Abstract: A method of mitigating EMI in an electronic device includes selecting a subset of surface-mount socket connectors on an electronic device to be connected with corresponding working plug connectors and connecting the working plug connectors with the selected subset of socket connectors by inserting the working plug connectors into the selected subset of socket connectors. The method further includes positioning a dummy plug in each of the unselected surface-mount socket connectors, the dummy plug comprising a flexible foam material configured to attenuate electromagnetic radiation by absorption and having a dummy plug profile generally matched to a socket profile of the corresponding socket connector.

Abstract: A system and method for mitigating EMI in an electronic device rely on a set of foam dummy plugs specially configured for insertion into socket connectors according to connector type. The foam plugs have no electrical terminals or wiring, but are made from a foam composite material that attenuates electromagnetic radiation by absorption. The foam composite material includes a foam matrix and electrically conductive particles impregnated within the foam matrix. A handle may be unitarily formed with the foam plug. The handle may include a stamped through-hole, forming a ring, to facilitate insertion and removal of the dummy plugs by hand.

Abstract: A system and method for mitigating EMI in an electronic device rely on a set of foam dummy plugs specially configured for insertion into socket connectors according to connector type. The foam plugs have no electrical terminals or wiring, but are made from a foam composite material that attenuates electromagnetic radiation by absorption. The foam composite material includes a foam matrix and electrically conductive particles impregnated within the foam matrix. A handle may be unitarily formed with the foam plug. The handle may include a stamped through-hole, forming a ring, to facilitate insertion and removal of the dummy plugs by hand.

Abstract: The average EMR emissions of an electronic device may be reduced by implementing an electrically-active modulated termination. For example, the impedance may be continuously varied at one or more termination locations between two metal substructures to cause a like variation in the amplitude of each component of the EMR. According to one approach, cyclically varying the electrical impedance with a period of less than the time interval over which the EMR is measured will result in a reduction in the average measured EMR.

Abstract: An isolated signal probe comprises an input module, an output module, and a fiber optic line connecting the input module to the output module. The input module includes external positive and negative terminals, an input translation circuit electrically connected to the external positive and negative terminals, a first power supply for driving the input translation circuit, and an electrical-to-optical converter that receives a first signal from the input translation circuit. The output module includes an optical-to-electrical converter, an output translation circuit for receiving a second signal from the optical-to-electrical converter; a second power source for driving the output translation circuit, and an output connector electrically connected to the output translation circuit. The fiber optic line connects the electrical-to-optical converter to the optical-to-electrical converter.

Abstract: A multi-port LAN switch is provided that enables attached network devices to both communicate directly and to insert into a token-ring network through an attached concentrator. Each port of the multi-port LAN switch has a first transformer, a second transformer, and a switching system. The first transformer has a first winding connected to a first connection of the port. The second transformer has a first winding connected to a second connection of the port. The switching system switches to a port mode or an adapter mode as a function of a mode signal transmitted to the port In the adapter mode, the switching system connects a second winding of the first transformer to a transmitter circuit in the port, and its connects a second winding of the second transformer to a receiver circuit in the port.

Abstract: A slot-type processor and one or more cache modules are incorporated into a vertically oriented, multiple chip module (CM) that is mounted to a printed circuit board. The MCM operates at ultra high frequencies and very high temperatures. Each component of the MCM has a heatsink, a thermal plate, and a series of mounting clips and screws which combine to dissipate heat. The heatsinks and thermal plates generate most of the electromagnetic interference (EMI) since they are not attached or grounded to the board. A series of alignment posts extend from the board and are used to individually and slidably mount each of the components to the board. Each thermal plate is grounded to the posts with grounding clips. The clips maintain contact with the thermal plate through wiping elements. Additional pressure is applied to the wiping elements through a post retaining bracket. The components are fully seated and retained in position with retaining cams.

Abstract: A multi-port LAN switch is provided that enables attached network devices to both communicate directly and to insert into a token-ring network through an attached concentrator. Each port of the multi-port LAN switch has a first transformer, a second transformer, and a switching system. The first transformer has a first winding connected to a first connection of the port. The second transformer has a first winding connected to a second connection of the port. The switching system switches to a port mode or an adapter mode as a function of a mode signal transmitted to the port. In the adapter mode, the switching system connects a second winding of the first transformer to a transmitter circuit in the port, and its connects a second winding of the second transformer to a receiver circuit in the port.