Abstract: A radiation modulator for a lithography apparatus, a lithography apparatus, a method of modulating radiation for use in lithography, and a device manufacturing method is disclosed. The radiation modulator for a lithography apparatus may have a plurality of waveguides supporting propagation therethough of radiation having a wavelength less than 450 nm; and a modulating section configured to individually modulate radiation propagating in each of the waveguides in order to provide a modulated plurality of output beams.

Abstract: A radiation modulator for a lithography apparatus, a lithography apparatus, a method of modulating radiation for use in lithography, and a device manufacturing method is disclosed. The radiation modulator for a lithography apparatus may have a plurality of waveguides supporting propagation therethough of radiation having a wavelength less than 450 nm; and a modulating section configured to individually modulate radiation propagating in each of the waveguides in order to provide a modulated plurality of output beams.

Abstract: A lithographic apparatus having a table including a target and/or a sensor and a liquid displacing device to displace liquid from the target and/or sensor using a localized gas flow is disclosed. The liquid displacement device may be positioned at various positions, e.g. mounted to a liquid handling device at an exposure station, adjacent or in a transfer path between the exposure station and a measurement station, at a load/unload station or adjacent a sensor.

Abstract: According to a first aspect of the invention, there is provided a lithographic method of providing an alignment mark on a layer provided on a substrate, the method including providing the alignment mark on an area of the layer which is oriented within a certain range of angles with respect to a surface of the substrate on which the layer is provided.

Abstract: A lithographic apparatus having a table including a target and/or a sensor and a liquid displacing device to displace liquid from the target and/or sensor using a localized gas flow is disclosed. The liquid displacement device may be positioned at various positions, e.g. mounted to a liquid handling device at an exposure station, adjacent or in a transfer path between the exposure station and a measurement station, at a load/unload station or adjacent a sensor.

Abstract: A method of producing a T-gate in a single stage exposure process using electromagnetic radiation is disclosed.

Abstract: A lithographic method includes patterning a beam of radiation with a patterning device. The patterning device includes at least two image patterning portions and at least two metrology mark patterning portions. The method also includes projecting at least two image portions of the patterned beam of radiation sequentially onto target portions of a substrate such that the projected image portions are substantially adjacent to each other on the substrate and collectively form a composite image on the substrate. The method also includes projecting a metrology mark onto the substrate outside of the area of the composite image at the same time as projecting each of at least two of the image portions, and measuring the alignment of the metrology marks to determine the relative positions of the at least two image portions.

Abstract: A lithographic apparatus having a table including a target and/or a sensor and a liquid displacing device to displace liquid from the target and/or sensor using a localized gas flow is disclosed. The liquid displacement device may be positioned at various positions, e.g. mounted to a liquid handling device at an exposure station, adjacent or in a transfer path between the exposure station and a measurement station, at a load/unload station or adjacent a sensor.

Abstract: A method for lithographically applying a pattern to a substrate involves obtaining temperature as a function of time during a post exposure bake for one or more locations on a substrate coated with a layer of chemically amplified resist. A relationship between radiation dosage directed onto the chemically amplified resist and post-exposure concentration of accelerant generated in the chemically amplified resist layer by the radiation dosage is also obtained. Using a model relating the critical dimension to post-exposure concentration of accelerant, and temperature as a function of time across the one or more locations, a radiation dosage to obtain a specified critical dimension for the patterned substrate can be calculated. A substrate can be patterned using the calculated radiation dosage for each one or more location on the substrate such that a specified critical dimension is obtained. An apparatus and controller for putting the method into effect are also disclosed.

Abstract: According to an aspect of the present invention, there is provided a lithographic apparatus that includes a substrate carrier arranged to hold a substrate in position using an electrostatic force. The substrate carrier is provided with an integral power source. The apparatus also includes a substrate table for holding the substrate carrier.

Abstract: According to a first aspect of the invention, there is provided a lithographic method of providing an alignment mark on a layer provided on a substrate, the method including providing the alignment mark on an area of the layer which is oriented within a certain range of angles with respect to a surface of the substrate on which the layer is provided.

Abstract: A lithographic alignment apparatus includes a radiation source arranged to generate radiation at a wavelength of 1000 nanometers or longer, and a plurality of non-imaging detectors arranged to detect the radiation after the radiation has been reflected by an alignment mark.

Abstract: A method is disclosed that includes introducing a substrate into a pre-aligner of a lithographic apparatus, using a detector to measure the location of an alignment mark provided on a side of the substrate which is opposite to the location of the detector, and after measurement, putting the substrate onto a substrate table of the lithographic apparatus, the substrate being positioned on the substrate table such that the alignment mark provided on the opposite side of the substrate is visible through a window of the substrate table.

Abstract: A second substrate, e.g. a III/V compound semiconductor, is placed on a first substrate, e.g. a wafer, in the vicinity of placement marks on the first substrate. The second substrate is exposed to patterned radiation, e.g. for the manufacture of integrated circuits.

Abstract: In an embodiment, a ring seal forming apparatus is disclosed, the apparatus including a substrate holder arranged to hold a substrate coated at least in part with resist, and a deep ultraviolet radiation outlet configured to irradiate an area of the resist, relative movement between the substrate holder and the deep ultraviolet radiation outlet being possible, the movement being arranged such that, in use of the apparatus, the area of resist irradiated by the deep ultraviolet radiation outlet is ring-shaped.

Abstract: A lithographic method includes patterning a beam of radiation with a patterning device. The patterning device includes at least two image patterning portions and at least two metrology mark patterning portions. The method also includes projecting at least two image portions of the patterned beam of radiation sequentially onto target portions of a substrate such that the projected image portions are substantially adjacent to each other on the substrate and collectively form a composite image on the substrate. The method also includes projecting a metrology mark onto the substrate outside of the area of the composite image at the same time as projecting each of at least two of the image portions, and measuring the alignment of the metrology marks to determine the relative positions of the at least two image portions.

Abstract: A device for locally treating a substrate is disclosed. The device includes an enclosure for forming an enclosed environment at a location on the substrate, a seal for sealing the enclosed environment between the enclosure and the substrate, a supply channel for supplying a chemical reactant to the location, and a removal channel for removing a chemical from the enclosed environment.