Patents by Inventor Rudolf Buser

Rudolf Buser has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Actuator Coupling System and a Pipetting Module Comprising Such a Coupling System
    Publication number: 20060281213
    Abstract: The present invention is directed a system for coupling a macroactuator to a movable element of a micromachined device. The system includes a micromachined device, a first body for holding a macroactuator, a macroactuator mechanically mounted on the first body, a second body having a bore for receiving the first body, a screw arrangement for fixing the axial position of the first body within the bore of the second body, and a plate arrangement for mounting the micromachined device on the second body. The plate arrangement is mounted in such a way that the macroactuator exerts a predetermined force or pressure on a movable element of the micromachined device. The present invention further is directed to a pipetting module that includes the micromachined device and the macroactuator.
    Type: Application
    Filed: August 22, 2006
    Publication date: December 14, 2006
    Applicant: Roche Diagnostics Corporation
    Inventors: Nicolas Szita, Rudolf Buser, Olivier Elsenhans
  • Actuator coupling system and a pipetting module comprising such a coupling system
    Patent number: 7125519
    Abstract: The present invention is directed a system for coupling a macroactuator to a movable element of a micromachined device. The system includes a micromachined device, a first body for holding a macroactuator, a macroactuator mechanically mounted on the first body, a second body having a bore for receiving the first body, a screw arrangement for fixing the axial position of the first body within the bore of the second body, and a plate arrangement for mounting the micromachined device on the second body. The plate arrangement is mounted in such a way that the macroactuator exerts a predetermined force or pressure on a movable element of the micromachined device. The present invention further is directed to a pipetting module that includes the micromachined device and the macroactuator.
    Type: Grant
    Filed: November 21, 2000
    Date of Patent: October 24, 2006
    Assignee: Roche Diagnostics Corporation
    Inventors: Nicolas Szita, Rudolf Buser, Olivier Elsenhans
  • Thermal flow sensor having recesses in a substrate
    Patent number: 7036369
    Abstract: A thermal flow sensor has a first, second and third substrate, each having a first side and a second opposite side. The first substrate is connected to the second substrate such that the second side of the first substrate abuts the first side of the second substrate. The third substrate is connected to the second substrate such that the second side of the second substrate abuts the first side of the third substrate. The second substrate has a groove formed therein so as to form a conduit bounded by the second substrate and the second side of the first substrate and the first side of the third substrate. A heater is disposed on the first side of the first substrate opposed to the conduit. A first temperature sensor is disposed on the first side of the first substrate opposed to the conduit. A second temperature sensor is disposed on the first side of the first substrate opposed to the conduit.
    Type: Grant
    Filed: June 30, 2004
    Date of Patent: May 2, 2006
    Assignee: Codman & Shurtleff, Inc.
    Inventors: Herbert Keppner, Rudolf Buser, Frank Zumkehr, Juergen Burger
  • Thermal flow sensor having recesses in a substrate
    Publication number: 20060000273
    Abstract: A thermal flow sensor has a first, second and third substrate, each having a first side and a second opposite side. The first substrate is connected to the second substrate such that the second side of the first substrate abuts the first side of the second substrate. The third substrate is connected to the second substrate such that the second side of the second substrate abuts the first side of the third substrate. The second substrate has a groove formed therein so as to form a conduit bounded by the second substrate and the second side of the first substrate and the first side of the third substrate. A heater is disposed on the first side of the first substrate opposed to the conduit. A first temperature sensor is disposed on the first side of the first substrate opposed to the conduit. A second temperature sensor is disposed on the first side of the first substrate opposed to the conduit.
    Type: Application
    Filed: June 30, 2004
    Publication date: January 5, 2006
    Inventors: Herbert Keppner, Rudolf Buser, Frank Zumkehr, Juergen Burger
  • Micromechanical pipetting device
    Patent number: 6407437
    Abstract: A micromechanical pipetting device comprising an integrally built pipetting module which has an inlet/outlet which may be connected to a removable pipetting tip or integrally built with a pipetting tip. The pipetting module comprises a micromechanical structure which is integrally built on a silicon wafer.
    Type: Grant
    Filed: March 19, 1998
    Date of Patent: June 18, 2002
    Assignee: Roche Diagnostics Corporation
    Inventors: Jürgen Burger, Felix Baader, Rudolf Buser, Olivier Elsenhans, Nicolas Szita