Abstract: According to the preferred exemplary embodiments of the present invention, a transmission line, such as microstrip, is connected to a waveguide using suspended stripline as an intermediate connection. This method results is a very low-loss transition, suitable for active microwave device applications such as low-noise receivers and transmitting devices such as power amplifiers.

Abstract: According to the preferred exemplary embodiments of the present invention, a transmission line, such as microstrip, is connected to a waveguide using suspended stripline as an intermediate connection. This method results is a very low-loss transition, suitable for active microwave device applications such as low-noise receivers and transmitting devices such as power amplifiers.

Abstract: A monolithic, software-definable, power amplifier is provided. According to one embodiment of the invention, power amplifier circuits can be tuned to the most efficient power amplification characteristics as determined by a digital microprocessor based on varying data. The data may relate to user density, carrier frequency and spectral band. The power amplifier circuits may also be formed on semiconductor structures that include monocrystalline silicon substrates and layers of monocrystalline compound semiconductors. In these structures, the power amplifier may be integrated in a single integrated circuit wherein portions of the power amplifier circuits may be formed on the silicon substrate and portions may be formed on the compound semiconductor. This configuration may substantially increase efficiency of the integrated power amplifier according to the invention.

Abstract: A waveguide feed is fabricated by first creating a lead frame (10) from a piece of conductive material. The lead frame (10) is shaped by bending arms (22) and probe portions (18) on the lead frame (10) into a desired shape. The lead frame (10) is then placed in a mold and dielectric molding material is added around relevant portions of the lead frame (10). After the dielectric molding material has solidified, excess molding material and extraneous portions of the lead frame (10) are removed from the molded feed assembly. The assembly can then be connectorized and inserted into a waveguide.