Abstract: The present invention provides a ceramic wafer with a surface shape and a manufacturing method thereof. The ceramic wafer has an upper surface and a lower surface, and at least one of the upper surface and the lower surface has an irregular surface shape. The total thickness variation (TTV) value between the two surfaces ranges from 0.1 to 100 ?m. The ceramic wafer with the surface shape of the present invention, by controlling the total thickness variation of the wafer, not only helps the coating, but also improves the flow of the fluid, and can improve the bonding force of the coating and reduce the surface defects in the subsequent process.

Abstract: A composite substrate and a manufacturing method thereof are provided. By disposing a plurality of interlayers between a carrier plate and a substrate, a strong bonding force between the layers can be ensured, and the difference between the coefficients of thermal expansion of the layers is allowed to be adjusted to prevent such drawbacks as the substrate being likely to break.