Patents by Inventor Rudolph F. Mutter
Rudolph F. Mutter has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11751338Abstract: A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation with the mold forming part of the finished product, e.g. providing heat sink fins or a surface mount solderable surface. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features such as registration features accurately locating the circuit board within the mold cavity, interlocking contours for structural integrity of the singulated module, contours to match component shapes and sizes enhancing heat removal from internal components and reducing the required volume of encapsulant, clearance channels providing safety agency spacing and setbacks for the interconnects.Type: GrantFiled: March 28, 2022Date of Patent: September 5, 2023Assignee: Vicor CorporationInventors: Patrizio Vinciarelli, Michael B. LaFleur, Sean Timothy Fleming, Rudolph F. Mutter, Andrew T. D'Amico
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Patent number: 11336167Abstract: Encapsulated electronic modules having complex contact structures may be formed by encapsulating panels containing a substrate comprising pluralities of electronic modules delineated by cut lines and having conductive interconnects buried within terminal holes and other holes drilled in the panel within the boundaries of the cut lines. Slots may be cut in the panel along the cut lines. The interior of the holes, as well as surfaces within the slots and on the surfaces of the panel may be metallized, e.g. by a series of processes including plating. Solder may be dispensed into the holes for surface mounting. Two or more panels may be stacked prior to singulation to form module stacks. Delivering power vertically to semiconductor dies is described using multi-cell converters having a relatively large cell and output terminal pitch. Translation interconnections may be provided in a semiconductor package substrate, a system PCB, or in an interconnection module.Type: GrantFiled: March 27, 2020Date of Patent: May 17, 2022Assignee: Vicor CorporationInventors: Patrizio Vinciarelli, Rudolph F. Mutter
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Patent number: 11324107Abstract: Electronic modules having complex contact structures may be formed by encapsulating panels containing pluralities of electronic modules delineated by cut lines and having conductive interconnects buried within the panel along the cut lines. Holes defining contact regions along the electronic module sidewall may be cut into the panel along the cut lines to expose the buried interconnects. The panel may be metallized, e.g. by a series or processes including plating, on selected surfaces including in the holes to form the contacts and other metal structures followed by cutting the panel along the cut lines to singulate the individual electronic models. The contacts may be located in a conductive grove providing a castellated module.Type: GrantFiled: December 6, 2019Date of Patent: May 3, 2022Assignee: Vicor CorporationInventors: Patrizio Vinciarelli, Patrick R. Lavery, Rudolph F. Mutter, Jeffery J. Kirk, Andrew T. D'Amico
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Patent number: 10791645Abstract: A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation with the mold forming part of the finished product, e.g. providing heat sink fins or a surface mount solderable surface. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features such as registration features accurately locating the circuit board within the mold cavity, interlocking contours for structural integrity of the singulated module, contours to match component shapes and sizes enhancing heat removal from internal components and reducing the required volume of encapsulant, clearance channels providing safety agency spacing and setbacks for the interconnects.Type: GrantFiled: February 14, 2020Date of Patent: September 29, 2020Assignee: VLT, Inc.Inventors: Patrizio Vinciarelli, Michael B. LaFleur, Sean Timothy Fleming, Rudolph F. Mutter, Andrew T. D'Amico
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Patent number: 10757816Abstract: A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation. The mold may be used to form part of the finished product, e.g. providing heat sink fins or a surface mount solderable surface. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area.Type: GrantFiled: June 17, 2016Date of Patent: August 25, 2020Assignee: VLT, Inc.Inventors: Patrizio Vinciarelli, Michael B. LaFleur, Sean Timothy Fleming, Rudolph F. Mutter, Andrew T. D'Amico
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Publication number: 20200253060Abstract: A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation. The mold may be used to form part of the finished product, e.g. providing heat sink fins or a surface mount solderable surface. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area.Type: ApplicationFiled: April 22, 2020Publication date: August 6, 2020Inventors: Patrizio Vinciarelli, Michael B. LaFleur, Sean Timothy Fleming, Rudolph F. Mutter, Andrew T. D`Amico
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Patent number: 10701828Abstract: A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation with the mold forming part of the finished product, e.g. providing heat sink fins or a surface mount solderable surface. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features such as registration features accurately locating the circuit board within the mold cavity, interlocking contours for structural integrity of the singulated module, contours to match component shapes and sizes enhancing heat removal from internal components and reducing the required volume of encapsulant, clearance channels providing safety agency spacing and setbacks for the interconnects.Type: GrantFiled: May 10, 2016Date of Patent: June 30, 2020Assignee: VLT, Inc.Inventors: Patrizio Vinciarelli, Michael B. LaFleur, Sean Timothy Fleming, Rudolph F. Mutter, Andrew T. D'Amico
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Patent number: 10537015Abstract: Electronic modules having complex contact structures may be formed by encapsulating panels containing pluralities of electronic modules delineated by cut lines and having conductive interconnects buried within the panel along the cut lines. Holes defining contact regions along the electronic module sidewall may be cut into the panel along the cut lines to expose the buried interconnects. The panel may be metallized, e.g. by a series or processes including plating, on selected surfaces including in the holes to form the contacts and other metal structures followed by cutting the panel along the cut lines to singulate the individual electronic models. The contacts may be located in a conductive grove providing a castellated module.Type: GrantFiled: May 3, 2018Date of Patent: January 14, 2020Assignee: VLT, Inc.Inventors: Patrizio Vinciarelli, Patrick R. Lavery, Rudolph F. Mutter, Jeffery J. Kirk, Andrew T. D'Amico
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Patent number: 10264664Abstract: Electronic modules having complex contact structures may be formed by encapsulating panels containing pluralities of electronic modules delineated by cut lines and having conductive interconnects buried within the panel along the cut lines. Holes defining contact regions along the electronic module sidewall may be cut into the panel along the cut lines to expose the buried interconnects. The panel may be metallized, e.g. by a series or processes including plating, on selected surfaces including in the holes to form the contacts and other metal structures followed by cutting the panel along the cut lines to singulate the individual electronic models. The contacts may be located in a conductive grove providing a castellated module.Type: GrantFiled: June 4, 2015Date of Patent: April 16, 2019Assignee: VLT, Inc.Inventors: Patrizio Vinciarelli, Patrick R. Lavery, Rudolph F. Mutter, Jeffery J. Kirk, Andrew T. D'Amico
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Patent number: 9516761Abstract: A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation with the mold forming part of the finished product, e.g. providing heat sink fins or a surface mount solderable surface. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features such as registration features accurately locating the circuit board within the mold cavity, interlocking contours for structural integrity of the singulated module, contours to match component shapes and sizes enhancing heat removal from internal components and reducing the required volume of encapsulant, clearance channels providing safety agency spacing and setbacks for the interconnects.Type: GrantFiled: March 2, 2015Date of Patent: December 6, 2016Assignee: VLT, Inc.Inventors: Patrizio Vinciarelli, Michael B. LaFleur, Sean Timothy Fleming, Rudolph F. Mutter, Andrew T. D'Amico
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Publication number: 20160302312Abstract: A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation. The mold may be used to form part of the finished product, e.g. providing heat sink fins or a surface mount solderable surface. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area.Type: ApplicationFiled: June 17, 2016Publication date: October 13, 2016Inventors: Patrizio Vinciarelli, Michael B. LaFleur, Sean Timothy Fleming, Rudolph F. Mutter, Andrew T. D'Amico
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Patent number: 9439297Abstract: A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation with the mold forming part of the finished product, e.g. providing heat sink fins or a surface mount solderable surface. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features such as registration features accurately locating the circuit board within the mold cavity, interlocking contours for structural integrity of the singulated module, contours to match component shapes and sizes enhancing heat removal from internal components and reducing the required volume of encapsulant, clearance channels providing safety agency spacing and setbacks for the interconnects.Type: GrantFiled: March 2, 2015Date of Patent: September 6, 2016Assignee: VLT, Inc.Inventors: Patrizio Vinciarelli, Michael B. LaFleur, Sean Timothy Fleming, Rudolph F. Mutter, Andrew T. D'Amico
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Patent number: 9402319Abstract: A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation. The mold may be used to form part of the finished product. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features. Wide cuts may be made in the molds after encapsulation reducing thermal stresses. Blank mold panels may be machined to provide some or all of the above features in an on-demand manufacturing system. Connection adapters may be provided to use the modules in vertical or horizontal mounting positions in connector, through-hole, surface-mount solder variations.Type: GrantFiled: May 11, 2012Date of Patent: July 26, 2016Assignee: VLT, Inc.Inventors: Patrizio Vinciarelli, Michael B. LaFleur, Sean Timothy Fleming, Rudolph F. Mutter, Andrew T. D'Amico
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Publication number: 20150181727Abstract: A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation with the mold forming part of the finished product, e.g. providing heat sink fins or a surface mount solderable surface. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features such as registration features accurately locating the circuit board within the mold cavity, interlocking contours for structural integrity of the singulated module, contours to match component shapes and sizes enhancing heat removal from internal components and reducing the required volume of encapsulant, clearance channels providing safety agency spacing and setbacks for the interconnects.Type: ApplicationFiled: March 2, 2015Publication date: June 25, 2015Inventors: Patrizio Vinciarelli, Michael B. LaFleur, Sean Timothy Fleming, Rudolph F. Mutter, Andrew T. D'Amico
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Publication number: 20150181719Abstract: A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation with the mold forming part of the finished product, e.g. providing heat sink fins or a surface mount solderable surface. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features such as registration features accurately locating the circuit board within the mold cavity, interlocking contours for structural integrity of the singulated module, contours to match component shapes and sizes enhancing heat removal from internal components and reducing the required volume of encapsulant, clearance channels providing safety agency spacing and setbacks for the interconnects.Type: ApplicationFiled: March 2, 2015Publication date: June 25, 2015Inventors: Patrizio Vinciarelli, Michael B. LaFleur, Sean Timothy Fleming, Rudolph F. Mutter, Andrew T. D'Amico
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Publication number: 20140355218Abstract: A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation. The mold may be used to form part of the finished product. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features. Wide cuts may be made in the molds after encapsulation reducing thermal stresses. Blank mold panels may be machined to provide some or all of the above features in an on-demand manufacturing system. Connection adapters may be provided to use the modules in vertical or horizontal mounting positions in connector, through-hole, surface-mount solder variations.Type: ApplicationFiled: May 11, 2012Publication date: December 4, 2014Applicant: VLT, INC.Inventors: Patrizio Vinciarelli, Michael B. LaFleur, Sean Timothy Fleming, Rudolph F. Mutter, Andrew T. D'Amico