Patents by Inventor Rui-Feng Tai

Rui-Feng Tai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220189900
    Abstract: An electronic package is provided and includes at least one conductor with a relatively large width formed on an electrode pad of an electronic element and in contact with a circuit layer. As such, when the electronic element and the circuit layer deviate in position relative to one another, the circuit layer will be still in contact with the conductor and hence electrically connected to the electronic element.
    Type: Application
    Filed: February 9, 2021
    Publication date: June 16, 2022
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Chia-Yu Kuo, Rui-Feng Tai, Yih-Jenn Jiang, Don-Son Jiang, Chang-Fu Lin
  • Publication number: 20220173052
    Abstract: An electronic package is provided and includes at least one protective structure positioned between a first electronic element and a second electronic element on a carrier for reducing stresses generated inside the first electronic element and the second electronic element when a filling material is formed on the carrier, encapsulates the protective structure and comes into contact with the first electronic element and the second electronic element, thereby preventing cracking of the first electronic element and the second electronic element and improving the reliability of the electronic package.
    Type: Application
    Filed: January 28, 2021
    Publication date: June 2, 2022
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Chih-Hsun Hsu, Chi-Jen Chen, Hsi-Chang Hsu, Yuan-Hung Hsu, Rui-Feng Tai, Don-Son Jiang
  • Patent number: 11289346
    Abstract: An electronic package and a method for fabricating the same are provided. The method includes: forming a circuit structure on an encapsulant; embedding a first electronic component and a plurality of conductive posts in the encapsulant; and disposing a second electronic component on the circuit structure. Since the first and second electronic components are arranged on opposite sides of the circuit structure, the electronic package can provide multi-function and high efficiency.
    Type: Grant
    Filed: July 2, 2020
    Date of Patent: March 29, 2022
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Chen-Yu Huang, Chee-Key Chung, Chang-Fu Lin, Kong-Toon Ng, Rui-Feng Tai, Bo-Hao Ma
  • Publication number: 20200335447
    Abstract: An electronic package and a method for fabricating the same are provided. The method includes: forming a circuit structure on an encapsulant; embedding a first electronic component and a plurality of conductive posts in the encapsulant; and disposing a second electronic component on the circuit structure. Since the first and second electronic components are arranged on opposite sides of the circuit structure, the electronic package can provide multi-function and high efficiency.
    Type: Application
    Filed: July 2, 2020
    Publication date: October 22, 2020
    Inventors: Chen-Yu Huang, Chee-Key Chung, Chang-Fu Lin, Kong-Toon Ng, Rui-Feng Tai, Bo-Hao Ma
  • Patent number: 10741500
    Abstract: An electronic package and a method for fabricating the same are provided. The method includes: forming a circuit structure on an encapsulant; embedding a first electronic component and a plurality of conductive posts in the encapsulant; and disposing a second electronic component on the circuit structure. Since the first and second electronic components are arranged on opposite sides of the circuit structure, the electronic package can provide multi-function and high efficiency.
    Type: Grant
    Filed: May 4, 2018
    Date of Patent: August 11, 2020
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Chen-Yu Huang, Chee-Key Chung, Chang-Fu Lin, Kong-Toon Ng, Rui-Feng Tai, Bo-Hao Ma
  • Publication number: 20190237374
    Abstract: An electronic package and a method for fabricating the same are provided. The method includes: forming a circuit structure on an encapsulant; embedding a first electronic component and a plurality of conductive posts in the encapsulant; and disposing a second electronic component on the circuit structure. Since the first and second electronic components are arranged on opposite sides of the circuit structure, the electronic package can provide multi-function and high efficiency.
    Type: Application
    Filed: May 4, 2018
    Publication date: August 1, 2019
    Inventors: Chen-Yu Huang, Chee-Key Chung, Chang-Fu Lin, Kong-Toon Ng, Rui-Feng Tai, Bo-Hao Ma
  • Publication number: 20190109092
    Abstract: A method for fabricating a package structure is provided, which includes the steps of: providing a base portion having at least an electronic element embedded therein and at least a positioning unit formed around a periphery of the electronic element, wherein the positioning unit protrudes from or is flush with a surface of the base portion; and forming at least a circuit layer on the surface of the base portion and the electronic element. The circuit layer is aligned and connected to the electronic element through the positioning unit.
    Type: Application
    Filed: December 11, 2018
    Publication date: April 11, 2019
    Inventors: Rui-Feng Tai, Hsiao-Chun Huang, Chun-Hung Lu, Hsi-Chang Hsu, Shih-Ching Chen
  • Publication number: 20160005695
    Abstract: A method for fabricating a package structure is provided, which includes the steps of: providing a base portion having at least an electronic element embedded therein and at least a positioning unit formed around a periphery of the electronic element, wherein the positioning unit protrudes from or is flush with a surface of the base portion; and forming at least a circuit layer on the surface of the base portion and the electronic element. The circuit layer is aligned and connected to the electronic element through the positioning unit.
    Type: Application
    Filed: August 28, 2014
    Publication date: January 7, 2016
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Rui-Feng Tai, Hsiao-Chun Huang, Chun-Hung Lu, Hsi-Chang Hsu, Shih-Ching Chen