Abstract: A semiconductor component includes a substrate having a chip side and a solder ball side. A semiconductor chip is mounted on the chip side of a substrate. The semiconductor chip is electrically conductively connected to a conductor structure on the substrate. Ball pads are disposed over the solder ball side of the substrate. The ball pads are electrically conductively connected to the conductor structure and suitable for application of solder balls. A mask made from a soldering resist is disposed on the solder ball side. A sealing region at a surface of the solder ball side of the substrate is provided with seal elements for a sealing connection to an encapsulation mold on the surface of the solder ball side.

Abstract: The invention relates to a wiring carrier design for a planar wiring carrier for receiving a plurality of chips, on the chip side of which chips of identical type are arranged in matrix-like fashion, a long narrow bonding channel surrounded by a soldering resist layer being situated in the center of each chip receptacle, and the further region of the chip receptacle area being free of soldering resist, and the chips in each case being encapsulated with a molding material. The invention is based on the object of providing a wiring carrier design with which a uniform application of adhesive can be achieved using simple means. The object is achieved by virtue of the fact that additional supporting elements (9) made of soldering resist, or made of some other suitable material, are applied on the wiring carrier (1) at least in the region of narrow stencil webs (8) that are readily flexible during the printing operation.

Abstract: A method of producing a semiconductor device is described. The semiconductor device has a semiconductor chip with wiring terminals, conductor tracks for the electrical connection of the semiconductor chip, and a component of a housing configuration that contains organic, silicon-containing material. For this purpose, the semiconductor chip is applied to the component of the housing configuration and permanently connected to it. The conductor tracks and/or the wiring terminals are subsequently subjected to a cleaning process, in which silicon-containing material adhering to a surface is eliminated. The conductor tracks are subsequently connected in an electrically conducting manner to the wiring terminals. The contact quality of these electrical connections is noticeably improved by the cleaning process provided.