Patents by Inventor Ruei-Wen SHIH

Ruei-Wen SHIH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11708651
    Abstract: The invention provides a method for knitting and forming a weft-knitted fabric with varying thickness by a flat knitting machine and a weft-knitted fabric thereof. The method is implemented in at least one knitting process of the weft-knitted fabric, comprising steps of: driving the flat knitting machine to knit a basic structure by at least one of two needle beds of the flat knitting machine, and controlling the two needle beds on the flat knitting machine to knit a three-dimensional structure connected with the basic structure. A thickness of the three-dimensional structure is greater than a thickness of the basic structure, the three-dimensional structure comprises two surface layer portions and a supporting portion connected with the two surface layer portions and located between the two surface layer portions. A junction between the three-dimensional structure and the basic structure is without the supporting portion.
    Type: Grant
    Filed: May 5, 2021
    Date of Patent: July 25, 2023
    Assignee: PAI LUNG MACHINERY MILL CO., LTD.
    Inventors: Chih-Chiang Lee, Ruei-Wen Shih, Po-Chun Chen
  • Publication number: 20220356615
    Abstract: The invention provides a method for knitting and forming a weft-knitted fabric with varying thickness by a flat knitting machine and a weft-knitted fabric thereof. The method is implemented in at least one knitting process of the weft-knitted fabric, comprising steps of: driving the flat knitting machine to knit a basic structure by at least one of two needle beds of the flat knitting machine, and controlling the two needle beds on the flat knitting machine to knit a three-dimensional structure connected with the basic structure. A thickness of the three-dimensional structure is greater than a thickness of the basic structure, the three-dimensional structure comprises two surface layer portions and a supporting portion connected with the two surface layer portions and located between the two surface layer portions. A junction between the three-dimensional structure and the basic structure is without the supporting portion.
    Type: Application
    Filed: May 5, 2021
    Publication date: November 10, 2022
    Inventors: Chih-Chiang LEE, Ruei-Wen SHIH, Po-Chun CHEN