Abstract: A method for determining a loading current of a circuit board is provided. In the method, outline positions of metal regions and hollowed regions in each of the metal regions are recorded. Metal widths corresponding to scan lines in circuit board are calculated in a sequence, so that a minimum metal width on each of the scan lines is acquired. According to the minimum metal width, a maximum loading current of each of the metal regions is calculated. In addition, a method and a system for filtering manufacturers are provided. A processing apparatus of the system analyzes the maximum loading current and manufacturing process parameters of the circuit board, calculates a weight score of a manufacturing process capability parameter table of each manufacturer according to the maximum loading current and manufacturing process parameters, and filtering the manufacturers to produce the best fit manufacturer list.

Abstract: A method for determining a loading current of a circuit board is provided. In the method, outline positions of metal regions and hollowed regions in each of the metal regions are recorded. Metal widths corresponding to scan lines in circuit board are calculated in a sequence, so that a minimum metal width on each of the scan lines is acquired. According to the minimum metal width, a maximum loading current of each of the metal regions is calculated. In addition, a method and a system for filtering manufacturers are provided. A processing apparatus of the system analyzes the maximum loading current and manufacturing process parameters of the circuit board, calculates a weight score of a manufacturing process capability parameter table of each manufacturer according to the maximum loading current and manufacturing process parameters, and filtering the manufacturers to produce the best fit manufacturer list.

Abstract: A method for determining a loading current of a circuit board is provided. In the method, outline positions of metal regions and hollowed regions in each of the metal regions are recorded. Metal widths corresponding to scan lines in circuit board are calculated in a sequence, so that a minimum metal width on each of the scan lines is acquired. According to the minimum metal width, a maximum loading current of each of the metal regions is calculated. In addition, a method and a system for filtering manufacturers are provided. A processing apparatus of the system analyzes the maximum loading current and manufacturing process parameters of the circuit board, calculates a weight score of a manufacturing process capability parameter table of each manufacturer according to the maximum loading current and manufacturing process parameters, and filtering the manufacturers to produce the best fit manufacturer list.

Abstract: A method for determining a loading current of a circuit board is provided. In the method, outline positions of metal regions and hollowed regions in each of the metal regions are recorded. Metal widths corresponding to scan lines in circuit board are calculated in a sequence, so that a minimum metal width on each of the scan lines is acquired. According to the minimum metal width, a maximum loading current of each of the metal regions is calculated. In addition, a method and a system for filtering manufacturers are provided. A processing apparatus of the system analyzes the maximum loading current and manufacturing process parameters of the circuit board, calculates a weight score of a manufacturing process capability parameter table of each manufacturer according to the maximum loading current and manufacturing process parameters, and filtering the manufacturers to produce the best fit manufacturer list.

Abstract: A circuit-design method for a PCB is provided. A first user input is obtained via a user interface of a layout tool, wherein the first user input indicates that an object of a circuit diagram of the PCB is selected in the user interface. A plurality of constraint settings corresponding to an attribute are obtained from a database according to the attribute of the object. The plurality of constraint settings are displayed in a window of the user interface. A second user input is obtained via the user interface, wherein the second user input indicates that one of the plurality of constraint settings is selected in the window. At least one constraint parameter corresponding to the selected constraint setting is assigned to the object, and a tag corresponding to the attribute of the object is attached to the object of the circuit diagram.