Patents by Inventor RUDOLPH TECHNOLOGIES, INC.

RUDOLPH TECHNOLOGIES, INC. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • WAFER EDGE INSPECTION
    Publication number: 20140063799
    Abstract: Wafer edge inspection approaches are disclosed wherein an imaging device captures at least one image of an edge of a wafer. The at least one image can be analyzed in order to identify an edge bead removal line. An illumination system having a diffuser can further be used in capturing images.
    Type: Application
    Filed: April 23, 2013
    Publication date: March 6, 2014
    Applicant: Rudolph Technologies, Inc.
    Inventor: Rudolph Technologies, Inc.
  • WAFER INVERSION MECHANISM
    Publication number: 20130209211
    Abstract: A BOLTS compatible module includes a support mechanism for gripping a wafer. The support mechanism is coupled to a rotary mechanism for rotating the support mechanism with a wafer grip therein. The rotary mechanism is coupled to the module and capable of at least 180° of rotation.
    Type: Application
    Filed: December 21, 2012
    Publication date: August 15, 2013
    Applicant: RUDOLPH TECHNOLOGIES, INC.
    Inventor: RUDOLPH TECHNOLOGIES, INC.