Patents by Inventor Rudolphus H. Hoefs

Rudolphus H. Hoefs has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods of attaching die to substrate using compliant die attach system having spring-driven bond tool
    Patent number: 11557567
    Abstract: A die attach system is provided. The die attach system includes: a support structure for supporting a substrate; a die supply source including a plurality of die for attaching to the substrate; and a bond head for bonding a die from the die supply source to the substrate, the bond head including a bond tool having a contact portion for contacting the die during a transfer from the die supply source to the substrate, the bond head including a spring portion engaged with the bond tool such that the spring portion is configured to compress during pressing of the die against the substrate using the contact portion of the bond tool.
    Type: Grant
    Filed: August 26, 2021
    Date of Patent: January 17, 2023
    Assignee: ASSEMBLEON BV
    Inventors: Rudolphus H. Hoefs, Roy Brewel, Richard A. Van Der Burg
  • Die attach systems, and methods of attaching a die to a substrate
    Patent number: 11410870
    Abstract: A die attach system is provided. The die attach system includes: a support structure for supporting a substrate; a die supply source including a plurality of die for attaching to the substrate; a bond head for bonding a die from the die supply source to the substrate, the bond head including a bond tool for contacting the die during a transfer from the die supply source to the substrate; a first motion system for moving the bond head along a first axis; and a second motion system, independent of the first motion system, for moving the bond tool along the first axis.
    Type: Grant
    Filed: June 21, 2021
    Date of Patent: August 9, 2022
    Assignee: ASSEMBLEON B.V.
    Inventors: Roy Brewel, Richard A. Van Der Burg, Rudolphus H. Hoefs, Wilhelmus G. Van Sprang
  • COMPLIANT DIE ATTACH TOOLS, DIE ATTACH SYSTEMS, AND METHODS OF USING THE SAME
    Publication number: 20210392802
    Abstract: A die attach system is provided. The die attach system includes: a support structure for supporting a substrate; a die supply source including a plurality of die for attaching to the substrate; and a bond head for bonding a die from the die supply source to the substrate, the bond head including a bond tool having a contact portion for contacting the die during a transfer from the die supply source to the substrate, the bond head including a spring portion engaged with the bond tool such that the spring portion is configured to compress during pressing of the die against the substrate using the contact portion of the bond tool.
    Type: Application
    Filed: August 26, 2021
    Publication date: December 16, 2021
    Inventors: Rudolphus H. Hoefs, Roy Brewel, Richard A. Van Der Burg
  • DIE ATTACH SYSTEMS, AND METHODS OF ATTACHING A DIE TO A SUBSTRATE
    Publication number: 20210313215
    Abstract: A die attach system is provided. The die attach system includes: a support structure for supporting a substrate; a die supply source including a plurality of die for attaching to the substrate; a bond head for bonding a die from the die supply source to the substrate, the bond head including a bond tool for contacting the die during a transfer from the die supply source to the substrate; a first motion system for moving the bond head along a first axis; and a second motion system, independent of the first motion system, for moving the bond tool along the first axis.
    Type: Application
    Filed: June 21, 2021
    Publication date: October 7, 2021
    Inventors: Roy Brewel, Richard A. Van Der Burg, Rudolphus H. Hoefs, Wilhelmus G. Van Sprang
  • Compliant die attach systems having spring-driven bond tools
    Patent number: 11134595
    Abstract: A die attach system is provided. The die attach system includes: a support structure for supporting a substrate; a die supply source including a plurality of die for attaching to the substrate; and a bond head for bonding a die from the die supply source to the substrate, the bond head including a bond tool having a contact portion for contacting the die during a transfer from the die supply source to the substrate, the bond head including a spring portion engaged with the bond tool such that the spring portion is configured to compress during pressing of the die against the substrate using the contact portion of the bond tool.
    Type: Grant
    Filed: September 3, 2019
    Date of Patent: September 28, 2021
    Assignee: ASSEMBLEON B.V.
    Inventors: Rudolphus H. Hoefs, Roy Brewel, Richard A. Van Der Burg
  • Die attach systems, and methods of attaching a die to a substrate
    Patent number: 11069555
    Abstract: A die attach system is provided. The die attach system includes: a support structure for supporting a substrate; a die supply source including a plurality of die for attaching to the substrate; a bond head for bonding a die from the die supply source to the substrate, the bond head including a bond tool for contacting the die during a transfer from the die supply source to the substrate; a first motion system for moving the bond head along a first axis; and a second motion system, independent of the first motion system, for moving the bond tool along the first axis.
    Type: Grant
    Filed: August 29, 2019
    Date of Patent: July 20, 2021
    Assignee: ASSEMBLEON B.V.
    Inventors: Roy Brewel, Richard A. Van Der Burg, Rudolphus H. Hoefs, Wilhelmus G. Van Sprang
  • COMPLIANT DIE ATTACH TOOLS, DIE ATTACH SYSTEMS, AND METHODS OF USING THE SAME
    Publication number: 20200077550
    Abstract: A die attach system is provided. The die attach system includes: a support structure for supporting a substrate; a die supply source including a plurality of die for attaching to the substrate; and a bond head for bonding a die from the die supply source to the substrate, the bond head including a bond tool having a contact portion for contacting the die during a transfer from the die supply source to the substrate, the bond head including a spring portion engaged with the bond tool such that the spring portion is configured to compress during pressing of the die against the substrate using the contact portion of the bond tool.
    Type: Application
    Filed: September 3, 2019
    Publication date: March 5, 2020
    Inventors: Rudolphus H. Hoefs, Roy Brewel, Richard A. Van Der Burg
  • DIE ATTACH SYSTEMS, AND METHODS OF ATTACHING A DIE TO A SUBSTRATE
    Publication number: 20200075385
    Abstract: A die attach system is provided. The die attach system includes: a support structure for supporting a substrate; a die supply source including a plurality of die for attaching to the substrate; a bond head for bonding a die from the die supply source to the substrate, the bond head including a bond tool for contacting the die during a transfer from the die supply source to the substrate; a first motion system for moving the bond head along a first axis; and a second motion system, independent of the first motion system, for moving the bond tool along the first axis.
    Type: Application
    Filed: August 29, 2019
    Publication date: March 5, 2020
    Inventors: Roy Brewel, Richard A. Van Der Burg, Rudolphus H. Hoefs, Wilhelmus G. Van Sprang