Abstract: An electronic device includes a first substrate having a first bonding region, a first circuit, a second circuit, a third circuit, and a plurality of first conductive contacts. The first and second circuit are located at a first edge and a second edge of the first bonding region, the third circuit is located between the first and the second circuits. A second substrate having a second bonding region corresponding to the first bonding region in position and a fourth circuit, a fifth circuit, a sixth circuit, and a plurality of second conductive contacts. When the first substrate is bonded with the second substrate, the first circuit, the second circuit, the third circuit, the fourth circuit, the fifth circuit, and the sixth circuit form a loop, and the first and second conductive contacts are electrically connected to a plurality of signal circuits.

Abstract: An electronic device includes a first substrate having a first bonding region, a first circuit, a second circuit, a third circuit, and a plurality of first conductive contacts. The first and second circuit are located at a first edge and a second edge of the first bonding region, the third circuit is located between the first and the second circuits. A second substrate having a second bonding region corresponding to the first bonding region in position and a fourth circuit, a fifth circuit, a sixth circuit, and a plurality of second conductive contacts. When the first substrate is bonded with the second substrate, the first circuit, the second circuit, the third circuit, the fourth circuit, the fifth circuit, and the sixth circuit form a loop, and the first and second conductive contacts are electrically connected to a plurality of signal circuits.