Patents by Inventor Rudong Shi

Rudong Shi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11821842
    Abstract: An apparatus that includes a module for use in installing a heatsink, the module comprising a fastener, a first indicator member comprising a first visual indicator surface, and a second indicator member comprising a second visual indicator surface, the first and second indicator members defining an opening for receiving the fastener. The first visual indicator surface is visible when the fastener is not fully installed and the second visual indicator surface is visible when the fastener is fully installed. A method for installing the heatsink with the module is also disclosed herein.
    Type: Grant
    Filed: January 10, 2022
    Date of Patent: November 21, 2023
    Assignee: CISCO TECHNOLOGY, INC.
    Inventors: Le Gao, Yang Sun, Rudong Shi, Bruce Chen
  • Publication number: 20230038672
    Abstract: One or more processors of a computing system, such as a server architecture, such as a disaggregated server architecture. The one or more processors are to access cable information pertaining to a cable coupled to an I/O port of the computing system. The one or more processors are to configure a first memory circuitry of the computing system based on the cable information. A cable structure includes the cable, and further includes a second memory circuitry storing the cable information, and accessible by the one or more processors.
    Type: Application
    Filed: October 25, 2022
    Publication date: February 9, 2023
    Applicant: Intel Corporation
    Inventors: Nan Wang, Zhiming Li, Rudong Shi, Francisco Javier Lasa Gutierrez
  • Publication number: 20220128482
    Abstract: An apparatus that includes a module for use in installing a heatsink, the module comprising a fastener, a first indicator member comprising a first visual indicator surface, and a second indicator member comprising a second visual indicator surface, the first and second indicator members defining an opening for receiving the fastener. The first visual indicator surface is visible when the fastener is not fully installed and the second visual indicator surface is visible when the fastener is fully installed. A method for installing the heatsink with the module is also disclosed herein.
    Type: Application
    Filed: January 10, 2022
    Publication date: April 28, 2022
    Inventors: Le Gao, Yang Sun, Rudong Shi, Bruce Chen
  • Patent number: 11268909
    Abstract: In one embodiment, an apparatus includes a module for use in installing a heatsink, the module comprising a fastener, a first indicator member comprising a first visual indicator surface, and a second indicator member comprising a second visual indicator surface, the first and second indicator members defining an opening for receiving the fastener. The first visual indicator surface is visible when the fastener is not fully installed and the second visual indicator surface is visible when the fastener is fully installed. A method for installing the heatsink with the module is also disclosed herein.
    Type: Grant
    Filed: October 23, 2018
    Date of Patent: March 8, 2022
    Assignee: CISCO TECHNOLOGY, INC.
    Inventors: Le Gao, Yang Sun, Rudong Shi, Bruce Chen
  • Publication number: 20200124540
    Abstract: In one embodiment, an apparatus includes a module for use in installing a heatsink, the module comprising a fastener, a first indicator member comprising a first visual indicator surface, and a second indicator member comprising a second visual indicator surface, the first and second indicator members defining an opening for receiving the fastener. The first visual indicator surface is visible when the fastener is not fully installed and the second visual indicator surface is visible when the fastener is fully installed. A method for installing the heatsink with the module is also disclosed herein.
    Type: Application
    Filed: October 23, 2018
    Publication date: April 23, 2020
    Applicant: CISCO TECHNOLOGY, INC.
    Inventors: Le Gao, Yang Sun, Rudong Shi, Bruce Chen
  • Publication number: 20190269040
    Abstract: The embodiments herein describe a function module that is removably mounted in a chassis. For example, the chassis may be a server chassis which stores a plurality of blade servers which uses hardware components and a fan module mounted in the function module to increase the storage capacity or computing performance of the blade servers. The function module can include PCIe cards, GPU cards, hard drives, and the like which are communicatively coupled to the blade servers in the chassis. In one embodiment, the function module is slidably mounted onto the chassis so that when pulled by the system administrator, the function module slides out of a front or rear side of the chassis. Doing so provides room for the system administrator to then add and/or remove the hardware components and the fan module mounted in the function module.
    Type: Application
    Filed: February 28, 2018
    Publication date: August 29, 2019
    Inventors: Le GAO, Yang SUN, Rudong SHI, Na FENG
  • Publication number: 20190075158
    Abstract: A network interface controller configured to be hosted by a first server, includes: a first input/output (IO) port configured to be coupled to a network switch; a second IO port configured to be coupled to a corresponding IO port of a second network interface controller of a second server; and a third IO port configured to be coupled to a corresponding IO port of a third network interface controller of a third server.
    Type: Application
    Filed: September 6, 2017
    Publication date: March 7, 2019
    Inventors: Yang Sun, Jayaprakash Balachandran, Rudong Shi, Bidyut Kanti Sen