Abstract: A device and method for plasma coating printed circuit boards populated with components are disclosed. A workpiece carrier that is already conventional in electronics manufacturing for holding the printed circuit boards during a plasma coating may be inserted into a sealable chamber, and a plasma coating process may be performed in the chamber, with the printed circuit boards mounted in the workpiece carrier. In this manner, process steps during loading are not only saved, but substantial costs can be avoided, e.g., with respect to the typical cleaning processes.

Abstract: The printing template (2) of an SMT process includes a metallic template body (2a) with clearances (3) corresponding to a desired printing structure. A printing material is to be applied through these clearances (3) to a plate that is to be joined onto the printing template from below. To prevent the printing material from adhering in the region of the clearances (3), the metallic template body (2a) is to be provided with a thin coating (6) of a metal-alkoxide coating material, the surface energy of which is reduced by chemical bonding of at least one organic component. The coating may be performed in particular by means of a sol-gel process.