Patents by Inventor Ruei Yuen Chen

Ruei Yuen Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10256926
    Abstract: The present disclosure provides a method for configuring a communication system with a variable attenuator. The method includes measuring a first attenuation accuracy of the communication system at a first attenuation rate of the variable attenuator, and setting the variable attenuator based on the first attenuation accuracy so that the variable attenuator has a second attenuation rate and the communication system has a second attenuation accuracy. The method further includes obtaining a plurality of first gains at first temperatures and first frequencies, and performing an interpolation process to obtain, from the plurality of first gains, a plurality of second gains at second temperatures and/or second frequencies. The method also includes building a three-dimensional gain table with respect to the temperature, the frequency and the attenuation rate.
    Type: Grant
    Filed: April 2, 2018
    Date of Patent: April 9, 2019
    Assignee: MICROELECTRONICS TECHNOLOGY, INC
    Inventors: Ruei-Yuen Chen, Hsiang-Hao Sung
  • Publication number: 20190058531
    Abstract: The present disclosure provides a method for configuring a communication system with a variable attenuator. The method includes measuring a first attenuation accuracy of the communication system at a first attenuation rate of the variable attenuator, and setting the variable attenuator based on the first attenuation accuracy so that the variable attenuator has a second attenuation rate and the communication system has a second attenuation accuracy. The method further includes obtaining a plurality of first gains at first temperatures and first frequencies, and performing an interpolation process to obtain, from the plurality of first gains, a plurality of second gains at second temperatures and/or second frequencies. The method also includes building a three-dimensional gain table with respect to the temperature, the frequency and the attenuation rate.
    Type: Application
    Filed: April 2, 2018
    Publication date: February 21, 2019
    Inventors: Ruei-Yuen CHEN, HSIANG-HAO SUNG
  • Patent number: 9419342
    Abstract: An outdoor unit includes a dish antenna and a low noise block converter positioned at a focus point of the dish antenna. The low noise block converter comprises a housing, a feed cap disposed on top of the housing, and an air permeable membrane disposed on a bottom portion of the housing. The housing includes a base portion, at least one feed horn protruding from the base portion, and a bottom cover attached to a bottom of the base portion so as to form a housing cavity, wherein the bottom cover has a vent hole forming a flow path between the housing cavity and an external environment. The feed cap is disposed on a feed portion of the at least one feed horn and the air permeable membrane is disposed over the vent hole and coupled to the bottom cover via an adhesive, wherein the membrane is configured to permit egress of a gas from the housing cavity therethrough.
    Type: Grant
    Filed: October 3, 2014
    Date of Patent: August 16, 2016
    Assignee: MICROELECTRONICS TECHNOLOGY, INC.
    Inventors: Ruei Yuen Chen, Hsiang Hao Sung, Wen Chi Fu
  • Publication number: 20160099503
    Abstract: An outdoor unit includes a dish antenna and a low noise block converter positioned at a focus point of the dish antenna. The low noise block converter comprises a housing, a feed cap disposed on top of the housing, and an air permeable membrane disposed on a bottom portion of the housing. The housing includes a base portion, at least one feed horn protruding from the base portion, and a bottom cover attached to a bottom of the base portion so as to form a housing cavity, wherein the bottom cover has a vent hole forming a flow path between the housing cavity and an external environment. The feed cap is disposed on a feed portion of the at least one feed horn and the air permeable membrane is disposed over the vent hole and coupled to the bottom cover via an adhesive, wherein the membrane is configured to permit egress of a gas from the housing cavity therethrough.
    Type: Application
    Filed: October 3, 2014
    Publication date: April 7, 2016
    Inventors: RUEI YUEN CHEN, HSIANG HAO SUNG, WEN CHI FU
  • Patent number: 9024835
    Abstract: An integral high frequency communication apparatus comprises a case, a waveguide apparatus having an extension portion, and a circuit board having a signal transmitting unit and a signal receiving unit. The transceiver module having two waveguide openings is retained in the case. The case has an opening through which the extension portion extends outside of the case. The integral high frequency communication apparatus can receive and transmit high frequency signals by the extension portion.
    Type: Grant
    Filed: December 28, 2011
    Date of Patent: May 5, 2015
    Assignee: Microelectronics Technology, Inc.
    Inventors: Ruei Yuen Chen, Hsiang Hao Sung
  • Patent number: 8358515
    Abstract: A low noise block converter includes a first printed circuit board, a second printed circuit board, and a housing. The first printed circuit board includes a metal layer disposed on a surface of the first printed circuit board. The second printed circuit board includes at least one chip. The housing includes a support surface configured to support the first printed circuit board, and a cavity formed on the support surface and configured to receive the second printed circuit board, wherein the first printed circuit board is placed on the support surface with the metal layer facing the cavity for shielding the electromagnetic fields radiated from the at least one chip.
    Type: Grant
    Filed: September 3, 2010
    Date of Patent: January 22, 2013
    Assignee: Microelectronics Technology, Inc.
    Inventors: Ruei Yuen Chen, Hsiang Hao Sung
  • Publication number: 20120092092
    Abstract: An integral high frequency communication apparatus comprises a case, a waveguide apparatus having an extension portion, and a circuit board having a signal transmitting unit and a signal receiving unit. The transceiver module having two waveguide openings is retained in the case. The case has an opening through which the extension portion extends outside of the case. The integral high frequency communication apparatus can receive and transmit high frequency signals by the extension portion.
    Type: Application
    Filed: December 28, 2011
    Publication date: April 19, 2012
    Applicant: MICROELECTRONICS TECHNOLOGY, INC.
    Inventors: RUEI YUEN CHEN, HSIANG HAO SUNG
  • Patent number: 8106843
    Abstract: An integral high frequency communication apparatus comprises a case, a waveguide apparatus having an extension portion, and a transceiver module having two waveguide openings. The transceiver module having two waveguide openings is retained in the case. The case has an opening through which the extension portion extends outside of the case. The integral high frequency communication apparatus can receive and transmit high frequency signals by the extension portion.
    Type: Grant
    Filed: October 29, 2008
    Date of Patent: January 31, 2012
    Assignee: Microelectronics Technology, Inc.
    Inventors: Ruei Yuen Chen, Hsiang Hao Sung
  • Publication number: 20110063810
    Abstract: A low noise block converter includes a first printed circuit board, a second printed circuit board, and a housing. The first printed circuit board includes a metal layer disposed on a surface of the first printed circuit board. The second printed circuit board includes at least one chip. The housing includes a support surface configured to support the first printed circuit board, and a cavity formed on the support surface and configured to receive the second printed circuit board, wherein the first printed circuit board is placed on the support surface with the metal layer facing the cavity for shielding the electromagnetic fields radiated from the at least one chip.
    Type: Application
    Filed: September 3, 2010
    Publication date: March 17, 2011
    Applicant: MICROELECTRONICS TECHNOLOGY INC.
    Inventors: RUEI YUEN CHEN, HSIANG HAO SUNG
  • Publication number: 20100029199
    Abstract: An integral high frequency communication apparatus comprises a case, a waveguide apparatus having an extension portion, and a transceiver module having two waveguide openings. The transceiver module having two waveguide openings is retained in the case. The case has an opening through which the extension portion extends outside of the case. The integral high frequency communication apparatus can receive and transmit high frequency signals by the extension portion.
    Type: Application
    Filed: October 29, 2008
    Publication date: February 4, 2010
    Applicant: MICROELECTRONICS TECHNOLOGY INC.
    Inventors: RUEI YUEN CHEN, HSIANG HAO SUNG
  • Patent number: 7570496
    Abstract: An electromagnetic interference shielding apparatus for a signal transceiver employs two folded-edge mechanisms coupled together and an adhesive. The electromagnetic interference shielding apparatus includes a metal cover, a chassis having a waveguide output hole, and an adhesive. A first combination portion having a first curved section is disposed on an edge of the metal cover. A second combination portion having a second curved section corresponding to the first combination portion is disposed on an edge of the chassis. The adhesive is used to combine the first combination portion and the second combination portion. The waveguide output hole outputs a signal transmitted by the signal transceiver. The first combination portion and the second combination portion form a curved space that is used with the adhesive to prevent leakage of the transmitted signal and the interference of external noises.
    Type: Grant
    Filed: August 30, 2007
    Date of Patent: August 4, 2009
    Assignee: Microelectronics Technology Inc.
    Inventors: Ruei Yuen Chen, Fang Yu Kuo, Yi Hsiang Huang
  • Patent number: 7492237
    Abstract: A gain compensation circuit comprises a first amplifier, a second amplifier, a filter, a first attenuator, a second attenuator and a third attenuator. The first amplifier is configured to amplify an input signal of the microwave signal processor. The filter is disposed between the first and second amplifiers. The first attenuator is disposed between the first amplifier and the filter for reducing return loss of the microwave signal processor. The second attenuator is disposed between the second amplifier and the filter for reducing return loss of the microwave signal processor. The third attenuator is electrically connected to the output of the second amplifier for reducing noise figure of the microwave signal processor and providing first and second gain compensations. The first gain compensation keeps the gain of the microwave signal processor constant under various temperatures, and the second gain compensation adjusts a nominal gain of the microwave signal processor.
    Type: Grant
    Filed: September 10, 2007
    Date of Patent: February 17, 2009
    Assignee: Microelectronics Technology Inc.
    Inventors: Ruei Yuen Chen, Yen Fen Lin
  • Publication number: 20080303612
    Abstract: A waveguide structure comprises a first waveguide portion, a second waveguide portion and a third waveguide portion. The first, second and third waveguide portions are connected in a series; signals feed into the first waveguide portion and then propagate through the first, second and third waveguide portions in sequence; and the cross sections of the first to third waveguide portions descend in size.
    Type: Application
    Filed: September 10, 2007
    Publication date: December 11, 2008
    Applicant: Microelectronics Technology Inc.
    Inventors: Ruei Yuen Chen, Hongru Suchen
  • Publication number: 20080272865
    Abstract: A gain compensation circuit comprises a first amplifier, a second amplifier, a filter, a first attenuator, a second attenuator and a third attenuator. The first amplifier is configured to amplify an input signal of the microwave signal processor. The filter is disposed between the first and second amplifiers. The first attenuator is disposed between the first amplifier and the filter for reducing return loss of the microwave signal processor. The second attenuator is disposed between the second amplifier and the filter for reducing return loss of the microwave signal processor. The third attenuator is electrically connected to the output of the second amplifier for reducing noise figure of the microwave signal processor and providing first and second gain compensations. The first gain compensation keeps the gain of the microwave signal processor constant under various temperatures, and the second gain compensation adjusts a nominal gain of the microwave signal processor.
    Type: Application
    Filed: September 10, 2007
    Publication date: November 6, 2008
    Applicant: Microelectronics Technology Inc.
    Inventors: Ruei Yuen Chen, Yen Fen Lin
  • Publication number: 20080123316
    Abstract: An electromagnetic interference shielding apparatus for a signal transceiver employs two folded-edge mechanisms coupled together and an adhesive. The electromagnetic interference shielding apparatus includes a metal cover, a chassis having a waveguide output hole, and an adhesive. A first combination portion having a first curved section is disposed on an edge of the metal cover. A second combination portion having a second curved section corresponding to the first combination portion is disposed on an edge of the chassis. The adhesive is used to combine the first combination portion and the second combination portion. The waveguide output hole outputs a signal transmitted by the signal transceiver. The first combination portion and the second combination portion form a curved space that is used with the adhesive to prevent leakage of the transmitted signal and the interference of external noises.
    Type: Application
    Filed: August 30, 2007
    Publication date: May 29, 2008
    Applicant: MICROELECTRONICS TECHNOLOGY INC.
    Inventors: Ruei Yuen Chen, Fang Yu Kou, Yi Hsiang Huang