Abstract: A barrier layer capacitor and a process for producing that capacitor: A central reduction layer formed of ceramic material is produced with a rectangular cross-section. A reoxidation layer is formed on all of the surfaces and is removed from one of the surfaces. Grooves are formed in opposite surfaces, including the one from which the reoxidation layer has been removed. A metal layer is applied around the entire capacitor body, except on the surface from which the reoxidation layer has been removed. Narrow strips are removed from the metal layer on the sides adjacent the surface without the reoxidation layer and at a location slightly away from that reoxidation layer free surface. On the reoxidation layer free surface, a connection coating is applied which extends up to the unremoved portion of the solderable metal coating. The capacitor may be cut from an elongated bar.

Abstract: The disclosure concerns a tubular capacitor having a relatively thin tube of dielectric material with metal layers formed on the outer and inner surfaces for forming the capacitor plates. A connecting cap is pushed over the outer layer and is connected electrically with one wire leading out of the capacitor. Another connecting wire extends into the tube and includes a widened portion that is engaged with or extends toward the inner layer. The widened portion is opposed to the pressure on the tube by the connecting cap. Insulation is provided in the exterior of the capacitor between the end of the wire and the connecting cap.

Abstract: The disclosure concerns a capacitive network and also concerns the individual metal layer carrying dielectric layers of which the capacitive network is comprised. Each dielectric layer is comprised of a flat plate having one or two rows of metal layers printed on one surface of it. At least one or perhaps both of the opposite edges of the dielectric layers are formed with grooves or incisions that define respective electric contact areas. There is a respective row of metal layers on the dielectric layer for each edge with grooves. Each metal layer is shaped to have a respective lead portion that extends toward a respective adjacent groove. The lead portions from the metal layers extend toward a first set of alternate grooves, leaving the second alternate set of contact areas not receiving an electric lead of that dielectric layer.