Abstract: A method is proposed for controlling a reactive sputtering process wherein the working point on the physical characteristic curves, cathode voltage or working current intensity over reactive gas flow to the sputtering apparatus, defined by the value of one of the two factors determining the electrical power drain of the reactive sputtering process, is adjusted and maintained constant by metering the reactive gas, for example O.sub.2, to the process chamber. Further, the invention proposes a device for the practice of the method, wherein a sputtering apparatus is provided, comprising a controller 5 (reactive gas controller) and a control valve 8 for metering the reactive gas. Further, a signal line 15 is provided which carries the cathode voltage to the input of the controller in which the output of the controller is connected to the control valve via a line 16 which supplies the adjusting magnitude computed in the controller to the control valve.

Abstract: The invention relates to a microwave-enhanced sputtering configuration. In this sputtering configuration a magnetron cathode is disposed in a housing whose target opposes a substrate. At both sides of the target is provided in each instance a microwave inlet comprising a waveguide coupled with a cavity resonator. The waveguide is implemented so that the microwave extends parallel to the target surface. Around the target is looped a first magnet coil generating a first magnetic field, while around an L-shaped end of the waveguide is looped a second magnet coil.

Abstract: A microwave ring resonator surrounds a cathode target and feeds microwaves to a plasma volume over the target through a slit system in such a way that the waves do not pass through the cathode dark space.

Abstract: The invention relates to an arrangement for generating a plasma by means of cathode sputtering. This arrangement comprises a magnetron and a target with shielding metal sheets. About these shielding metal sheets are wound two coils with a common center axis of which the one coil is connected to a dc power source and the other coil to a high-frequency source. Through the cooperation of the fields of both coils result helicon or whistler waves.

Abstract: The invention relates to a device for generating a plasma by means of cathode sputtering and microwave irradiation. This device comprises a magnetron cathode over which is placed a microwave cavity resonator at the atmosphere side. At the vacuum side the device comprises laterally delimiting shielding sheets which on their inside are provided with a magnet which generates a magnetic field perpendicular to the surface of the target of the magnetron cathode.

Abstract: Substrate holders (16) having approximately plate-like, parallelepipedal configuration which can be moved in the vertical position along a given transport path through coating stations. The substrate holder (16) has frame-shaped sides parts (16a, 16b) disposed in parallel planes, in whose window-like openings (25, 26) the substrates (22, 23) are received. Wiping contacts (29, 29a and 30, 30a) are provided on stationary mountings (27, 28) and their resilient ends make contact with the electrically conductive coating (22a, 23a) upon movement through the station, and an electrical circuit can be closed briefly through these wiping contacts (29, 29a and 30, 30a) and the coating (22a, 23a), producing a heating and tempering of the material of the coating.

Abstract: A pair of magnetron cathodes in an evacuable coating chamber are each connected to an ungrounded output of an A.C. power supply. The discharge voltage of at least one of the cathodes is measured and the flow of reactive gas into the chamber is controlled so that the measured voltage is identical to a desired voltage.

Abstract: In an apparatus for coating a substrate (1) with electrically conductive materials (2), comprising a direct-current and/or an alternating-current source (10 and 38, respectively), which is connected to an electrode disposed in an evacuable coating chamber (15, 15a, 15b) electrically connected with a target (3, 32) which is sputtered and whose sputtered particles deposit themselves on the substrate (1), a process gas can be put into the coating chamber (15, 15a, 15b), toroidal magnetic fields pass through the target and their lines of force issue from the surface of the target (3) at the magnet poles, the target (3) has a substantially elongated, flat, oval shape and is furthermore surrounded by a dark-space shield (34) whose circumferential edge facing the substrate (1) slightly overreaches the front surface of the cathode tub (4), while the magnet system held on a yoke (6) and disposed in the cathode tub (4) is formed of a middle series of narrow magnets (8) extending in the direction of the length of the ta

Abstract: A device for coating a substrate 1 with electrically conductive materials 2 includes a direct current and/or alternating current source 10, 38 which is connected to an electrode 44 disposed in an evacuable coating chamber 15, 15a, 15b and electrically connected to a target 43 which is to be sputtered and the sputtered particles of which are deposited on the substrate a process gas can be introduced into the coating chamber 15, 15a, 15b and wherein toroidal magnetic fields penetrate the target and the magnetic flux lines thereof exit from the surface of the target in the area of the magnetic poles 45, 46, 47. The target 43 has essentially an oval layout enclosed by a dark space shield 34 having circumferential front 35 which faces the substrate 1 and is slightly set back behind the front of the target 34.

Abstract: The invention relates to a microwave cathode sputtering arrangement in which a cathode is disposed opposite a substrate. In the immediate vicinity of the substrate is located at least one magnetic field whose strength leads to an electron cyclotron resonance.

Abstract: In an apparatus for etching substrates (18) with a luminous discharge in a vacuum, containing a vacuum chamber (13), a substrate holder (17), an electrode (20, 21, 22) and a radiofrequency generator (24) whose output is connected on the one hand to the substrate holder and on the other hand to the electrode (20, 21, 22, 28), the electrode (20) opposite the substrate (17) and at least partially surrounded by a pot-like, grounded shield (23) is provided in the marginal zone with a projection rim (22) which is at the same potential and which spans the space between the electrode and the substrate (18) or substrate holder (17) except for a gap, while on the circumferential bottom margin of the approximately cylindrical projection rim (22) of the diode (20) a diaphragm ring (28) is provided which extends radially inwardly in a plane parallel to the substrate (18).

Abstract: The invention relates to an apparatus for coating a substrate (1) with dielectrics which has a dc current source (10) connected to an electrode (5) which is connected to a target (3) which is being sputtered. The sputtered particles of the target (3) form a compound with an introduced substance which is deposited on the substrate (1). Permeating the target (3) are toroidal maganetic fields whose field lines emerge in the region of magnetic poles from the surface of the target (3). Under the invention an ac voltage source (30) is provided whose output voltage is superimposed on the dc voltage of the dc current source (10). Here, the electrical output of the ac current source (30) which is supplied to the electrode (5) corresponds to 5% to 25% of the output supplied by the dc current source (10) to the electrode (5).