Abstract: A light-emitting diode (LED) package and method of manufacture are described. An LED package includes an LED die that has a top surface, a bottom surface and side surfaces. The package further includes a wavelength converting element having a top surface, a bottom surface and side surfaces. The bottom surface of the wavelength converting element is adjacent the top surface of the LED die. The package further includes a light reflecting coating surrounding at least the side surfaces of both the LED die and the wavelength converting element. The light reflective coating has at a least a portion that extends above the top surface of the wavelength converting element.

Abstract: A light-emitting device is disclosed that includes a substrate; a semiconductor structure on the substrate, a wavelength conversion element on the substrate, opposite the semiconductor structure; an insulating side coating around the semiconductor structure; and a reflective side coating around the wavelength conversion element and the substrate, the reflective layer being stacked over the insulating side coating, the reflective side coating having a first surface that is over a second surface of the insulating side coating.

Abstract: A light-emitting device is disclosed that includes a substrate; a semiconductor structure on the substrate, a wavelength conversion element on the substrate, opposite the semiconductor structure; an insulating side coating around the semiconductor structure; and a reflective side coating around the wavelength conversion element and the substrate, the reflective layer being stacked over the insulating side coating, the reflective side coating having a first surface that is over a second surface of the insulating side coating.

Abstract: A light-emitting device is disclosed that includes a semiconductor structure having an active region disposed between an n-type layer and a p-type layer; a wavelength converter formed above the semiconductor structure; an insulating side coating formed around the semiconductor structure; and a reflective side coating formed around the wavelength converter above the insulating side coating, the reflective side coating having a top surface that is flush with a top surface of the wavelength converter.

Abstract: A light emitting device includes a light emitting element on a substrate, and a lens element that includes a cavity within which the light emitting element is situated, and is optically aligned with the light emitting element. A strip of adhesive that attaches the lens element to the substrate substantially surrounds the light emitting element, but includes a gap that facilitates release of material from the cavity during the attachment of the lens element to the substrate. When the lens element is placed upon the substrate, the adhesive is partially cured to provide a relatively high shear strength before the light emitting device is transported or subjected to other processes. To provide compatibility with subsequent processes or applications, and to protect the light emitting element from the environment, the gap in each device is sealed with a sealing material.

Abstract: A light-emitting device is disclosed that includes a semiconductor structure having an active region disposed between an n-type layer and a p-type layer; a wavelength converter formed above the semiconductor structure; an insulating side coating formed around the semiconductor structure; and a reflective side coating formed around the wavelength converter above the insulating side coating, the reflective side coating having a top surface that is flush with a top surface of the wavelength converter.

Abstract: A light emitting device includes a light emitting element on a substrate, and a lens element that includes a cavity within which the light emitting element is situated, and is optically aligned with the light emitting element. A strip of adhesive that attaches the lens element to the substrate substantially surrounds the light emitting element, but includes a gap that facilitates release of material from the cavity during the attachment of the lens element to the substrate. When the lens element is placed upon the substrate, the adhesive is partially cured to provide a relatively high shear strength before the light emitting device is transported or subjected to other processes. To provide compatibility with subsequent processes or applications, and to protect the light emitting element from the environment, the gap in each device is sealed with a sealing material.