Abstract: An embodiment of the present invention includes a plunger, a heating element, and first and second arms. The plunger affixes a first unit to a second unit with adhesive. The first and second units are on a strip of a flexible tape. The strip is on a folding base unit. The folding base unit folds the first unit on top of the second unit. The heating element is attached to the plunger to cure the adhesive. The first and second arms are positioned on first and second sides of the plunger via first and second hinges, respectively, to secure the first and second units underneath the plunger. Another embodiment of the invention includes a first sub-assembly and a second sub-assembly. The first sub-assembly supports a first unit. The first sub-assembly, when activated, folds the first unit on top of a second unit. The first and second units are on a strip of a flexible tape. The second sub-assembly supports the second unit.

Abstract: An embodiment of the present invention includes a plunger, a heating element, and first and second arms. The plunger affixes a first unit to a second unit with adhesive. The first and second units are on a strip of a flexible tape. The strip is on a folding base unit. The folding base unit folds the first unit on top of the second unit. The heating element is attached to the plunger to cure the adhesive. The first and second arms are positioned on first and second sides of the plunger via first and second hinges, respectively, to secure the first and second units underneath the plunger. Another embodiment of the invention includes a first sub-assembly and a second sub-assembly. The first sub-assembly supports a first unit. The first sub-assembly, when activated, folds the first unit on top of a second unit. The first and second units are on a strip of a flexible tape. The second sub-assembly supports the second unit.

Abstract: An embodiment of the present invention includes a plunger, a heating element, and first and second arms. The plunger affixes a first unit to a second unit with adhesive. The first and second units are on a strip of a flexible tape. The strip is on a folding base unit. The folding base unit folds the first unit on top of the second unit. The heating element is attached to the plunger to cure the adhesive. The first and second arms are positioned on first and second sides of the plunger via first and second hinges, respectively, to secure the first and second units underneath the plunger. Another embodiment of the invention includes a first sub-assembly and a second sub-assembly. The first sub-assembly supports a first unit. The first sub-assembly, when activated, folds the first unit on top of a second unit. The first and second units are on a strip of a flexible tape. The second sub-assembly supports the second unit.

Abstract: An embodiment of the present invention includes a plunger, a heating element, and first and second arms. The plunger affixes a first unit to a second unit with adhesive. The first and second units are on a strip of a flexible tape. The strip is on a folding base unit. The folding base unit folds the first unit on top of the second unit. The heating element is attached to the plunger to cure the adhesive. The first and second arms are positioned on first and second sides of the plunger via first and second hinges, respectively, to secure the first and second units underneath the plunger. Another embodiment of the invention includes a first sub-assembly and a second sub-assembly. The first sub-assembly supports a first unit. The first sub-assembly, when activated, folds the first unit on top of a second unit. The first and second units are on a strip of a flexible tape. The second sub-assembly supports the second unit.

Abstract: A method for packaging a die includes attaching the die to a substrate using a plurality of pieces of discontinuous die attach material, and injecting a mold compound at the interface between the die and the substrate.

Abstract: Some embodiments relate to a semiconducting device that includes a substrate, a die and an interconnect device. The die and interconnect device are attached to an upper surface of the substrate. The semiconducting device further includes a first wire that is bonded to the substrate and to the interconnect device and a second wire that is bonded to the interconnect device and to the die. Other example embodiments include a stack of dice that has a bottom die attached to the upper surface of the substrate and a top die stacked onto the other dice in the stack of dice. The interconnect device is attached to an upper surface of any die in the stack of dice such that a first wire is bonded to the substrate and to the interconnect device and a second wire is bonded to the interconnect device and to the top die.