Patents by Inventor Rudolphus Hendrikus Hoefs

Rudolphus Hendrikus Hoefs has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • COMPONENT PLACEMENT SYSTEMS AND METHODS OF OPERATING THE SAME
    Publication number: 20230189493
    Abstract: A component placement system is provided. The component placement system includes: a first bond head array configured for simultaneously carrying a first plurality of electronic components; a second bond head array configured for simultaneously carrying a second plurality of electronic components; a first motion system for simultaneously carrying the first bond head array and the second bond head array along a first motion axis; and a second motion system for carrying the first bond head array independent of the second bond head array.
    Type: Application
    Filed: February 9, 2023
    Publication date: June 15, 2023
    Inventors: Roy Brewel, Rudolphus Hendrikus Hoefs, Wilhelmus Gijsbertus Leonardus Van Sprang
  • Component placement systems and methods of operating the same
    Patent number: 11612089
    Abstract: A component placement system is provided. The component placement system includes: a first bond head array configured for simultaneously carrying a first plurality of electronic components; a second bond head array configured for simultaneously carrying a second plurality of electronic components; a first motion system for simultaneously carrying the first bond head array and the second bond head array along a first motion axis; and a second motion system for carrying the first bond head array independent of the second bond head array.
    Type: Grant
    Filed: December 3, 2021
    Date of Patent: March 21, 2023
    Assignee: Assembleon B.V.
    Inventors: Roy Brewel, Rudolphus Hendrikus Hoefs, Wilhelmus Gijsbertus Leonardus Van Sprang
  • POSITIONAL ERROR COMPENSATION IN ASSEMBLY OF DISCRETE COMPONENTS BY ADJUSTMENT OF OPTICAL SYSTEM CHARACTERISTICS
    Publication number: 20220236557
    Abstract: A method includes determining an alignment error between a discrete component of a discrete component assembly mounted in a laser-assisted transfer system and a target position on a target substrate, the discrete component assembly including the discrete component adhered to a support by a dynamic release layer; based on the alignment error, determining a beam offset characteristic; and providing a signal indicative of the beam offset characteristic to an optical element of the laser-assisted transfer system, the optical element being configured to adjust a position of a beam pattern relative to the discrete component according to the beam offset characteristic.
    Type: Application
    Filed: June 11, 2020
    Publication date: July 28, 2022
    Inventors: Matthew R. Semler, Samuel Brown, Rudolphus Hendrikus Hoefs
  • COMPONENT PLACEMENT SYSTEMS AND METHODS OF OPERATING THE SAME
    Publication number: 20220183198
    Abstract: A component placement system is provided. The component placement system includes: a first bond head array configured for simultaneously carrying a first plurality of electronic components; a second bond head array configured for simultaneously carrying a second plurality of electronic components; a first motion system for simultaneously carrying the first bond head array and the second bond head array along a first motion axis; and a second motion system for carrying the first bond head array independent of the second bond head array.
    Type: Application
    Filed: December 3, 2021
    Publication date: June 9, 2022
    Inventors: Roy Brewel, Rudolphus Hendrikus Hoefs, Wilhelmus Gijsbertus Leonardus Van Sprang