Patents by Inventor Rudolph Manuel Lopez

Rudolph Manuel Lopez has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6446335
    Abstract: A method of thermal compression bonding conductors of a multiconductor flat cable or electrical component by melting through a base layer from the reverse side of a base layer supporting the conductors. The multiconductor flat cable or electrical component comprises a base layer with conductors disposed thereon and a flat cover having an opening provided therein at a bonding site, preferably by die cutting. The flat cover with the opening is laminated to the base layer, overlaying the conductors, so that the conductors are mechanically stabilized by the base layer while being exposed through the bonding opening. The shape of the multiconductor flat cable or electrical component of the present invention may be highly varied. In one embodiment, the flat multiconductor electrical component circumferentially extends around a central area, for example, totally encompassing in IC chip which may be connected to the conductors thereof at a bonding site.
    Type: Grant
    Filed: April 4, 2000
    Date of Patent: September 10, 2002
    Assignee: International Business Machines Corporation
    Inventors: Richard Lee Carlson, Bruce Dale King, Rudolph Manuel Lopez, Alex Irwin Panasiuk, George G. Zamora
  • Patent number: 6093894
    Abstract: A bonding opening exposing conductors through a cover of a multiconductor flat cable or electrical component to allow direct bonding thereof is described. The multiconductor flat cable or electrical component having a base layer with conductors disposed thereon and a flat cover having an opening provided therein at a bonding site, preferably by die cutting. The flat cover with the opening is laminated to the base layer, overlaying the conductors, so that the conductors are mechanically stabilized by the base layer while being exposed through the bonding opening. The shape of the multiconductor flat cable or electrical component of the present invention may be highly varied. In one embodiment, the flat multiconductor electrical component circumferentially extends around a central area, for example, totally encompassing in IC chip which may be connected to the conductors thereof at a bonding site.
    Type: Grant
    Filed: June 26, 1997
    Date of Patent: July 25, 2000
    Assignee: International Business Machines Corporation
    Inventors: Richard Lee Carlson, Bruce Dale King, Rudolph Manuel Lopez, Alex Irwin Panasiuk, George G. Zamora
  • Patent number: 5961343
    Abstract: Disclosed is a strain relief clamp for supporting one or more flexible ribbon cables. A first stiff member has an indentation wider than a flexible ribbon cable, and a height less than the thickness of a flexible ribbon cable. Stacked pliant members are stacked on the first stiff member. Each pliant member has an indentation on the side facing away from the first stiff member. The indentations are substantially equal in width and height to the indentation of the first stiff member. A second stiff member is located on the end of the stack opposite the first stiff member and has a protrusion at least as wide as a flexible ribbon cable facing the indentation of the adjacent pliant member. The protrusion height is such that the sum of its height and the thicknesses of the flexible ribbon cables is greater than the sum of the heights of the indentations of the first stiff member and of the stacked pliant members.
    Type: Grant
    Filed: January 26, 1998
    Date of Patent: October 5, 1999
    Assignee: International Business Machines
    Inventors: Paul Yu-Fei Hu, Rudolph Manuel Lopez