Abstract: An embodiment of the present invention includes a plunger, a heating element, and first and second arms. The plunger affixes a first unit to a second unit with adhesive. The first and second units are on a strip of a flexible tape. The strip is on a folding base unit. The folding base unit folds the first unit on top of the second unit. The heating element is attached to the plunger to cure the adhesive. The first and second arms are positioned on first and second sides of the plunger via first and second hinges, respectively, to secure the first and second units underneath the plunger. Another embodiment of the invention includes a first sub-assembly and a second sub-assembly. The first sub-assembly supports a first unit. The first sub-assembly, when activated, folds the first unit on top of a second unit. The first and second units are on a strip of a flexible tape. The second sub-assembly supports the second unit.

Abstract: Some embodiments relate to a semiconducting device that includes a substrate, a die and an interconnect device. The die and interconnect device are attached to an upper surface of the substrate. The semiconducting device further includes a first wire that is bonded to the substrate and to the interconnect device and a second wire that is bonded to the interconnect device and to the die. Other example embodiments include a stack of dice that has a bottom die attached to the upper surface of the substrate and a top die stacked onto the other dice in the stack of dice. The interconnect device is attached to an upper surface of any die in the stack of dice such that a first wire is bonded to the substrate and to the interconnect device and a second wire is bonded to the interconnect device and to the top die.

Abstract: An embodiment of the present invention includes a plunger, a heating element, and first and second arms. The plunger affixes a first unit to a second unit with adhesive. The first and second units are on a strip of a flexible tape. The strip is on a folding base unit. The folding base unit folds the first unit on top of the second unit. The heating element is attached to the plunger to cure the adhesive. The first and second arms are positioned on first and second sides of the plunger via first and second hinges, respectively, to secure the first and second units underneath the plunger. Another embodiment of the invention includes a first sub-assembly and a second sub-assembly. The first sub-assembly supports a first unit. The first sub-assembly, when activated, folds the first unit on top of a second unit. The first and second units are on a strip of a flexible tape. The second sub-assembly supports the second unit.

Abstract: An embodiment of the present invention includes a plunger, a heating element, and first and second arms. The plunger affixes a first unit to a second unit with adhesive. The first and second units are on a strip of a flexible tape. The strip is on a folding base unit. The folding base unit folds the first unit on top of the second unit. The heating element is attached to the plunger to cure the adhesive. The first and second arms are positioned on first and second sides of the plunger via first and second hinges, respectively, to secure the first and second units underneath the plunger. Another embodiment of the invention includes a first sub-assembly and a second subassembly. The first sub-assembly supports a first unit. The first sub-assembly, when activated, folds the first unit on top of a second unit. The first and second units are on a strip of a flexible tape. The second sub-assembly supports the second unit.

Abstract: A degater is described having upper and lower support halves movable relative to one another between an open position and a closed position. The support halves, while in the closed position, secure an encapsulated microelectronic device having excess encapsulant attached thereto and being partially severable therefrom. The upper support half includes a retainer for securing the excess encapsulant when in the closed position and for detaching the excess encapsulant from the encapsulated device when the support halves move to the open position. The upper support half also includes movable support pins which contact the encapsulated device when the support halves are in the closed position, and bias the encapsulated device against the lower support half as the support halves move from the closed to the open position.