Abstract: Within both a electrostatic chuck apparatus and a method for fabricating a substrate while employing a fabrication apparatus having assembled therein the electrostatic chuck apparatus there is employed: (1) an electrostatically energizable substrate plate sized to accommodate a substrate; and (2) an electrically conductive lift pin movably positionable with respect to the electrostatically energizable substrate plate such as to optionally contact and lift the substrate when positioned upon the electrostatically energizable substrate plate, further wherein the electrically conductive lift pin is connected to ground through a switch. Both the electrostatic chuck apparatus and the method provide for more efficient dechucking of the substrate positioned and electrostatically fixed upon the electrostatic chuck apparatus.

Abstract: Within both a electrostatic chuck apparatus and a method for fabricating a substrate while employing a fabrication apparatus having assembled therein the electrostatic chuck apparatus there is employed: (1) an electrostatically energizable substrate plate sized to accommodate a substrate; and (2) an electrically conductive lift pin movably positionable with respect to the electrostatically energizable substrate plate such as to optionally contact and lift the substrate when positioned upon the electrostatically energizable substrate plate, further wherein the electrically conductive lift pin is connected to ground through a switch. Both the electrostatic chuck apparatus and the method provide for more efficient dechucking of the substrate positioned and electrostatically fixed upon the electrostatic chuck apparatus.

Abstract: An apparatus for controlling temperature of a process chamber which includes a plurality of heating elements mounted juxtaposed to a cylindrical chamber sidewall of the process chamber for heating the chamber, and a plurality of thermal sensors with one mounted juxtaposed to each of the plurality of heating elements such that the temperature of the chamber cavity can be more uniformly controlled. The method may be carried out by first forming a substantially air-tight chamber cavity by a cylindrical chamber sidewall, a top enclosure and a bottom enclosure, and then positioning a plurality of heating elements juxtaposed to and surrounds the cylindrical chamber sidewall and then mounting a plurality of thermal sensors to the plurality of heating elements with one sensor juxtaposed to each heating element, and then controlling the temperature of the process chamber by inputting signals from the plurality of thermal sensors into a controller and then outputting signals to the plurality of heating elements.