Abstract: An expandable server case includes a shell and an expansion frame. The shell includes at least one docking space. The expansion frame is detachably assembled on one end of the shell and protruding from the periphery of the shell. The expansion frame is disposed corresponding to the docking space, and one side of the expansion frame is provided with a junction which is capable of fastening the power supply device. The power supply device is able to be inserted into the docking space to partially be accommodated into the expansion frame and is positioned onto the junction.

Abstract: A storage device backplane with penetrating convection and a computer framework with the storage device backplane are disclosed. The storage device backplane includes an integration board, an operation board and a heat dissipation unit. The integration board has a first surface for electrically connecting the storage device group. The operation board is superposed on and electrically connected to a second surface of the integration board and is provided that the operation board includes an electronic heating active element (EHAE) and an airflow hole set around the EHAE. The heat dissipation unit includes a heat absorb portion and multiple fins set on the heat absorb portion. The heat absorb portion makes a thermal contact with the EHAE. The fins laterally extend to cover the airflow hole. Airflow passages are formed between the fins corresponding to the airflow hole.

Abstract: An expandable server case includes a shell and an expansion frame. The shell includes at least one docking space. The expansion frame is detachably assembled on one end of the shell and protruding from the periphery of the shell. The expansion frame is disposed corresponding to the docking space, and one side of the expansion frame is provided with a junction which is capable of fastening the power supply device. The power supply device is able to be inserted into the docking space to partially be accommodated into the expansion frame and is positioned onto the junction.

Abstract: A storage device backplane with penetrating convection and a computer framework with the storage device backplane are disclosed. The storage device backplane includes an integration board, an operation board and a heat dissipation unit. The integration board has a first surface for electrically connecting the storage device group. The operation board is superposed on and electrically connected to a second surface of the integration board and is provided that the operation board includes an electronic heating active element (EHAE) and an airflow hole set around the EHAE. The heat dissipation unit includes a heat absorb portion and multiple fins set on the heat absorb portion. The heat absorb portion makes a thermal contact with the EHAE. The fins laterally extend to cover the airflow hole. Airflow passages are formed between the fins corresponding to the airflow hole.