Patents by Inventor Ruediger Wilde

Ruediger Wilde has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for micro-pack production
    Patent number: 4667402
    Abstract: A wafer is adhered to a foil with an adhesive which is resistant, for a short time, to soldering temperature and the wafer is then divided into chips. After the soldering of the chip to a carrier strip, a pin or spindle beneath the chip penetrates the foil and removes the chip from the foil. The invention has the particular advantage that few method steps are necessary and that the soldering temperature may be synchronized exactly with the soldering operation.
    Type: Grant
    Filed: August 31, 1984
    Date of Patent: May 26, 1987
    Assignee: Siemens Aktiengesellschaft
    Inventor: Ruediger Wilde