Patents by Inventor Rudolf Kogler

Rudolf Kogler has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer chuck and processing arrangement
    Patent number: 11387081
    Abstract: According to various embodiments, a wafer chuck may include at least one support region configured to support a wafer in a receiving area; a central cavity surrounded by the at least one support region configured to support the wafer only along an outer perimeter; and a boundary structure surrounding the receiving area configured to retain the wafer in the receiving area.
    Type: Grant
    Filed: February 24, 2020
    Date of Patent: July 12, 2022
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Rudolf Kogler, Juergen Steinbrenner, Wolfgang Dastel, Harald Huetter, Markus Kahn
  • WAFER CHUCK AND PROCESSING ARRANGEMENT
    Publication number: 20200251314
    Abstract: According to various embodiments, a wafer chuck may include at least one support region configured to support a wafer in a receiving area; a central cavity surrounded by the at least one support region configured to support the wafer only along an outer perimeter; and a boundary structure surrounding the receiving area configured to retain the wafer in the receiving area.
    Type: Application
    Filed: February 24, 2020
    Publication date: August 6, 2020
    Inventors: Rudolf KOGLER, Juergen STEINBRENNER, Wolfgang DASTEL, Harald HUETTER, Markus KAHN
  • Wafer chuck and processing arrangement
    Patent number: 10629416
    Abstract: According to various embodiments, a wafer chuck may include at least one support region configured to support a wafer in a receiving area; a central cavity surrounded by the at least one support region configured to support the wafer only along an outer perimeter; and a boundary structure surrounding the receiving area configured to retain the wafer in the receiving area.
    Type: Grant
    Filed: January 23, 2017
    Date of Patent: April 21, 2020
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Rudolf Kogler, Juergen Steinbrenner, Wolfgang Dastel, Harald Huetter, Markus Kahn
  • WAFER CHUCK AND PROCESSING ARRANGEMENT
    Publication number: 20180211821
    Abstract: According to various embodiments, a wafer chuck may include at least one support region configured to support a wafer in a receiving area; a central cavity surrounded by the at least one support region configured to support the wafer only along an outer perimeter; and a boundary structure surrounding the receiving area configured to retain the wafer in the receiving area.
    Type: Application
    Filed: January 23, 2017
    Publication date: July 26, 2018
    Inventors: Rudolf Kogler, Juergen Steinbrenner, Wolfgang Dastel, Harald Huetter, Markus Kahn