Abstract: The invention features and methods and compositions for oxide production on a Copper substrate, e.g., a Copper or Copper alloy substrate, to provide for improved adhesion of Copper substrate to polymeric material, e.g., such as used in manufacture of printed circuit boards. The oxide-producing compositions of the invention, which may be either acidic or ammoniacal, comprise 1) a source of Cu++ (Cupric) ions; 2) a source of a primary electrolyte that is non-interactive with Copper ions; 3) a Cuprous ligand, e.g., a halide ion, preferably chloride, which also serves as a secondary electrolyte; and 4) an optional organic. Acidic oxide-producing compositions comprise a strong acid as the primary electrolyte. The primary electrolyte of ammoniacal oxide-producing compositions is a non-interactive, ammonium salt of acid, which provides a highly soluble Cupric ammonium salt. The secondary electrolyte of the oxide-producing compositions is selected so as to be compatible with the primary electrolyte.

Abstract: The invention features and methods and compositions for oxide production on a Copper substrate, e.g., a Copper or Copper alloy substrate, to provide for improved adhesion of Copper substrate to polymeric material, e.g., such as used in manufacture of printed circuit boards. The oxide-producing compositions of the invention, which may be either acidic or ammoniacal, comprise 1) a source of Cu++ (Cupric) ions; 2) a source of a primary electrolyte that is non-interactive with Copper ions; 3) a Cuprous ligand, e.g., a halide ion, preferably chloride, which also serves as a secondary electrolyte; and 4) an optional organic. Acidic oxide-producing compositions comprise a strong acid as the primary electrolyte. The primary electrolyte of ammoniacal oxide-producing compositions is a non-interactive, ammonium salt of acid, which provides a highly soluble Cupric ammonium salt. The secondary electrolyte of the oxide-producing compositions is selected so as to be compatible with the primary electrolyte.

Abstract: The present invention provides methods and compositions for use in recovery of metal from waste solutions minimally comprising tin as a dispersed insoluble oxide and iron as ferric ion. In general, the invention involves increasing the pH of the waste solution using a strong alkali to solubilize the tin, and adding a complexing agent(s) for other metal ionsin the solution, e.g., ferric ion, and/or cupric ion, and/or plumbous ion, so as to maintain the iron and other metal ions in a soluble state in the treated waste solution. The treated waste solution can then be used in an electroplating system to recover the tin and other metals. The electroplated, treated waste solution that is produced after tin recovery is environmentally safe, and, after pH adjustment, can generally be disposed of in most sanitary sewage systems.

Abstract: A method to remove solder flux residues from assembled or partially assembled electronic circuit boards employs a composition containing a nonpolar component consisting essentially of terpenes and/or terpenols, a polar component consisting essentially of a polar aprotic solvent or a mixture of polar aprotic solvents, and a surfactant. Use of this composition results in shorter cleaning times at lower temperatures with superior results.

Abstract: Black, brown, and red oxide layers having high adhesion and peel strength are formed on printed circuit boards by adding a suitable amphipathic anionic surfactant to standard oxidizing solutions. The oxide layers thus formed result in multilayer circuit boards having reduced tendency to delaminate.

Abstract: The adhesion of organic chemicals to metal surfaces is enhanced by treating the metal surface with a composition comprising an etching component, a quaternary ammonium cationic surfactant, and a solubilizing secondary surfactant.