Patents by Inventor Ruey-Hsia CHIANG

Ruey-Hsia CHIANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10497638
    Abstract: A method of producing ceramic wafer includes a forming step and processing step. The processing step includes forming positioning notch or positioning, flat edge and edge profile, which avoids the ceramic wafers to have processing defect during cutting, grinding, and polishing, for increasing yield. The ceramic particles for producing ceramic wafer include nitride ceramic powder, oxide ceramic powder, and nitride ceramic powder. The ceramic wafer has low dielectric constant, insulation, and excellent heat dissipation, which can be applied for the need of semiconductor process, producing electric product and semiconductor equipment.
    Type: Grant
    Filed: November 16, 2016
    Date of Patent: December 3, 2019
    Assignee: HONG CHUANG APPLIED TECHNOLOGY CO., LTD.
    Inventors: Ruey-Hsia Chiang, Yan-Kai Zeng
  • Publication number: 20180053706
    Abstract: A method of producing ceramic wafer includes a forming step and processing step. The processing step includes forming positioning notch or positioning, flat edge and edge profile, which avoids the ceramic wafers to have processing defect during cutting, grinding, and polishing, for increasing yield. The ceramic particles for producing ceramic wafer include nitride ceramic powder, oxide ceramic powder, and nitride ceramic powder. The ceramic wafer has low dielectric constant, insulation, and excellent heat dissipation, which can be applied for the need of semiconductor process, producing electric product and semiconductor equipment.
    Type: Application
    Filed: November 16, 2016
    Publication date: February 22, 2018
    Inventors: Ruey-Hsia CHIANG, Yan-Kai ZENG