Abstract: Previously, hook-up wires were glued to a mounting board by means of spot gluing. As disclosed herein, the insulated hook-up wire is first continuously coated with a coating of hot-melt adhesive and is then placed on the mounting board and simultaneously bonded by means of a heated laying tip of an application tool, similar to a soldering bit. When passing through the laying tip, the hook-up wire is briefly heated, whereby the coating of hot-melt adhesive is melted. The insulating layer of the hook-up wire has a higher temperature stability and is thereby not altered. In the immediately following application of the hook-up wire to the mounting board, the hot-melt adhesive cools and connects the hook-up wire to the mounting board.