Abstract: An apparatus includes a pick and place system with a bonding head, picking head and support table. The picking head and support table are mounted on a carriage. The apparatus can be operated in a direct mode and a parallel mode. In the direct mode the carriage is in a first position (parked). A control unit operates the pick and place system to cause the bonding head to move a series of semiconductor chips from the wafer table to the substrate. In the parallel mode, the carriage is in a second position. The control unit operates the picking head, support table and pick and place system to repeatedly cause the picking head to move a semiconductor chip from the wafer table to the support table and the bonding head to move said semiconductor chip from the support table to the substrate.

Abstract: A device for dispensing adhesive on a substrate comprises a writing head with a first dispensing nozzle and at least one second dispensing nozzle. The device can be operated in two operating modes and is configured to perform the following steps for the change from the one operating mode to the other operating mode: —lifting of the writing head, retracting or extending a pin, and lowering of the writing head to a predetermined working altitude, wherein the tips of the dispensing nozzles reach a substantially similar altitude above the substrate in the retracted state of the pin, and wherein the tip of the at least one second dispensing nozzle reaches a higher altitude above the substrate than the tip of the first dispensing nozzle in the extended state of the pin.

Abstract: A device for dispensing adhesive on a substrate comprises a writing head with a first dispensing nozzle and at least one second dispensing nozzle. The device can be operated in two operating modes and is configured to perform the following steps for the change from the one operating mode to the other operating mode: lifting of the writing head, retracting or extending a pin, and lowering of the writing head to a predetermined working altitude, wherein the tips of the dispensing nozzles reach a substantially similar altitude above the substrate in the retracted state of the pin, and wherein the tip of the at least one second dispensing nozzle reaches a higher altitude above the substrate than the tip of the first dispensing nozzle in the extended state of the pin.

Abstract: An apparatus includes a pick and place system with a bonding head, picking head and support table. The picking head and support table are mounted on a carriage. The apparatus can be operated in a direct mode and a parallel mode. In the direct mode the carriage is in a first position (parked). A control unit operates the pick and place system to cause the bonding head to move a series of semiconductor chips from the wafer table to the substrate. In the parallel mode, the carriage is in a second position. The control unit operates the picking head, support table and pick and place system to repeatedly cause the picking head to move a semiconductor chip from the wafer table to the support table and the bonding head to move said semiconductor chip from the support table to the substrate.

Abstract: An apparatus for mounting semiconductor chips as flip chips on a substrate includes a chip supply, a pick-and-place system with a bonding head having a chip gripper, a flipping apparatus operable to rotate the chip from a first position to a second (flipped) position through an angle with a gripper and two cameras. The first camera determines a position of the chip before the flipping apparatus receives the chip and also determines a position of the flipped chip received by the chip gripper of the bonding head once the flipping apparatus has transferred the chip to it. The apparatus also comprises an optical switch, e.g., a rotatable mirror located in the field of view of the first camera. The mirror operates to rotate with the gripper of the flipping apparatus but at half the angle.

Abstract: The invention relates to an apparatus for mounting semiconductor chips as flip chip on a substrate. The apparatus comprises means for supplying the semiconductor chips, a pick-and-place system with a bonding head with a chip gripper, a flipping apparatus with a gripper and two cameras. The first camera is used for determining the actual position of the semiconductor chip that is provided by the said means for mounting before the flipping apparatus receives the semiconductor chip, and it is used to determine the actual position of the flip chip received by the chip gripper of the bonding head once the flipping apparatus has transferred the semiconductor chip. The apparatus comprises an optical switch in accordance with the invention, e.g., a rotatably held mirror which is located in the field of view of the first camera. In operation, the mirror is rotated simultaneously with the gripper of the flipping apparatus, but only by half the angle.

Abstract: The present invention relates to a method and a device for wetting the bumps of a semiconductor chip with a soldering flux, in which a container, which accommodates the soldering flux and is open on the bottom, and a base plate, which contains at least one cavity, are moved back-and-forth in relation to one another on one side of the cavity to the other side of the cavity. The viewed in the movement direction front wall of the container is lifted up during the relative movement, so that it is located at a distance above the base plate. The distance is somewhat greater than the height difference by which the soldering flux projects above the level of the surface of the base plate. This measure has the effect that the front wall of the container does not convey any soldering flux onto the base plate, which has caused the loss of this soldering flux until now.

Abstract: The invention concerns a method for mounting a semiconductor chip with bumps on one surface onto a substrate location of a substrate, whereby the bumps are brought into contact with corresponding pads on the substrate location. Reference marks are attached to the bondhead that enable measurement of the actual position of the semiconductor chip as well as measurement of the actual position of the substrate location in relation to a system of coordinates defined by the reference marks. Positional displacement of the individual components of the assembly machine caused by thermal influences can be compensated without perpetual calibration procedures having to be carried out.

Abstract: The invention concerns a method for mounting a semiconductor chip with bumps on one surface onto a substrate location of a substrate, whereby the bumps are brought into contact with corresponding pads on the substrate location. Reference marks are attached to the bondhead that enable measurement of the actual position of the semiconductor chip as well as measurement of the actual position of the substrate location in relation to a system of coordinates defined by the reference marks. Positional displacement of the individual components of the assembly machine caused by thermal influences can be compensated without perpetual calibration procedures having to be carried out.

Abstract: An apparatus for placing a semiconductor chip as a flipchip on a substrate has a flip device for flipping the semiconductor chip. The flip device is formed as a parallelogram construction which consists of a support bracket, a first and a second swivel arm and a connecting arm. A chip gripper is arranged on the connecting arm. A drive system serves the back and forth movement of the parallelogram construction between a first limit position where the chip gripper accepts the semiconductor chip and a second limit position where the chip gripper places the semiconductor chip on the substrate.

Abstract: A Die Bonder or a Wire Bonder contains a device for holding down a substrate. The device comprises a table with drill holes. The drill holes are mechanically programmable with regard to whether vacuum can be applied to them or not. The mechanical programming enables a fast and easy adaptation of the device to different substrates.

Abstract: An apparatus for placing a semiconductor chip as a flipchip on a substrate has a flip device for flipping the semiconductor chip. The flip device is formed as a parallelogram construction which consists of a support bracket, a first and a second swivel arm and a connecting arm. A chip gripper is arranged on the connecting arm. A drive system serves the back and forth movement of the parallelogram construction between a first limit position where the chip gripper accepts the semiconductor chip and a second limit position where the chip gripper places the semiconductor chip on the substrate.

Abstract: A Die Bonder or a Wire Bonder contains a device for holding down a substrate. The device comprises a table with drill holes. The drill holes are mechanically programmable with regard to whether vacuum can be applied to them or not. The mechanical programming enables a fast and easy adaptation of the device to different substrates.