frank Rehme, Rudolf Bart