Patents by Inventor Rui-Fen Zhuang

Rui-Fen Zhuang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9334159
    Abstract: The invention relates to an integrated chip with an MEMS and an integrated circuit mounted therein and a method for manufacturing the same. The method includes the steps of: S1: providing a first chip, wherein the first chip comprises a first substrate, an MEMS component layer formed on the first substrate and comprising a first electrical bonding point disposed on MEMS the component layer; S2: providing a second chip with an IC integrated circuit, wherein the second chip comprises a second lead layer and a second electrical bonding point; S3: bonding the first electrical bonding point and the second electrical bonding point; S4: processing a thinning operation for the bottom surface of the first substrate; and S5: forming an electrical connection layer electrically connected to an external circuit on the bottom surface of the first substrate.
    Type: Grant
    Filed: October 11, 2013
    Date of Patent: May 10, 2016
    Assignee: MEMSENSING MICROSYSTEMS (SUZHOU, CHINA) CO., LTD.
    Inventors: Gang Li, Wei Hu, Jia-Xin Mei, Rui-Fen Zhuang
  • Publication number: 20140332909
    Abstract: The invention relates to an integrated chip with an MEMS and an integrated circuit mounted therein and a method for manufacturing the same. The method includes the steps of: S1: providing a first chip, wherein the first chip comprises a first substrate, an MEMS component layer formed on the first substrate and comprising a first electrical bonding point disposed on MEMS the component layer; S2: providing a second chip with an IC integrated circuit, wherein the second chip comprises a second lead layer and a second electrical bonding point; S3: bonding the first electrical bonding point and the second electrical bonding point; S4: processing a thinning operation for the bottom surface of the first substrate; and S5: forming an electrical connection layer electrically connected to an external circuit on the bottom surface of the first substrate.
    Type: Application
    Filed: October 11, 2013
    Publication date: November 13, 2014
    Applicant: MEMSensing Microsystems (Suzhou, China) Co., Ltd.
    Inventors: Gang Li, Wei Hu, Jia-Xin Mei, Rui-Fen Zhuang
  • Publication number: 20130192365
    Abstract: A monolithic triaxial gyro includes a mass block, a number of electrode groups and a drive comb group. The mass block includes main masses and a coupling mass coupled with the main masses. The main masses are positioned on opposite sides of the coupling mass and are symmetrical with each other along a Y-axis. The electrode groups include a first electrode group within an orthographic projection of the mass block, a second electrode group within an orthographic projection of the coupling mass and a third electrode group including a group of immovable slender flat plates and a group of movable slender flat plates. The drive comb group is connected to the main masses for driving movement of the main masses when signals are inputted into the drive comb group.
    Type: Application
    Filed: July 30, 2012
    Publication date: August 1, 2013
    Applicant: MEMSensing Microsystems Technology Co., Ltd
    Inventors: Rui-Fen Zhuang, Gang Li