Patents by Inventor Rueyshing Star Huang

Rueyshing Star Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • MEMS device package with vacuum cavity by two-step solder reflow method
    Patent number: 8058106
    Abstract: In a method of vacuum packaging a MEMS device, at least one MEMS device is attached on a substrate. A solder preform is printed on the substrate at the perimeter surrounding the substrate. A lid is attached to the solder preform wherein the lid provides a cavity enclosing the at least one MEMS device. A first reflowing step reflows the solder at a first temperature, partially sealing the lid/substrate interface and at the same time does the outgassing and baking procedure for the packaging. Flux is applied onto an outer ring of the solder preform and a second step reflows the solder at a second temperature, completely sealing the lid/substrate interface and providing a vacuum cavity enclosing the at least one MEMS device.
    Type: Grant
    Filed: September 4, 2009
    Date of Patent: November 15, 2011
    Assignee: MagIC Technologies, Inc.
    Inventors: Mei-Ling Wu, Rueyshing Star Huang
  • MEMS device package with vacuum cavity by two-step solder reflow method
    Publication number: 20110059567
    Abstract: In a method of vacuum packaging a MEMS device, at least one MEMS device is attached on a substrate. A solder preform is printed on the substrate at the perimeter surrounding the substrate. A lid is attached to the solder preform wherein the lid provides a cavity enclosing the at least one MEMS device. A first reflowing step reflows the solder at a first temperature, partially sealing the lid/substrate interface and at the same time does the outgassing and baking procedure for the packaging. Flux is applied onto an outer ring of the solder preform and a second step reflows the solder at a second temperature, completely sealing the lid/substrate interface and providing a vacuum cavity enclosing the at least one MEMS device.
    Type: Application
    Filed: September 4, 2009
    Publication date: March 10, 2011
    Inventors: Mei-Ling Wu, Rueyshing Star Huang