Patents by Inventor Ruediger Knofe
Ruediger Knofe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240057262Abstract: Various embodiments include a method for producing electronic assemblies. The method may include: applying a fluid printing medium in a structured manner using a printing device multiple times consecutively in a sequential series of individual printing steps; measuring a rheological property of the printing medium in an automated repeated series of individual measurement steps during or between the individual printing steps; executing a computer-implemented rheological model for the execution of the individual printing steps, using the repeatedly measured rheological property as a variable input parameter; determining a favorable value for a selected printing parameter with the rheological model based on the currently measured rheological property; and automatically setting the determined favorable value for the selected printing parameter.Type: ApplicationFiled: October 15, 2021Publication date: February 15, 2024Applicant: Siemens AktiengesellschaftInventors: Matthias Heimann, Carsten Borwieck, Ulrich Wittreich, Stefan Nerreter, Rüdiger Knofe, Peter Frühauf, Rene Blank, Bernd Müller, Martin Franke
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Publication number: 20230189450Abstract: A tolerance compensation element is for circuit configurations having a DCB (direct copper bonded) substrate and a PCB (printed circuit board). A circuit configuration further includes the tolerance compensation element. A tolerance compensation element is positioned in a targeted manner between the DCB substrate and PCB in a gap A for the contact-connection of components on the DCB substrate via additive manufacturing and is formed so as to close the gap.Type: ApplicationFiled: February 10, 2023Publication date: June 15, 2023Applicant: Siemens AktiengesellschaftInventors: Rene BLANK, Martin FRANKE, Peter FRUEHAUF, Ruediger KNOFE, Bernd MUELLER, Stefan NERRETER, Joerg STROGIES, Klaus WILKE
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Patent number: 11564310Abstract: The invention relates to a circuit arrangement, comprising at least one wiring carrier plate (1), characterized by at least one separating element (2) formed in the wiring carrier plate (1), which separating element divides the wiring carrier plate (1) into sections separated by the separating element (2), wherein the transfer of vibrations from one section to another section is at least partially decoupled and/or damped by the separating element (2). The invention further relates to a converter having such a circuit arrangement, and to an aircraft having a converter. The converter can comprise capacitor stacks (3) arranged on the wiring carrier plate (1), and power semiconductors (6).Type: GrantFiled: March 20, 2019Date of Patent: January 24, 2023Assignee: Rolls-Royce Deutschland Ltd & Co KGInventors: Rene Blank, Martin Franke, Peter Frühauf, Matthias Heimann, Nora Jeske, Rüdiger Knofe, Bernd Müller, Stefan Nerreter, Jörg Strogies, Klaus Wilke, Ulrich Wittreich
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Patent number: 11289425Abstract: Various embodiments include a semiconductor component comprising: a first carrier part; a second carrier part arranged opposite the first carrier part; a semiconductor element arranged between the first carrier part and the second carrier part; a contact surface arranged on one of the parts; a contact sleeve arranged on one of the carrier parts opposite the contact surface; and a contact pin with, at one axial end, an end face providing an electrical contact connection of the contact surface and, in a region averted from said axial end, a connection region for the connection of the contact pin with the contact sleeve by means of press fitting. At least one of the first carrier part or the second carrier part comprises a printed conductor connected to the contact surface and/or to the contact sleeve.Type: GrantFiled: July 3, 2018Date of Patent: March 29, 2022Assignee: SIEMENS AKTIENGESELLSCHAFTInventors: Rene Blank, Martin Franke, Peter Frühauf, Rüdiger Knofe, Bernd Müller, Stefan Nerreter, Jörg Strogies, Klaus Wilke
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Patent number: 11212918Abstract: Various embodiments include an electrical assembly with: an electronic switching element electrically contacted on an underside and arranged on a flexible first wiring support; wherein the electronic switching element is electrically contacted on an upper side lying opposite the lower side; and a second wiring support arranged lying opposite the first wiring support on the upper side electrical contacting area of the electronic switching element. The first wiring support and the second wiring support each comprise a permanently elastic, electrically insulating, thermally conductive material.Type: GrantFiled: June 19, 2018Date of Patent: December 28, 2021Assignee: SIEMENS AKTIENGESELLSCHAFTInventors: Rene Blank, Martin Franke, Peter Frühauf, Rüdiger Knofe, Bernd Müller, Stefan Nerreter, Jörg Strogies, Klaus Wilke
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Publication number: 20210161002Abstract: The invention relates to a circuit arrangement, comprising at least one wiring carrier plate (1), characterized by at least one separating element (2) formed in the wiring carrier plate (1), which separating element divides the wiring carrier plate (1) into sections separated by the separating element (2), wherein the transfer of vibrations from one section to another section is at least partially decoupled and/or damped by the separating element (2). The invention further relates to a converter having such a circuit arrangement, and to an aircraft having a converter. The converter can comprise capacitor stacks (3) arranged on the wiring carrier plate (1), and power semiconductors (6).Type: ApplicationFiled: March 20, 2019Publication date: May 27, 2021Inventors: Rene Blank, Martin Franke, Peter Frühauf, Matthias Heimann, Nora Jeske, Rüdiger Knofe, Bernd Müller, Stefan Nerreter, Jörg Strogies, Klaus Wilke, Ulrich Wittreich
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Patent number: 10902305Abstract: Various embodiments may include an identification device comprising: a data memory storing a piece of information containing an identification; a processor generating a signal indicating the piece of information; an optical-to-electrical energy converter supplying power for the processor and converting electromagnetic radiation from the surroundings into an electric current feeding the processor via a power connection; an output device with a data connection to the processor for transmitting the signal; and an executable program stored in the processor for reading an input signal transmitted via the power connection and superimposed on the electrical current.Type: GrantFiled: May 12, 2017Date of Patent: January 26, 2021Assignee: SIEMENS AKTIENGESELLSCHAFTInventors: Rüdiger Knofe, Stefan Nerreter, Michael Niedermayer
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Publication number: 20210021179Abstract: A circuit arrangement is disclosed herein. The circuit arrangement includes a circuit carrier board, a power semiconductor arranged on the underside of the circuit carrier board, and a wiring carrier board arranged underneath the power semiconductor. The circuit arrangement further includes a metallic first spacer element arranged between the circuit carrier board and the wiring carrier board and via which an electric load current from the power semiconductor flows, wherein the first spacer element acts as a shunt through which current flows. The circuit arrangement further includes a voltage measuring unit, by which a voltage drop across the first spacer element, produced by the load current flow, may be determined. A converter having such a circuit arrangement, an aircraft having a converter, and a method for current measurement in power semiconductors are likewise specified.Type: ApplicationFiled: February 28, 2019Publication date: January 21, 2021Inventors: Rene Blank, Martin Franke, Peter Frühauf, Matthias Heimann, Nora Jeske, Rüdiger Knofe, Bernd Müller, Stefan Nerreter, Jörg Strogies, Klaus Wilke, Ulrich Wittreich
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Publication number: 20200170111Abstract: Various embodiments include an electrical assembly comprising: an electronic switching element electrically contacted on an underside and arranged on a flexible first wiring support; wherein the electronic switching element is electrically contacted on an upper side lying opposite the lower side; and a second wiring support arranged lying opposite the first wiring support on the upper side electrical contacting area of the electronic switching element. The first wiring support and the second wiring support each comprise a permanently elastic, electrically insulating, thermally conductive material.Type: ApplicationFiled: June 19, 2018Publication date: May 28, 2020Applicant: Siemens AktiengesellschaftInventors: Rene Blank, Martin Franke, Peter Frühauf, Rüdiger Knofe, Bernd Müller, Stefan Nerreter, Jörg Strogies, Klaus Wilke
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Publication number: 20200161246Abstract: Various embodiments include a semiconductor component comprising: a first carrier part; a second carrier part arranged opposite the first carrier part; a semiconductor element arranged between the first carrier part and the second carrier part; a contact surface arranged on one of the parts; a contact sleeve arranged on one of the carrier parts opposite the contact surface; and a contact pin with, at one axial end, an end face providing an electrical contact connection of the contact surface and, in a region averted from said axial end, a connection region for the connection of the contact pin with the contact sleeve by means of press fitting. At least one of the first carrier part or the second carrier part comprises a printed conductor connected to the contact surface and/or to the contact sleeve.Type: ApplicationFiled: July 3, 2018Publication date: May 21, 2020Applicant: Siemens AktiengesellschaftInventors: Rene Blank, Martin Franke, Peter Frühauf, Rüdiger Knofe, Bernd Müller, Stefan Nerreter, Jörg Strogies, Klaus Wilke
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Publication number: 20200152532Abstract: Various embodiments include an electronic assembly comprising: a first substrate; a second substrate; and a component located between the first substrate and the second substrate. The component is in contact with the first substrate and the second substrate. A gap between the first substrate and the component is bridged with an auxiliary joining material. The first substrate defines a through-hole opening into the gap and sealed by the auxiliary joining material. The first substrate and the second substrate define a cavity closed against the environment.Type: ApplicationFiled: April 20, 2018Publication date: May 14, 2020Applicant: Siemens AktiengesellschaftInventors: Rene Blank, Martin Franke, Peter Frühauf, Rüdiger Knofe, Bernd Müller, Stefan Nerreter, Jörg Strogies, Klaus Wilke
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Publication number: 20200122450Abstract: A tolerance compensation element is for circuit configurations having a DCB (direct copper bonded) substrate and a PCB (printed circuit board). A circuit configuration further includes the tolerance compensation element. A tolerance compensation element is positioned in a targeted manner between the DCB substrate and PCB in a gap A for the contact-connection of components on the DCB substrate via additive manufacturing and is formed so as to close the gap.Type: ApplicationFiled: June 7, 2018Publication date: April 23, 2020Applicant: Siemens AktiengesellschaftInventors: Rene BLANK, Martin FRANKE, Peter FRUEHAUF, Ruediger KNOFE, Bernd MUELLER, Stefan NERRETER, Joerg STROGIES, Klaus WILKE
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Patent number: 10582642Abstract: Examples include cooling members for electronic components and/or methods for producing cooling members. The members may include: an assembly side for an electronic component and an upper side opposite the assembly side; at least one cooling chimney extending through the cooling member away from the assembly side which leads to an outlet opening in the upper side of the cooling member; and a number of cooling channels. The cooling channels may have a smaller cross-section than a cross-section of the cooling chimney which lead from inlet openings in the upper side of the cooling member to the cooling chimney.Type: GrantFiled: July 8, 2016Date of Patent: March 3, 2020Assignee: SIEMENS AKTIENGESELLSCHAFTInventors: Martin Franke, Peter Frühauf, Rüdiger Knofe, Bernd Müller, Stefan Nerreter, Michael Niedermayer, Ulrich Wittreich, Manfred Zäske
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Publication number: 20190286958Abstract: Various embodiments may include an identification device comprising: a data memory storing a piece of information containing an identification; a processor generating a signal indicating the piece of information; an optical-to-electrical energy converter supplying power for the processor and converting electromagnetic radiation from the surroundings into an electric current feeding the processor via a power connection; an output device with a data connection to the processor for transmitting the signal; and an executable program stored in the processor for reading an input signal transmitted via the power connection and superimposed on the electrical current.Type: ApplicationFiled: May 12, 2017Publication date: September 19, 2019Applicant: Siemens AktiengesellschaftInventors: Rüdiger Knofe, Stefan Nerreter, Michael Niedermayer
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Publication number: 20180269371Abstract: The present disclosure relates to a cooling arrangement for an electronic component. Some embodiments of the teachings thereof may include a heat sink with a contact surface as an interface for the electronic component. For example, a cooling arrangement for an electronic component may include: a heat sink with a contact surface for the electronic component; a converter for the conversion of thermal energy into useful energy; a functional element driven by the useful energy; and an active cooling device for the heat sink or for the electronic component.Type: ApplicationFiled: September 7, 2016Publication date: September 20, 2018Applicant: Siemens AktiengesellschaftInventors: Martin Franke, Peter Frühauf, Rüdiger Knofe, Bernd Müller, Stefan Nerreter, Michael Niedermayer, Ulrich Wittreich, Manfred Zäske
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Publication number: 20180235101Abstract: The present disclosure relates to electronics. The teachings thereof may be embodied in cooling members for electronic components and/or methods for producing cooling members with an assembly side for an electronic component. For example, a cooling member may include: an assembly side for mounting an electronic component and an upper side opposite the assembly side; at least one cooling chimney extending through the cooling member away from the assembly side which leads to an outlet opening in the upper side of the cooling member; and a number of cooling channels with a smaller cross-section than a cross-section of the cooling chimney which lead from inlet openings in the upper side of the cooling member to the cooling chimney.Type: ApplicationFiled: July 8, 2016Publication date: August 16, 2018Applicant: Siemens AktiengesellschaftInventors: Martin FRANKE, Peter FRÜHAUF, Rüdiger KNOFE, Bernd MÜLLER, Stefan NERRETER, Michael NIEDERMAYER, Ulrich WITTREICH, Manfred ZÄSKE
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Patent number: 9888559Abstract: A method for producing or disassembling an electronic assembly are provided. The assembly may have a heating device integrated into a substrate. The heating device can be heated via an external power supply during the assembly process so that, for example, solder connections of an electric component can be melted. The heating device can also be used when operating the electronic assembly, and the heating device can then be directly actuated by the component. For this purpose, an electric connection is then established between the component and the heating device, the connection not yet being provided during the thermal assembly process in order to protect the electronic components of the circuit from being damaged.Type: GrantFiled: June 17, 2015Date of Patent: February 6, 2018Assignees: SIEMENS AKTIENGESELLSCHAFT, NEUE MATERIALIEN BAYREUTH GMBHInventors: Ruediger Knofe, Bernd Mueller, Andrey Prihodovsky
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Publication number: 20170164465Abstract: A method for producing or disassembling an electronic assembly are provided. The assembly may have a heating device integrated into a substrate. The heating device can be heated via an external power supply during the assembly process so that, for example, solder connections of an electric component can be melted. The heating device can also be used when operating the electronic assembly, and the heating device can then be directly actuated by the component. For this purpose, an electric connection is then established between the component and the heating device, the connection not yet being provided during the thermal assembly process in order to protect the electronic components of the circuit from being damaged.Type: ApplicationFiled: June 17, 2015Publication date: June 8, 2017Applicant: Siemens AktiengesellschaftInventors: Ruediger Knofe, Bernd Mueller, Andrey Prihodovsky