Patents by Inventor RUEI-YI TSAI

RUEI-YI TSAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11878301
    Abstract: An analysis cartridge includes a first cover, a second cover, a plurality of containers, a plurality of fluid tunnels and a rotary valve. The second cover has two opposite surfaces, a plurality of first through holes and a second through hole individually penetrate through the two opposite surfaces, and the first cover is attached to the second cover. The plurality of containers are disposed between the first cover and the second cover, with each of the containers being aligned to and filled in the first through holes. The plurality of the fluid tunnels are disposed on the first cover, and each of which is individually connected with a first pipette. The rotary valve is rotatably disposed between the first cover and the second cover to correspond to the second through hole, and a flow channel disposed on the rotary valve is connected with the containers individually.
    Type: Grant
    Filed: December 8, 2021
    Date of Patent: January 23, 2024
    Assignee: Credo Diagnostics Biomedical Pte. Ltd.
    Inventors: Ying-Ta Lai, Yu-Cheng Ou, Jim-Yi Liao, Shu-Hong Huang, Fan-Yun Huang, Ruei-Yi Tsai, Li-Yu Hsiung
  • Publication number: 20220388000
    Abstract: An analysis cartridge includes a first cover, a second cover, a plurality of containers, a plurality of fluid tunnels and a rotary valve. The second cover has two opposite surfaces, a plurality of first through holes and a second through hole individually penetrate through the two opposite surfaces, and the first cover is attached to the second cover. The plurality of containers are disposed between the first cover and the second cover, with each of the containers being aligned to and filled in the first through holes. The plurality of the fluid tunnels are disposed on the first cover, and each of which is individually connected with a first pipette. The rotary valve is rotatably disposed between the first cover and the second cover to correspond to the second through hole, and a flow channel disposed on the rotary valve is connected with the containers individually.
    Type: Application
    Filed: December 8, 2021
    Publication date: December 8, 2022
    Applicant: Credo Diagnostics Biomedical Pte. Ltd.
    Inventors: Ying-Ta Lai, Yu-Cheng Ou, Jim-Yi Liao, Shu-Hong Huang, Fan-Yun Huang, Ruei-Yi Tsai, Li-Yu Hsiung
  • Publication number: 20220389402
    Abstract: The present disclosure relates to a method and an apparatus for opening the external layer structure of cells using laser, wherein the short pulse laser excited from a laser diode is collimated via the optical lens and concentrated at a focus, a biological sample which is fixed on the focus or moves through the focus is treated with the concentrated short pulse laser, so that the cell membrane or cell wall of cells in the sample is broken.
    Type: Application
    Filed: June 30, 2021
    Publication date: December 8, 2022
    Applicant: Credo Diagnostics Biomedical Pte. Ltd.
    Inventors: Ying-Ta Lai, Yu-Cheng Ou, Yi-Hsi Chen, Chung-Wei Tsai, Kuan-Ying Chen, Ruei-Yi Tsai, Chih-Yuan Chen
  • Patent number: 10861761
    Abstract: Present disclosure provides a method for forming a semiconductor packaged wafer, including providing a semiconductor package having a die on a first side of a wafer, partially molding the die by disposing molding material on the first side of the wafer, a peripheral of the first side is free of molding material at a completion of the partially molding, and bonding the semiconductor package with a carrier from the first side of the wafer. Present disclosure also provides a semiconductor packaged wafer, including a die on a first side of a wafer, a molding encapsulating the die and partially positioning on the first side of the wafer by retracting from a peripheral of the first side of the wafer, and a sealing structure on the peripheral of the first side of the wafer.
    Type: Grant
    Filed: February 21, 2018
    Date of Patent: December 8, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Fu-Chen Chang, Cheng-Lin Huang, Wen-Ming Chen, Shih-Yen Chen, Ruei-Yi Tsai, Pin-Yi Hsin
  • Publication number: 20190103389
    Abstract: Present disclosure provides a method for forming a semiconductor packaged wafer, including providing a semiconductor package having a die on a first side of a wafer, partially molding the die by disposing molding material on the first side of the wafer, a peripheral of the first side is free of molding material at a completion of the partially molding, and bonding the semiconductor package with a carrier from the first side of the wafer. Present disclosure also provides a semiconductor packaged wafer, including a die on a first side of a wafer, a molding encapsulating the die and partially positioning on the first side of the wafer by retracting from a peripheral of the first side of the wafer, and a sealing structure on the peripheral of the first side of the wafer.
    Type: Application
    Filed: February 21, 2018
    Publication date: April 4, 2019
    Inventors: FU-CHEN CHANG, CHENG-LIN HUANG, WEN-MING CHEN, SHIH-YEN CHEN, RUEI-YI TSAI, PIN-YI HSIN